e tu'uina atu kelu mo gaosiga fa'aeletonika.
Epoxy-Fa'avae Chip Underfill ma COB Encapsulation Mea
DeepMaterial e ofoina atu le tafega o capillary fou i lalo o le faʻapipiʻiina mo masini vaʻaia, CSP ma BGA masini. DeepMaterial's new capillary flow underfills o le maualuga o le sua, maualuga-mama, tasi-vaega ipu ipu mea e fai ai toniga, leai se fa'atumu lalo fa'atumu e fa'aleleia ai le fa'atuatuaina ma mea fa'ainisinia o vaega e ala i le fa'aitiitia o le fa'alavelave e mafua mai mea solder. DeepMaterial e tuʻuina atu faʻataʻitaʻiga mo le faʻatumu vave o vaega sili ona lelei o le pitch, vave faʻamalolo gafatia, galue umi ma le ola, faʻapea foʻi ma le toe faʻaaogaina. Toe fa'aogaina e sefe ai tau e ala i le fa'atagaina o le aveeseina o le fa'atumu mo le toe fa'aaogaina o le laupapa.
E mana'omia le fa'amama fa'amamago o le su'iga u'u mo le fa'aumi o le soifua matua ma le ola ta'amilosaga. CSP po'o le BGA fa'apotopotoga e mana'omia le fa'aogaina o se mea fa'atumu e fa'aleleia atili ai le fa'ainisinia fa'amaoni o le fa'apotopotoga i le taimi o su'ega, vibration po'o le pa'u.
DeepMaterial's flip-chip underfills e maualuga mea e fa'atumu ai a'o fa'atumauina le tafe vave i tama'i pitch, fa'atasi ai ma le malosi e maua ai le maualuga o le vevela o le tioata ma le maualuga o le modulus. O matou CSP underfills o loʻo avanoa i tulaga faʻatumu eseese, filifilia mo le vevela suiga tioata ma modulus mo le faʻaogaina.
COB encapsulant e mafai ona faʻaogaina mo le faʻapipiʻiina o uaea e maua ai le puipuiga o le siosiomaga ma faʻateleina le malosi faʻainisinia. O le fa'amaufa'ailogaina o tupe meataalo uaea e aofia ai le fa'apipi'i pito i luga, cofferdam, ma le fa'atumuina o avanoa. E mana'omia ni mea fa'apipi'i fa'alelei, aua e tatau ona fa'amautinoa ua fa'apipi'i uaea, ma o le a le tafe mai le mea fa'apipi'i mai le pu, ma fa'amautinoa e mafai ona fa'aoga mo ta'ita'i lelei tele.
DeepMaterial's COB fa'apipi'i fa'apipi'i e mafai ona fa'amama pe fa'amalolo UV DeepMaterial's COB fa'apipi'i fa'apipi'i e mafai ona fa'amalolo vevela po'o le UV-fa'amaloloina ma le fa'atuatuaina maualuga ma le maualalo o le vevela o le vevela, fa'apea fo'i ma le maualuga o le vevela o le liua tioata ma le maualalo o le ion. DeepMaterial's COB fa'apipi'i fa'apipi'i e puipuia ai ta'ita'i ma palama, chrome ma silicon wafers mai le si'osi'omaga i fafo, fa'aleagaina fa'ainisinia ma le pala.
DeepMaterial COB fa'apipi'i fa'apipi'i o lo'o fa'apipi'iina i le epoxy e fa'amalolo ai le vevela, fa'ama'iina o le UV, po'o vaila'au silisikoni mo le fa'amalo lelei o le eletise. DeepMaterial COB faʻapipiʻi faʻapipiʻi e ofoina atu lelei le maualuga o le vevela ma le teteʻe o le vevela, mea faʻamalo eletise i luga o le lautele o le vevela, ma le faʻaitiitia o le paʻu, maualalo le faʻalavelave, ma le faʻamaʻiina o vailaʻau pe a faʻamalolo.
