Epoxy-Fa'avae Chip Underfill ma COB Encapsulation Mea

DeepMaterial e ofoina atu le tafega o capillary fou i lalo o le faʻapipiʻiina mo masini vaʻaia, CSP ma BGA masini. DeepMaterial's new capillary flow underfills o le maualuga o le sua, maualuga-mama, tasi-vaega ipu ipu mea e fai ai toniga, leai se fa'atumu lalo fa'atumu e fa'aleleia ai le fa'atuatuaina ma mea fa'ainisinia o vaega e ala i le fa'aitiitia o le fa'alavelave e mafua mai mea solder. DeepMaterial e tuʻuina atu faʻataʻitaʻiga mo le faʻatumu vave o vaega sili ona lelei o le pitch, vave faʻamalolo gafatia, galue umi ma le ola, faʻapea foʻi ma le toe faʻaaogaina. Toe fa'aogaina e sefe ai tau e ala i le fa'atagaina o le aveeseina o le fa'atumu mo le toe fa'aaogaina o le laupapa.

E mana'omia le fa'amama fa'amamago o le su'iga u'u mo le fa'aumi o le soifua matua ma le ola ta'amilosaga. CSP po'o le BGA fa'apotopotoga e mana'omia le fa'aogaina o se mea fa'atumu e fa'aleleia atili ai le fa'ainisinia fa'amaoni o le fa'apotopotoga i le taimi o su'ega, vibration po'o le pa'u.

DeepMaterial's flip-chip underfills e maualuga mea e fa'atumu ai a'o fa'atumauina le tafe vave i tama'i pitch, fa'atasi ai ma le malosi e maua ai le maualuga o le vevela o le tioata ma le maualuga o le modulus. O matou CSP underfills o loʻo avanoa i tulaga faʻatumu eseese, filifilia mo le vevela suiga tioata ma modulus mo le faʻaogaina.

COB encapsulant e mafai ona faʻaogaina mo le faʻapipiʻiina o uaea e maua ai le puipuiga o le siosiomaga ma faʻateleina le malosi faʻainisinia. O le fa'amaufa'ailogaina o tupe meataalo uaea e aofia ai le fa'apipi'i pito i luga, cofferdam, ma le fa'atumuina o avanoa. E mana'omia ni mea fa'apipi'i fa'alelei, aua e tatau ona fa'amautinoa ua fa'apipi'i uaea, ma o le a le tafe mai le mea fa'apipi'i mai le pu, ma fa'amautinoa e mafai ona fa'aoga mo ta'ita'i lelei tele.

DeepMaterial's COB fa'apipi'i fa'apipi'i e mafai ona fa'amama pe fa'amalolo UV DeepMaterial's COB fa'apipi'i fa'apipi'i e mafai ona fa'amalolo vevela po'o le UV-fa'amaloloina ma le fa'atuatuaina maualuga ma le maualalo o le vevela o le vevela, fa'apea fo'i ma le maualuga o le vevela o le liua tioata ma le maualalo o le ion. DeepMaterial's COB fa'apipi'i fa'apipi'i e puipuia ai ta'ita'i ma palama, chrome ma silicon wafers mai le si'osi'omaga i fafo, fa'aleagaina fa'ainisinia ma le pala.

DeepMaterial COB fa'apipi'i fa'apipi'i o lo'o fa'apipi'iina i le epoxy e fa'amalolo ai le vevela, fa'ama'iina o le UV, po'o vaila'au silisikoni mo le fa'amalo lelei o le eletise. DeepMaterial COB faʻapipiʻi faʻapipiʻi e ofoina atu lelei le maualuga o le vevela ma le teteʻe o le vevela, mea faʻamalo eletise i luga o le lautele o le vevela, ma le faʻaitiitia o le paʻu, maualalo le faʻalavelave, ma le faʻamaʻiina o vailaʻau pe a faʻamalolo.

