Chip Underfill / Packaging
Chip Manufacturing Process Application ye DeepMaterial Adhesive Products
Semiconductor Packaging
Semiconductor tekinoroji, kunyanya kurongedza kwesemiconductor zvishandiso, haina kumbobvira yabata mamwe maapplication kupfuura zvaanoita nhasi. Sezvo ese maficha ehupenyu hwezuva nezuva achiwedzera dhijitari - kubva kumotokari kuenda kuchengetedzo yemba kusvika kumafoni uye 5G zvivakwa - semiconductor yekurongedza magadzirirwo ari pamwoyo wekuteerera, wakavimbika, uye ane simba masimba emagetsi.
Mawaferi matete, zvimiro zvidiki, mapiche akakwenenzverwa, kusanganisa kwepakeji, dhizaini ye3D, matekinoroji e-wafer-level uye hupfumi hwehukuru mukugadzira huwandu hunoda zvinhu zvinogona kutsigira zvishuvo zvitsva. Henkel's yakazara mhinduro nzira inokwirisa yakakura zviwanikwa zvepasirese kuendesa yepamusoro semiconductor kurongedza zvinhu tekinoroji uye mutengo-kukwikwidza kuita. Kubva pakufa kubatanidza zvinonamira zvechinyakare waya bhondi kurongedza kune epamberi underfills uye encapsulants yepamberi yekurongedza maapplication, Henkel inopa yekucheka-kumucheto zvinhu tekinoroji uye kutsigirwa kwepasirese kunodiwa nemakambani anotungamira mamicroelectronics.
Flip Chip Underfill
Iyo underfill inoshandiswa kugadzikana kwemakanika yeflip chip. Izvi zvinonyanya kukosha kana soldering bhora grid array (BGA) chips. Kuti uderedze coefficient of thermal expansion (CTE), iyo yekunamatira inozadzwa zvishoma ne nanofillers.
Adhesives anoshandiswa se chip underfills ane capillary flow properties yekukurumidza uye nyore kushandisa. Iyo mbiri-yekurapa inonamira inowanzoshandiswa: nzvimbo dzemupendero dzinobatwa munzvimbo neUV kurapa nzvimbo dzine mimvuri dzisati dzapora.
Deepmaterial yakadzikira tembiricha inorapa bga flip chip underfill pcb epoxy process adhesive glue material mugadziri uye tembiricha inodzivirira underfill coating zvinhu vatengesi, ipa chimwe chikamu epoxy underfill makomisheni, epoxy underfill encapsulant, underfill encapsulation zvinhu zveflip chip mu pcpoxy electronic circuit board. yakavakirwa chip underfill uye cob encapsulation zvinhu uye zvichingodaro.
