Nyaya muUSA: American Partner's Chip Underfill Solution
Senyika yepamusoro-soro, kune akawanda emakambani eBGA, CSP kana Flip Chip emidziyo muUSA, saka anonamira pasi pasi ari kudiwa zvikuru.
Mumwe wevatengi vedu kubva kuUSA makambani epamusoro-tech, vanoshandisa iyo DeepMaterial underfill mhinduro kune yavo chip underfill, uye inoshanda zvakakwana.
DeepMaterial inopa yakakwirira kuita zvinhu zveSintering uye Die Attach, Surface Mount, uye Wave Soldering application. Hupamhi hwezvigadzirwa zvinosanganisira Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills uye Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, uye Stencils.
DeepMaterial Chip Underfill Adhesive akatevedzana chimwe chikamu, kupisa zvinorapika zvinhu. Izvo zvinhu zvakagadziridzwa kuti capillary underfill uye reworkability. Aya epoxy based materials anogona kupihwa pamupendero weBGA, CSP kana Flip Chip zvishandiso. Nyaya iyi inozoyerera ichizadza nzvimbo iri pasi pezvikamu izvi.
Zvakadai sekuti ine imwe-chikamu capillary underfill yakagadzirirwa kuchengetedza yakaungana chip mapakeji pamabhodhi edunhu akadhindwa.
Iyo tembiricha yepamusoro yegirazi [Tg] uye yakaderera coefficient yekuwedzera yekupisa [CTE] isina kukwana. Aya maitiro anoguma nepamusoro kuvimbika mhinduro.
Product Features
· Inopa kuvharika kuzere kwechikamu kana yaiswa pane substrate preheated pa70 - 100 ° C.
· Yakakwira Tg uye Yakaderera CTE makoshero anovandudza zvakanyanya kugona kupasa yakaomesesa Thermal Cycling Test mamiriro
· Yakanakisa Thermal Cycling Test kuita
Halogen-isina uye inoenderana neRoHS Directive 2015/863/EU
Underfill For Exceptional Thermal Fatigue Resistance
Mira wega SAC solder majoini muBGA uye CSP maassemblies anowanzo kuderera mukupisa kwemoto maapplication emotokari. Yakakwira Tg uye yakaderera CTE underfill [UF] mhinduro yekusimbisa. Sezvo rework isiri chinhu chinodiwa, izvi zvinobvumira yepamusoro filler yemukati mukugadzirisa kukudziridza hunhu hwakadaro.
DeepMaterial Chip Underfill Adhesive series ine yakakwira Tg ye165°C uye yakaderera CTE1/CTE2 ye31 ppm/105 ppm, payakaungana uye yakaedzwa kuti ipfuure mazana mashanu emacycles -5000 +40°C thermal cycling test. Kuti uwane kuyerera kuri nani, preheat the substrates panguva yekugovera.
Isu tiri kutsvagawo DeepMaterial maindasitiri anonamira zvigadzirwa kushandira pamwe pasi rose, kana iwe uchida kuve mumiriri weDeepMaterial's:
Industrial adhesive glue supplier muAmerica,
Industrial adhesive glue supplier muEurope,
Industrial adhesive glue supplier muUK,
Industrial adhesive glue supplier muIndia,
Industrial adhesive glue mutengesi muAustralia,
Industrial adhesive glue supplier muCanada,
Industrial adhesive glue supplier muSouth Africa,
Industrial adhesive glue supplier muJapan,
Industrial adhesive glue supplier muEurope,
Industrial adhesive glue mutengesi muKorea,
Industrial adhesive glue mutengesi muMalaysia,
Industrial adhesive glue mutengesi muPhilippines,
Industrial adhesive glue mutengesi muVietnam,
Industrial adhesive glue mutengesi muIndonesia,
Industrial adhesive glue mutengesi muRussia,
Industrial adhesive glue mutengesi muTurkey,
......
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