Mhosva muIndia: Adhesives For Smart Phone uye Mobile Devices Assembly
Hurumende yeIndia yakawedzera kusundira kwayo kuMade in India zvigadzirwa. Uye chimwe chezvikamu zvikuru zvinosundidzira mushandirapamwe uyu kumberi inzvimbo yetekinoroji ine mafoni uye semiconductors ari kutora mhosva. Mukuda kukwidziridza kuyedza kwayo, hurumende iri kupawo makambani rubatsiro uye zvimwe zvikomborero pasi pezvirongwa zvakasiyana-siyana senge PLI chirongwa uye EMC 2.0 mukuda kumisa zvidyarwa zvavo zvekugadzira muIndia.
Sezvo kugadzirwa kwemafoni akangwara kwakakura, uye musika we batching wakakura uye wakakura, senge zvinonamira zvema smart phone assembly. DeepMaterial yanga iri maindasitiri anonamira glue mutengesi muIndia kwemakore mazhinji, isu tinochengeta ngarava yakanaka yekubatana nevagadziri vemidziyo nhare muIndia.
Musika wemidziyo yemafoni iindasitiri inokura uye ine simba. Gore rega rega, vagadziri vanoshanda kuti vavandudze pazvizvarwa zvakapfuura zvemidziyo kupindura kune zvinodiwa nevatengi. Iko kuungana kwemafoni efoni akadai sema smartphones uye mahwendefa kunoda akawanda akasiyana anonamira uye sealants ekusangana kwemaitiro, kuchengetedza kwezvakatipoteredza, kudziya kwekutonga, magetsi conductivity kana insulation nezvimwe. DeepMaterial zvemagetsi zvinonamira uye zvisimbiso zvinogona kuwanikwa mune akawanda eaya maapplication anosanganisira:
Kuvhara Glass Bonding
Zvimiro zvekunamira zvekuvhara girazi bonding zvinosanganisa yakakwirira yekunamatira simba uye kukanganisa kuramba. Zvishandiso zvedu zvinogoneka zvinobvumira vatengi kudzikisa mutengo wakazara wevaridzi mumagadzirirwo avo ekugadzira.
Frame Bonding Uye Kuisa Chisimbiso
DeepMaterial structural adhesives inosanganisa yakakwira bond simba uye kukurumidza kugadzirisa ine yakaderera shrinkage, dense cross-linking uye pressure kuramba. Yedu yeDeepMaterial nharembozha inonamatira inopa vagadziri ve smartphone kuvimba mumagungano akavimbika uku vachiwedzera kugadzirwa kwekuita.
Flexible printed circuit (FPC) bonding
DeepMaterial reinforcement adhesives inopa kuchengetedzwa kwepamusoro kwemaseketi anochinjika anoshandiswa mumagungano emagetsi. Kunamatira kwakanaka uye kusvuura simba pamwe nekuchinjika kwakanyanya uye kutsemuka kuramba kunodzivirira maFPC kubva mukukuvadzwa.
Micro-Electro-Mechanical-Systems (MEMS) zvikumbiro
DeepMaterial portfolio ye encapsulant uye inonamira zvinhu inobvumira vagadziri veMEMS kuti vasangane nezvinonetsa kuita zvinodiwa zvinosanganisira kudzivirira kuita, kukanganisa kupikisa, kunamatira kune akasiyana substrates uye optimized rheology.
Glob Pamusoro & Encapsulants
DeepMaterial encapsulants inodzivirira maPCB uye zvikamu kubva mukuvhunduka, kudonha, kuzunguzika uye kukanganisa. Mhinduro dzedu dzinopa kunamatira kwakasimba, hunyoro kuramba uye ingress kudzivirira (IP) kudzivirira mvura pasina kukanganisa antenna kugona kana acoustic kuita.
Entry Point Sealants
Midziyo yenhare ine akati wandei anovhurika panjodzi nedhizaini, senge soketi dzemunzeve kana USB ports. DeepMaterial yakakwira performance sealants uye encapsulants inochengetedza kubva mukunyorova kupinda uye inobvumira yakakwirira ingress dziviriro (IP) ratings.
Chikamu Gasketing
DeepMaterial inopa huwandu hwakasiyana hwemhinduro ne optimized rheology, durometer uye compression set ye gasketing yezvikamu munharembozha. Yedu yemhando yekurapa-mu-nzvimbo gaskets (CIPG) inobatsira kuchengetedza zvishandiso kubva mumvura ingress uye kunotevera kukuvara.
Enclosure Impregnation
DeepMaterial yakafararira yevacuum impregnation resins inogona kupinda nekuisa chisimbiso kuvharirwa uye kubatsira kudzivirira kupinda kwekunze kusvibisa seguruva nemvura. Marezeni edu akagadzirirwa microporosity chisimbiso kuti ipinde mukati me kunyange madiki maburi.
Bhatani uye Key bonding
DeepMaterial structural adhesives uye nekukasira zvinonamira zvakagadzirirwa yakaderera pamusoro pesimba substrate bonding iyo yakakosha pakupindura kwakakosha. Mazhinji eanonamira edu ekugadzirisa mumasekonzi kubvumira kuwedzera kumhanya kwekugadzira uye yakakwirira kugadzirwa kwekugadzira.
Wireless Charger Bonding
DeepMaterial structural adhesives inopa yakanakisa chisungo simba pane akawanda substrates ane akanyanya kukurumidza kugadzirisa uye musika unotungamira kusimba kwegirinhi. Pakurapa kuzere zvinonamira zvedu zvinoratidzira zvakanakisa tensile zvivakwa uye kudonhedza kukanganisa kuramba kuti ive nechokwadi chekuti zvikamu zvinogara munzvimbo.
DeepMaterial's mutsara wenharembozha anonamatira uye zvisimbiso zvinopa zvakakosha kuita mabhenefiti kune smartphone uye piritsi vanogadzira. Mutsara wedu weDeepMaterial mhinduro dzakaratidzwa kuendesa:
· Yakanyanya kunamatira kune akawanda substrates
· Yakanakisa makemikari uye unyoro kuramba
· Kurumidza kurapa kugadzirisa uye kukurumidza kurapa
· Superior tensile zvivakwa uye kukanganisa kupikisa
· Mutengo wakaderera wekuva muridzi
· Kuvimbika kuita uye kunaka
Isu tiri kutsvagawo DeepMaterial maindasitiri anonamira zvigadzirwa kushandira pamwe pasi rose, kana iwe uchida kuve mumiriri weDeepMaterial's:
Industrial adhesive glue supplier muAmerica,
Industrial adhesive glue supplier muEurope,
Industrial adhesive glue supplier muUK,
Industrial adhesive glue supplier muIndia,
Industrial adhesive glue mutengesi muAustralia,
Industrial adhesive glue supplier muCanada,
Industrial adhesive glue supplier muSouth Africa,
Industrial adhesive glue supplier muJapan,
Industrial adhesive glue supplier muEurope,
Industrial adhesive glue mutengesi muKorea,
Industrial adhesive glue mutengesi muMalaysia,
Industrial adhesive glue mutengesi muPhilippines,
Industrial adhesive glue mutengesi muVietnam,
Industrial adhesive glue mutengesi muIndonesia,
Industrial adhesive glue mutengesi muRussia,
Industrial adhesive glue mutengesi muTurkey,
......
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