glue mupi wezvigadzirwa zvemagetsi.
Epoxy-Yakavakirwa Chip Underfill Uye COB Encapsulation Zvishandiso
DeepMaterial inopa nyowani capillary inoyerera underfills yeflip chip, CSP uye BGA zvishandiso. DeepMaterial's new capillary flow underfills ndeye yakakwira fluidity, yakakwirira-kuchena, imwe-chikamu chehari zvinhu zvinoumba yunifomu, isina-isina-isina underfill layers iyo inovandudza kuvimbika uye mechanical zvimiro zvezvikamu nekubvisa kushushikana kunokonzerwa ne solder zvinhu. DeepMaterial inopa maumbirwo ekukurumidza kuzadza kweakanyanya kunaka zvikamu, kukurumidza kurapa kugona, kushanda kwenguva refu uye hupenyu hwehupenyu, pamwe nekushandazve. Reworkability inochengetedza mari nekubvumira kubviswa kweiyo underfill kuti ishandiswezve bhodhi.
Flip chip assembly inoda kuzorora kwekushushikana kweiyo welding seam zvakare kune yakawedzera kupisa kuchembera uye kutenderera hupenyu. CSP kana BGA gungano inoda kushandiswa kweiyo underfill kuti ivandudze kutendeseka kwemuchina wegungano panguva yeflex, vibration kana kudonha kuyedzwa.
DeepMaterial's flip-chip underfills ine yakakwira yekuzadza mukati ichichengetedza nekukurumidza kuyerera mumapikisi madiki, nekugona kuve nepamusoro girazi tembiricha yekuchinja uye yakakwirira modulus. Yedu CSP underfills inowanikwa mune akasiyana mafirita mazinga, akasarudzirwa tembiricha yegirazi yekuchinja uye modulus yeiyo yakarongwa application.
COB encapsulant inogona kushandiswa kune waya yekubatanidza kupa kuchengetedzwa kwezvakatipoteredza uye kuwedzera simba remagetsi. Iyo yekuvharira chisimbiso yewaya-yakasungwa machipisi inosanganisira yepamusoro encapsulation, cofferdam, uye gap kuzadza. Adhesives ane yakanaka-tuning flow function inodiwa, nekuti kugona kwavo kuyerera kunofanirwa kuve nechokwadi chekuti waya dzakavharwa, uye chinonamira hachizoyerera kubva muchip, uye chengetedza icho chinogona kushandiswa kune yakanakisa pitch lead.
DeepMaterial's COB yakavharira anonamira inogona kuve inopisa kana UV yakarapwa DeepMaterial's COB encapsulation adhesive inogona kupisa kupisa kana UV-kuporeswa nekuvimbika kwakanyanya uye yakadzikira yekuzvimba yekudziya coefficient, pamwe nekukwira kwegirazi kutendeuka tembiricha uye yakaderera ion zvirimo. DeepMaterial's COB yakavharira adhesives inodzivirira inotungamira uye plumbum, chrome uye silicon wafers kubva kune ekunze nharaunda, kukuvara kwemagetsi uye ngura.
DeepMaterial COB encapsulating adhesives akagadzirwa neheat-curing epoxy, UV-curing acrylic, kana silicone chemistries yekuvharisa magetsi. DeepMaterial COB encapsulating adhesives inopa yakanaka yakakwira tembiricha kugadzikana uye kupisa kutyisa kuramba, magetsi ekudzivirira zvivakwa pamusoro pehupamhi hwekushisa, uye kuderera kuderera, kuderera kushushikana, uye makemikari kuramba kana arapwa.