Deepmaterial e sili ona lelei le susu o le kelu faʻapipiʻi faʻapipiʻi mo palasitika i uʻamea ma tioata gaosi oloa, tuʻuina atu le faʻapipiʻi epoxy faʻapipiʻi faʻapipiʻi kelu mo le faʻaogaina o mea eletise pcb, faʻapipiʻi semiconductor mo faʻapotopotoga faʻaeletoroni, faʻamalo maualalo le vevela bga flip chip underfill pcb epoxy process kelu mea ma faapena luga
DeepMaterial Epoxy Resin Base Chip Fa'atumu pito i lalo ma Cob Mea e teu ai Mea Filifiliga Filifilia
Fa'asa'o Maulalo Epoxy Fa'apipi'i Oloa Filifiliga
Faʻamaumauga o oloa | igoa oloa | Fa'aoga masani o oloa |
Fa'apipi'i fa'amalologa maualalo | FA-6108 |
Fa'apipi'i fa'amalologa maualalo, fa'aoga masani e aofia ai le kata manatua, CCD po'o le CMOS fa'apotopotoga. O lenei oloa e talafeagai mo togafitiga maualalo-vevela ma e mafai ona pipii lelei i mea eseese i se taimi puupuu. O talosaga masani e aofia ai kata manatua, vaega CCD/CMOS. E sili ona talafeagai mo taimi e manaʻomia ai le faʻamaloloina o le elemene vevela i se vevela maualalo. |
FA-6109 |
E tasi le vaega fa'amama fa'amalolo epoxy resin. O lenei oloa e talafeagai mo togafitiga maualalo-vevela ma e lelei le pipii i mea eseese i se taimi puupuu lava. O talosaga masani e aofia ai kata manatua, fa'apotopotoga CCD/CMOS. E fa'apitoa mo fa'aoga e mana'omia ai le maualalo o le vevela o le fa'amalologa mo vaega fa'afefe vevela. |
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FA-6120 |
Fa'apipi'i fa'amālōlō fa'amama maualalo, fa'aaogaina mo le fa'apotopotoga fa'apipi'i fa'aola LCD. |
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FA-6180 |
Fa'amalolo vave i le maualalo o le vevela, fa'aaogaina mo le fa'apotopotoga o vaega CCD po'o CMOS ma masini VCM. O lenei oloa ua mamanuina faapitoa mo le vevela-maʻaleʻale talosaga e manaʻomia le faʻamalolo maualalo-vevela. E mafai ona vave tuʻuina atu i tagata faʻatau ni talosaga maualuga, e pei o le faʻapipiʻiina o tioata faʻasalalau malamalama i LED, ma le faʻapipiʻiina o mea e faʻaogaina ai ata (e aofia ai mea pueata). O lenei mea e pa'epa'e e maua ai le fa'aaliga sili atu. |
Encapsulation Epoxy Oloa Filifiliga
Laina oloa | Faʻamaumauga o oloa | Igoa oloa | lanu | Viscositas masani (cps) | Taimi fa'apipi'i muamua / fa'amautu atoa | Faʻaleleia auala | TG/°C | Malosi /D | Faleoloa/°C/M |
Epoxy fa'avae | Fa'apipi'i fa'apipi'i | FA-6216 | Lanu uliuli | 58000-62000 | 150°C 20min | Faamalolo vevela | 126 | 86 | 2-8/6M |
FA-6261 | Lanu uliuli | 32500-50000 | 140°C 3H | Faamalolo vevela | 125 | * | 2-8/6M | ||
FA-6258 | Lanu uliuli | 50000 | 120°C 12min | Faamalolo vevela | 140 | 90 | -40/6M | ||
FA-6286 | Lanu uliuli | 62500 | 120°C 30min1 150°C 15min | Faamalolo vevela | 137 | 90 | 2-8/6M |
Underfill Epoxy Oloa Filifiliga
Faʻamaumauga o oloa | igoa oloa | Fa'aoga masani o oloa |
Fa'atumu lalo | FA-6307 | E tasi le vaega, thermosetting epoxy resin. O se CSP toe faʻaaogaina (FBGA) poʻo le BGA faʻatumu e faʻaaogaina e puipuia ai solder solder mai faʻalavelave faʻainisinia i masini eletise lima. |
FA-6303 | E tasi le vaega epoxy resin adhesive o se resini faʻatumu e mafai ona toe faʻaaogaina i le CSP (FBGA) poʻo le BGA. E vave ona fofo i le taimi lava e vevela ai. Ua mamanuina e maua ai se puipuiga lelei e puipuia ai le toilalo ona o le mamafa o masini. Ole viscosity maualalo e mafai ai ona fa'atumu avanoa ile CSP po'o le BGA. | |
