Semiconductor Packaging
DeepMaterial, i le avea ai o se fale gaosi oloa epoxy adhesive, matou te leiloa suʻesuʻega e uiga i le epoxy underfill, non conductive kelu mo mea faaeletonika, non conductive epoxy, faʻapipiʻi mo faʻapotopotoga faʻaeletoroni, underfill adhesive, epoxy faasino igoa maualuga. Faʻavae i luga o lena mea, o loʻo ia i matou le tekonolosi aupito lata mai o le faʻapipiʻi epoxy alamanuia.
DeepMaterial ua atia'e mea fa'apipi'i fa'apisinisi mo le fa'apipi'iina ma le su'ega o atigipusa, fa'apipi'i tulaga o laupapa, ma fa'apipi'i mo oloa fa'aeletoroni. Faʻavae i luga o mea faʻapipiʻi, ua atiaʻe ata puipui, faʻatumu semiconductor, ma mea faʻapipiʻi mo le gaosiga o le semiconductor wafer ma le afifiina ma le suʻega.
Le tuʻuina atu o mea faʻapipiʻi faʻaeletoroni ma mea manifinifi ata faʻaeletoroni mea faʻaoga oloa ma fofo mo kamupani faʻapipiʻi fesoʻotaʻiga, kamupani eletise faʻatau, faʻapipiʻi semiconductor ma kamupani suʻega, ma kamupani gaosi mea tau fesoʻotaʻiga, e foia ai tagata o loʻo taʻua i luga i le puipuiga o le faagasologa, oloa faʻapipiʻi maualuga. , ma le faatinoga o le eletise.
DeepMaterial e ofoina atu ituaiga eseese o oloa e uiga i mea faʻapipiʻi falegaosimea mo le eletise, UV faʻamalolo UV faʻapipiʻi faʻasologa, ituaiga faʻafefe o mea faʻapipiʻi vevela ma faʻamalosi faʻapipiʻi vevela vevela, faʻapipiʻi epoxy-faʻavae ma faʻasologa o mea faʻapipiʻi COB, pusa laupapa puipuia ma faʻapipiʻi faʻapipiʻi faʻapipiʻi. fa'asologa, epoxy fa'avae fa'asologa fa'apipi'i siliva, fa'asologa fa'apipi'i fa'apipi'i, fa'asologa o ata tifaga puipuia, fa'asologa ata tifaga puipui semiconductor.
Deepmaterial o le pito i luga semiconductor mea fa'apipi'i mea gaosi ma wirebond semiconductor fa'apipi'i ma fa'apipi'i semiconductor fa'apipi'i fofo kamupani Saina, sapalai epoxy fa'apipi'i mo mea pu'eata, masini fa'apipi'i tamatamai lima, mems, fa'apipi'i semiconductor mo fa'apotopotoga fa'aeletoroni ma isi.
