Mataupu I Amerika: American Partner's Chip Underfill Solution
I le avea ai o se atunuʻu tekonolosi, e tele kamupani BGA, CSP poʻo Flip Chip masini i Amerika, o lea e manaʻomia tele ai mea faʻapipiʻi lalo.
O se tasi o matou tagata fa'atau mai kamupani fa'atekonolosi a Amerika, latou te fa'aogaina le DeepMaterial underfill solution mo a latou chip underfill, ma e lelei atoatoa.
DeepMaterial ofo atu mea maualuga fa'atinoga mo Sintering ma Die Attach, Surface Mount, ma Galu Soldering talosaga. O le lautele o oloa e aofia ai le Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, ma Stencils.
DeepMaterial Chip Underfill Adhesive fa'asologa o se tasi vaega, mea e mafai ona fa'amaloloina le vevela. O meafaitino ua sili ona lelei mo capillary underfill ma toe faʻaaogaina. O nei mea fa'avae epoxy e mafai ona tu'uina atu i pito o masini BGA, CSP po'o Flip Chip. Ole mea lea ole a tafe mulimuli ane e faatumu ai le avanoa i lalo ole vaega nei.
Fa'apei o lo'o i ai se fa'atumu fa'apalapala e tasi le vaega ua fuafuaina mo le puipuiga o afifi atigipusa fa'apipi'i i luga o laupapa fa'asalalau lolomi.
O le maualuga o le vevela fesuiaiga o tioata [Tg] ma le maualalo o le faʻalauteleina o le vevela [CTE] i lalo ole faʻatumu. O nei foliga e maua ai se fofo faʻatuatuaina maualuga.
Taunuuga o Mea
· Tuuina atu vaega uma o le ufiufi pe a tuʻuina atu i luga o le mea faʻapipiʻi muamua faʻavevela ile 70 - 100°C
· O le maualuga o le Tg ma le maualalo o le CTE e matua faʻaleleia atili ai le mafai ona pasia se suʻega sili atu le mamafa o le uila uila.
· Lelei le fa'atinoga ole su'ega ole uila afi
· E leai se Halogen ma e tausisia le RoHS Directive 2015/863/EU
Fa'atumuina mo le fa'ateteleina o le vaivai o le vevela
Tuto'atasi so'oga so'o SAC i fa'apotopotoga BGA ma le CSP e matele ina vaivai i fa'aoga tau ta'avale vevela. Tg maualuga ma le maualalo CTE underfill [UF] o se fofo faʻamalosia. Talu ai e le o se mea e mana'omia le toe fa'aleleia, o lea e mafai ai ona fa'atupuina uiga fa'apea.
DeepMaterial Chip Underfill Adhesive series e maualuga le Tg o le 165 ° C ma le maualalo CTE1 / CTE2 o le 31 ppm / 105 ppm, i luga o le faʻapotopotoina ma ua faʻataʻitaʻiina e pasi 5000 cycles -40 + 125 ° C suʻega uila uila. Mo le lelei atili o le tafe, fa'amumu muamua mea'ai i le taimi o le tu'uina atu.
O loʻo matou vaʻavaʻai foʻi mo DeepMaterial alamanuia faʻapipiʻi oloa galulue faʻatasi paaga i le lalolagi, pe afai e te manaʻo e avea ma sui o DeepMaterial's:
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Amerika,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Europa,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Peretania,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Initia,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Ausetalia,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Kanata,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Aferika i Saute,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Iapani,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Europa,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Korea,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Malaysia,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Filipaina,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Vietnam,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Initonesia,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Rusia,
Fa'atau oloa kelu fa'apipi'i fa'apisinisi i Turkey,
......
Faʻafesoʻotaʻi mai nei matou!