Deepmaterial yakanakisa yepamusoro isingapindi mvura inonamira glue yepurasitiki kune simbi uye girazi mugadziri, shandisa isina conductive epoxy adhesive sealant glue ye underfill pcb yemagetsi zvinhu, semiconductor adhesives emagetsi gungano, yakaderera tembiricha kurapa bga flip chip underfill pcb epoxy process adhesive glue zvinhu zvichingodaro. on
DeepMaterial Epoxy Resin Base Chip Pazasi Kuzadza Uye Cob Packaging Material Sarudzo Tafura
Yakaderera Tembiricha Kurapa Epoxy Adhesive Chigadzirwa Sarudzo
| Product Series | Product zita | Chigadzirwa chakajairika application |
| Low tembiricha kurapa adhesive | DM-6108 |
Yakadzika tembiricha yekurapa inonamira, yakajairika maapplication anosanganisira memori kadhi, CCD kana CMOS gungano. Ichi chigadzirwa chakakodzera kurapa kwakadzika-tembiricha uye chinogona kuve nekunamatira kwakanaka kune akasiyana zvinhu munguva pfupi. Yakajairika maapplication anosanganisira memori makadhi, CCD/CMOS zvikamu. Iyo inonyanya kukodzera kune iyo nguva iyo inopisa-sensitive element inoda kurapwa pane yakaderera tembiricha. |
| DM-6109 |
Icho chinhu chimwe-chikamu chinopisa chinoporesa epoxy resin. Ichi chigadzirwa chakakodzera kupora-kupisa uye kunamatira kwakanaka kune zvakasiyana-siyana zvezvinhu munguva pfupi. Yakajairika maapplication anosanganisira memori kadhi, CCD / CMOS kusangana. Iyo inonyanya kukodzera kune zvikumbiro apo kuderera kwekushisa kwekushisa kunodiwa kune zvinopisa-sensitive components. |
|
| DM-6120 |
Classic yakaderera-tembiricha yekurapa adhesive, inoshandiswa kuLCD backlight module musangano. |
|
| DM-6180 |
Kukurumidza kurapa pane yakaderera tembiricha, inoshandiswa kuungana kweCCD kana CMOS zvikamu uye VCM motors. Ichi chigadzirwa chakanyatsogadzirirwa kupisa-sensitive application inoda kudzika-tembiricha kurapwa. Inogona kukurumidza kupa vatengi maapplication epamusoro-soro, akadai sekubatanidza mwenje wekuvhenekesa lenzi kune maLED, uye kuunganidza mifananidzo inonzwa michina (kusanganisira kamera modules). Nyaya iyi ichena kuti ipe reflectivity yakakura. |
Encapsulation Epoxy Chigadzirwa Sarudzo
| Mutengo wemhizha | Product Series | Product Name | Colour | Yakajairika viscosity (cps) | Yekutanga kugadzirisa nguva / yakazara kugadzirisa | Kurapa nzira | TG/°C | Kuoma /D | Store/°C/M |
| Epoxy based | Encapsulation Adhesive | DM-6216 | Nhema | 58000-62000 | 150 ° C 20 min | Kupisa kupisa | 126 | 86 | 2-8/6M |
| DM-6261 | Nhema | 32500-50000 | 140°C 3H | Kupisa kupisa | 125 | * | 2-8/6M | ||
| DM-6258 | Nhema | 50000 | 120 ° C 12 min | Kupisa kupisa | 140 | 90 | -40/6M | ||
| DM-6286 | Nhema | 62500 | 120°C 30min1 150°C 15min | Kupisa kupisa | 137 | 90 | 2-8/6M |
Underfill Epoxy Chigadzirwa Sarudzo
| Product Series | Product zita | Chigadzirwa chakajairika application |
| Underfill | DM-6307 | Icho chinhu chimwe-chikamu, thermosetting epoxy resin. Iyo inogona kushandiswa zvakare CSP (FBGA) kana BGA filler inoshandiswa kuchengetedza masolder majoini kubva kumakanika kushushikana mumidziyo yemagetsi inobatwa. |
| DM-6303 | Imwe-chikamu epoxy resin adhesive iresin yekuzadza iyo inogona kushandiswa zvakare muCSP (FBGA) kana BGA. Inorapa nokukurumidza kana yapisa. Yakagadzirirwa kupa kuchengetedzwa kwakanaka kudzivirira kukundikana nekuda kwe mechanical stress. Low viscosity inobvumira kuzadza mapundu pasi peCSP kana BGA. | |
