BGA Package Underfill Epoxy
High Fluidity
Yakachena Purity
matambudziko
Zvigadzirwa zvemagetsi zveaerospace uye kufamba, mota, mota, mwenje wekunze we LED, simba rezuva uye mabhizinesi emauto ane kuvimbika kwakanyanya zvinodiwa, solder ball array zvishandiso (BGA/CSP/WLP/POP) uye midziyo yakakosha pamabhodhi edunhu zvese zvakatarisana nemicroelectronics. Maitiro ekuita miniaturization, uye maPCB akaonda ane ukobvu hweasingasviki 1.0mm kana anochinjika akakwira-density magungano ma substrates, majoini anotengeswa pakati pemidziyo uye substrates anova asina kusimba pasi pemakinika uye nekupisa kwekushushikana.
Solutions
YeBGA yekurongedza, DeepMaterial inopa underfill process mhinduro - inovandudza capillary kuyerera underfill. Iyo yekuzadza inogoverwa uye inoshandiswa kumucheto kwechigadzirwa chakaunganidzwa, uye "capillary effect" yemvura inoshandiswa kuita kuti glue ipinde uye izadze pasi pe chip, uye inopisa kubatanidza kuzadza ne chip substrate, solder majoini uye PCB substrate.
DeepMaterial underfill process mabhenefiti
1. Kunyungudika kwemvura, kuchena kwepamusoro, chikamu chimwe chete, kukurumidza kuzadza uye kukurumidza kuporesa kugona kwezvikamu zvakanyanyisa-pitch;
2. Inogona kuumba yunifomu uye isina-isina-isina pasi yekuzadza pasi, iyo inogona kubvisa kushushikana kunokonzerwa newelding zvinhu, kunatsiridza kuvimbika uye michina zvinhu zvezvikamu, uye inopa kuchengetedzwa kwakanaka kwezvigadzirwa kubva pakudonha, kumonyoroka, kuzununguka, kunyorova. , nezvimwewo.
3. Iyo system inogona kugadziriswa, uye bhodhi redunhu rinogona kushandiswa zvakare, iro rinoponesa zvakanyanya mari.
Deepmaterial yakadzikira tembiricha inorapa bga flip chip underfill pcb epoxy process adhesive glue material mugadziri uye tembiricha inodzivirira underfill coating zvinhu vatengesi, ipa chimwe chikamu epoxy underfill makomisheni, epoxy underfill encapsulant, underfill encapsulation zvinhu zveflip chip mu pcpoxy electronic circuit board. yakavakirwa chip underfill uye cob encapsulation zvinhu uye zvichingodaro.