Deepmaterial e sili ona lelei le susu o le kelu faʻapipiʻi faʻapipiʻi mo palasitika i uʻamea ma tioata gaosi oloa, tuʻuina atu le faʻapipiʻi epoxy faʻapipiʻi faʻapipiʻi kelu mo le faʻaogaina o mea eletise pcb, faʻapipiʻi semiconductor mo faʻapotopotoga faʻaeletoroni, faʻamalo maualalo le vevela bga flip chip underfill pcb epoxy process kelu mea ma faapena luga

DeepMaterial Epoxy Resin Base Chip Fa'atumu pito i lalo ma Cob Mea e teu ai Mea Filifiliga Filifilia
Fa'asa'o Maulalo Epoxy Fa'apipi'i Oloa Filifiliga

Faʻamaumauga o oloa igoa oloa Fa'aoga masani o oloa
Fa'apipi'i fa'amalologa maualalo FA-6108

Fa'apipi'i fa'amalologa maualalo, fa'aoga masani e aofia ai le kata manatua, CCD po'o le CMOS fa'apotopotoga. O lenei oloa e talafeagai mo togafitiga maualalo-vevela ma e mafai ona pipii lelei i mea eseese i se taimi puupuu. O talosaga masani e aofia ai kata manatua, vaega CCD/CMOS. E sili ona talafeagai mo taimi e manaʻomia ai le faʻamaloloina o le elemene vevela i se vevela maualalo.

FA-6109

E tasi le vaega fa'amama fa'amalolo epoxy resin. O lenei oloa e talafeagai mo togafitiga maualalo-vevela ma e lelei le pipii i mea eseese i se taimi puupuu lava. O talosaga masani e aofia ai kata manatua, fa'apotopotoga CCD/CMOS. E fa'apitoa mo fa'aoga e mana'omia ai le maualalo o le vevela o le fa'amalologa mo vaega fa'afefe vevela.

FA-6120

Fa'apipi'i fa'amālōlō fa'amama maualalo, fa'aaogaina mo le fa'apotopotoga fa'apipi'i fa'aola LCD.

FA-6180

Fa'amalolo vave i le maualalo o le vevela, fa'aaogaina mo le fa'apotopotoga o vaega CCD po'o CMOS ma masini VCM. O lenei oloa ua mamanuina faapitoa mo le vevela-maʻaleʻale talosaga e manaʻomia le faʻamalolo maualalo-vevela. E mafai ona vave tuʻuina atu i tagata faʻatau ni talosaga maualuga, e pei o le faʻapipiʻiina o tioata faʻasalalau malamalama i LED, ma le faʻapipiʻiina o mea e faʻaogaina ai ata (e aofia ai mea pueata). O lenei mea e pa'epa'e e maua ai le fa'aaliga sili atu.

Encapsulation Epoxy Oloa Filifiliga

Laina oloa Faʻamaumauga o oloa Igoa oloa lanu Viscositas masani (cps) Taimi fa'apipi'i muamua / fa'amautu atoa Faʻaleleia auala TG/°C Malosi /D Faleoloa/°C/M
Epoxy fa'avae Fa'apipi'i fa'apipi'i FA-6216 Lanu uliuli 58000-62000 150°C 20min Faamalolo vevela 126 86 2-8/6M
FA-6261 Lanu uliuli 32500-50000 140°C 3H Faamalolo vevela 125 * 2-8/6M
FA-6258 Lanu uliuli 50000 120°C 12min Faamalolo vevela 140 90 -40/6M
FA-6286 Lanu uliuli 62500 120°C 30min1 150°C 15min Faamalolo vevela 137 90 2-8/6M