| DM-6309 | Iyo inokurumidza kurapa, inokurumidza kuyerera mvura epoxy resin yakagadzirirwa capillary inoyerera ichizadza chip saizi mapakeji, ndeye kuvandudza maitiro ekumhanya mukugadzira uye kugadzira dhizaini yayo yerheological, ita kuti ipinde 25μm clearance, ideredze induced kushushikana, kuvandudza tembiricha yebhasikoro kuita, ne yakanakisa makemikari kuramba. | |
| DM-6308 | Classic underfill, Ultra-yakaderera viscosity yakakodzera kune akawanda underfill application. | |
| DM-6310 | Iyo reusable epoxy primer yakagadzirirwa CSP uye BGA zvikumbiro. Inogona kurapwa nekukurumidza pane tembiricha ine mwero kuderedza kumanikidza kune dzimwe nzvimbo. Mushure mekurapa, zvinhu zvacho zvine zvakanakisa zvemuchina uye zvinogona kudzivirira majoini ekutengesa panguva yekupisa bhasikoro. | |
| DM-6320 | Iyo inoshandiswazve underfill yakanyatsogadzirirwa CSP, WLCSP uye BGA application. Chimiro chayo ndechekurapa nekukurumidza pane tembiricha ine mwero kuderedza kushushikana pane zvimwe zvikamu. Izvo zvinhu zvine tembiricha yepamusoro yegirazi uye kuomarara kwekutsemuka kwepamusoro, uye inogona kupa chengetedzo yakanaka kune majoini anotengeswa panguva yekupisa bhasikoro. |
DeepMaterial Epoxy Yakavakirwa Chip Underfill Uye COB Packaging Material Data Sheet
Yakaderera Tembiricha Kurapa Epoxy Adhesive Chigadzirwa Data Sheet
| Mutengo wemhizha | Product Series | Product Name | Colour | Yakajairika viscosity (cps) | Yekutanga kugadzirisa nguva / yakazara kugadzirisa | Kurapa nzira | TG/°C | Kuoma /D | Store/°C/M |
| Epoxy based | Low tembiricha kurapa encapsulant | DM-6108 | Nhema | 7000-27000 | 80°C 20min 60°C 60min | Kupisa kupisa | 45 | 88 | -20/6M |
| DM-6109 | Nhema | 12000-46000 | 80°C 5-10min | Kupisa kupisa | 35 | 88A | -20/6M | ||
| DM-6120 | Nhema | 2500 | 80°C 5-10min | Kupisa kupisa | 26 | 79 | -20/6M | ||
| DM-6180 | Chena | 8700 | 80 ° C 2 min | Kupisa kupisa | 54 | 80 | -40/6M |
Yakavharirwa Epoxy Adhesive Product Data Sheet
| Mutengo wemhizha | Product Series | Product Name | Colour | Yakajairika viscosity (cps) | Yekutanga kugadzirisa nguva / yakazara kugadzirisa | Kurapa nzira | TG/°C | Kuoma /D | Store/°C/M |
| Epoxy based | Encapsulation Adhesive | DM-6216 | Nhema | 58000-62000 | 150 ° C 20 min | Kupisa kupisa | 126 | 86 | 2-8/6M |
| DM-6261 | Nhema | 32500-50000 | 140°C 3H | Kupisa kupisa | 125 | * | 2-8/6M | ||
| DM-6258 | Nhema | 50000 | 120 ° C 12 min | Kupisa kupisa | 140 | 90 | -40/6M | ||
| DM-6286 | Nhema | 62500 | 120°C 30min1 150°C 15min | Kupisa kupisa | 137 | 90 | 2-8/6M |
Underfill Epoxy Adhesive Chigadzirwa Data Sheet
| Mutengo wemhizha | Product Series | Product Name | Colour | Yakajairika viscosity (cps) | Yekutanga kugadzirisa nguva / yakazara kugadzirisa | Kurapa nzira | TG/°C | Kuoma /D | Store/°C/M |
| Epoxy based | Underfill | DM-6307 | Nhema | 2000-4500 | 120°C 5min 100°C 10min | Kupisa kupisa | 85 | 88 | 2-8/6M |
| DM-6303 | Opaque creamy yellow fluid | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Kupisa kupisa | 69 | 86 | 2-8/6M | ||
| DM-6309 | Mvura yakasviba | 3500-7000 | 165°C 3min 150°C 5min | Kupisa kupisa | 110 | 88 | 2-8/6M | ||
| DM-6308 | Mvura yakasviba | 360 | 130°C 8min 150°C 5min | Kupisa kupisa | 113 | * | -20/6M | ||
| DM-6310 | Mvura yakasviba | 394 | 130 ° C 8 min | Kupisa kupisa | 102 | * | -20/6M | ||
| DM-6320 | Mvura yakasviba | 340 | 130°C 10min 150°C 5min 160°C 3min | Kupisa kupisa | 134 | * | -20/6M |