FA-6309 | O se faʻamalolo vave, faʻafefeteina vai epoxy resin ua fuafuaina mo capillary tafe faʻatumu pusa lapoa afifi, o le faʻaleleia o le saoasaoa o le faagasologa i le gaosiga ma mamanu lona mamanu rheological, tuʻu i totonu o le kilia 25μm, faʻaitiitia le faʻalavelave faʻaosoina, faʻaleleia le vevela o le uila, ma sili ona lelei le tetee atu i vailaau. | |
DM- 6308 | Fa'atumu tulaga masani, viscosity ultra-maualalo talafeagai mo le tele o le faatumu talosaga. | |
FA-6310 | O le epoxy primer toe fa'aaogaina ua mamanuina mo CSP ma BGA talosaga. E mafai ona fofo vave i le vevela e faʻaitiitia ai le mamafa i isi vaega. A maeʻa faʻamalolo, o mea e iai mea faʻainisinia sili ona lelei ma e mafai ona puipuia solder solder i le taimi o le uila vevela. | |
FA-6320 | O le toe faʻaaogaina lalo o loʻo faʻatulagaina faapitoa mo CSP, WLCSP ma BGA talosaga. O lona fua fa'atatau o le fofo vave i le vevela e fa'aitiitia ai le popole i isi vaega. O mea e iai le maualuga o le vevela o le suiga o le tioata ma le maualuga o le gau gau, ma e mafai ona maua ai se puipuiga lelei mo solder solder i le taimi o le uila vevela. |
DeepMaterial Epoxy Based Chip Underfill Ma COB Packaging Material Data Pepa
Pepa Fa'amatalaga o Oloa Fa'apipi'i Epoxy Mau'u Tevela
Laina oloa | Faʻamaumauga o oloa | Igoa oloa | lanu | Viscositas masani (cps) | Taimi fa'apipi'i muamua / fa'amautu atoa | Faʻaleleia auala | TG/°C | Malosi /D | Faleoloa/°C/M |
Epoxy fa'avae | Ekapsulant fa'amalologa maualalo | FA-6108 | Lanu uliuli | 7000-27000 | 80°C 20min 60°C 60min | Faamalolo vevela | 45 | 88 | -20/6M |
FA-6109 | Lanu uliuli | 12000-46000 | 80°C 5-10min | Faamalolo vevela | 35 | 88A | -20/6M | ||
FA-6120 | Lanu uliuli | 2500 | 80°C 5-10min | Faamalolo vevela | 26 | 79 | -20/6M | ||
FA-6180 | Lanu pa'epa'e | 8700 | 80°C 2min | Faamalolo vevela | 54 | 80 | -40/6M |
Encapsulated Epoxy Adhesive Oloa Pepa Fa'amatalaga
Laina oloa | Faʻamaumauga o oloa | Igoa oloa | lanu | Viscositas masani (cps) | Taimi fa'apipi'i muamua / fa'amautu atoa | Faʻaleleia auala | TG/°C | Malosi /D | Faleoloa/°C/M |
Epoxy fa'avae | Fa'apipi'i fa'apipi'i | FA-6216 | Lanu uliuli | 58000-62000 | 150°C 20min | Faamalolo vevela | 126 | 86 | 2-8/6M |
FA-6261 | Lanu uliuli | 32500-50000 | 140°C 3H | Faamalolo vevela | 125 | * | 2-8/6M | ||
FA-6258 | Lanu uliuli | 50000 | 120°C 12min | Faamalolo vevela | 140 | 90 | -40/6M | ||
FA-6286 | Lanu uliuli | 62500 | 120°C 30min1 150°C 15min | Faamalolo vevela | 137 | 90 | 2-8/6M |
Fa'atumu lalo ole Epoxy Adhesive Product Data Pepa
Laina oloa | Faʻamaumauga o oloa | Igoa oloa | lanu | Viscositas masani (cps) | Taimi fa'apipi'i muamua / fa'amautu atoa | Faʻaleleia auala | TG/°C | Malosi /D | Faleoloa/°C/M |
Epoxy fa'avae | Fa'atumu lalo | FA-6307 | Lanu uliuli | 2000-4500 | 120°C 5min 100°C 10min | Faamalolo vevela | 85 | 88 | 2-8/6M |
FA-6303 | Opaque kulimi samasama vai | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Faamalolo vevela | 69 | 86 | 2-8/6M | ||
FA-6309 | Suavai uliuli | 3500-7000 | 165°C 3min 150°C 5min | Faamalolo vevela | 110 | 88 | 2-8/6M | ||
FA-6308 | Suavai uliuli | 360 | 130°C 8min 150°C 5min | Faamalolo vevela | 113 | * | -20/6M | ||
FA-6310 | Suavai uliuli | 394 | 130°C 8min | Faamalolo vevela | 102 | * | -20/6M | ||
FA-6320 | Suavai uliuli | 340 | 130°C 10min 150°C 5min 160°C 3min | Faamalolo vevela | 134 | * | -20/6M |