Underfill Epoxy Oloa Filifiliga

Faʻamaumauga o oloa igoa oloa Fa'aoga masani o oloa
Fa'atumu lalo FA-6307 E tasi le vaega, thermosetting epoxy resin. O se CSP toe faʻaaogaina (FBGA) poʻo le BGA faʻatumu e faʻaaogaina e puipuia ai solder solder mai faʻalavelave faʻainisinia i masini eletise lima.
FA-6303 E tasi le vaega epoxy resin adhesive o se resini faʻatumu e mafai ona toe faʻaaogaina i le CSP (FBGA) poʻo le BGA. E vave ona fofo i le taimi lava e vevela ai. Ua mamanuina e maua ai se puipuiga lelei e puipuia ai le toilalo ona o le mamafa o masini. Ole viscosity maualalo e mafai ai ona fa'atumu avanoa ile CSP po'o le BGA.
FA-6309 O se faʻamalolo vave, faʻafefeteina vai epoxy resin ua fuafuaina mo capillary tafe faʻatumu pusa lapoa afifi, o le faʻaleleia o le saoasaoa o le faagasologa i le gaosiga ma mamanu lona mamanu rheological, tuʻu i totonu o le kilia 25μm, faʻaitiitia le faʻalavelave faʻaosoina, faʻaleleia le vevela o le uila, ma sili ona lelei le tetee atu i vailaau.
DM- 6308 Fa'atumu tulaga masani, viscosity ultra-maualalo talafeagai mo le tele o le faatumu talosaga.
FA-6310 O le epoxy primer toe fa'aaogaina ua mamanuina mo CSP ma BGA talosaga. E mafai ona fofo vave i le vevela e faʻaitiitia ai le mamafa i isi vaega. A maeʻa faʻamalolo, o mea e iai mea faʻainisinia sili ona lelei ma e mafai ona puipuia solder solder i le taimi o le uila vevela.
FA-6320 O le toe faʻaaogaina lalo o loʻo faʻatulagaina faapitoa mo CSP, WLCSP ma BGA talosaga. O lona fua fa'atatau o le fofo vave i le vevela e fa'aitiitia ai le popole i isi vaega. O mea e iai le maualuga o le vevela o le suiga o le tioata ma le maualuga o le gau gau, ma e mafai ona maua ai se puipuiga lelei mo solder solder i le taimi o le uila vevela.

DeepMaterial Epoxy Based Chip Underfill Ma COB Packaging Material Data Pepa
Pepa Fa'amatalaga o Oloa Fa'apipi'i Epoxy Mau'u Tevela

Laina oloa Faʻamaumauga o oloa Igoa oloa lanu Viscositas masani (cps) Taimi fa'apipi'i muamua / fa'amautu atoa Faʻaleleia auala TG/°C Malosi /D Faleoloa/°C/M
Epoxy fa'avae Ekapsulant fa'amalologa maualalo FA-6108 Lanu uliuli 7000-27000 80°C 20min 60°C 60min Faamalolo vevela 45 88 -20/6M
FA-6109 Lanu uliuli 12000-46000 80°C 5-10min Faamalolo vevela 35 88A -20/6M
FA-6120 Lanu uliuli 2500 80°C 5-10min Faamalolo vevela 26 79 -20/6M
FA-6180 Lanu pa'epa'e 8700 80°C 2min Faamalolo vevela 54 80 -40/6M

Encapsulated Epoxy Adhesive Oloa Pepa Fa'amatalaga

Laina oloa Faʻamaumauga o oloa Igoa oloa lanu Viscositas masani (cps) Taimi fa'apipi'i muamua / fa'amautu atoa Faʻaleleia auala TG/°C Malosi /D Faleoloa/°C/M
Epoxy fa'avae Fa'apipi'i fa'apipi'i FA-6216 Lanu uliuli 58000-62000 150°C 20min Faamalolo vevela 126 86 2-8/6M
FA-6261 Lanu uliuli 32500-50000 140°C 3H Faamalolo vevela 125 * 2-8/6M
FA-6258 Lanu uliuli 50000 120°C 12min Faamalolo vevela 140 90 -40/6M
FA-6286 Lanu uliuli 62500 120°C 30min1 150°C 15min Faamalolo vevela 137 90 2-8/6M

Fa'atumu lalo ole Epoxy Adhesive Product Data Pepa

Laina oloa Faʻamaumauga o oloa Igoa oloa lanu Viscositas masani (cps) Taimi fa'apipi'i muamua / fa'amautu atoa Faʻaleleia auala TG/°C Malosi /D Faleoloa/°C/M
Epoxy fa'avae Fa'atumu lalo FA-6307 Lanu uliuli 2000-4500 120°C 5min 100°C 10min Faamalolo vevela 85 88 2-8/6M
FA-6303 Opaque kulimi samasama vai 3000-6000 100°C 30min 120°C 15min 150°C 10min Faamalolo vevela 69 86 2-8/6M
FA-6309 Suavai uliuli 3500-7000 165°C 3min 150°C 5min Faamalolo vevela 110 88 2-8/6M
FA-6308 Suavai uliuli 360 130°C 8min 150°C 5min Faamalolo vevela 113 * -20/6M
FA-6310 Suavai uliuli 394 130°C 8min Faamalolo vevela 102 * -20/6M
FA-6320 Suavai uliuli 340 130°C 10min 150°C 5min 160°C 3min Faamalolo vevela 134 * -20/6M