BGA Package Underfill Epoxy
Ole maualuga ole sua
Maualuga Mama
luitau
O oloa faaeletonika o le aerospace ma le folauga, taavale afi, taavale, moli moli i fafo, malosi o le la ma pisinisi faamiliteli ma manaoga maualuga le faatuatuaina, solder ball array masini (BGA/CSP/WLP/POP) ma masini faapitoa i luga o laupapa matagaluega o loo feagai uma ma microelectronics. O le tulaga o miniaturization, ma PCBs manifinifi ma se mafiafia o le itiiti ifo i le 1.0mm po o fetuutuunai maualuga-density faapotopotoga substrates, solder sooga i le va o masini ma substrates avea maaleale i lalo o le mamafa o masini ma vevela.
fofo o Faafitauli
Mo BGA afifiina, DeepMaterial e maua ai se vaifofo faiga fa'atumu lalo - fa'afo'i fou le tafe o capillary underfill. O le faʻatumu e tufatufa ma faʻaoga i le pito o le masini faʻapipiʻi, ma o le "capillary effect" o le vai e faʻaaogaina e faʻaoga ai le kelu ma faʻatumu le pito i lalo o le pu, ona faʻamafanafanaina lea e tuʻufaʻatasia le faʻatumu ma le mea faʻapipiʻi, solder sooga ma PCB substrate.
DeepMaterial underfill faagasologa lelei
1. High fluidity, mama maualuga, tasi-vaega, faʻatumu vave ma vave faʻamalolo gafatia o vaega sili ona lelei-pitch;
2. E mafai ona fausia se toniga ma le leai o se mea e faʻatumu ai le pito i lalo, lea e mafai ona faʻaumatia ai le faʻalavelave e mafua mai i mea faʻapipiʻi, faʻaleleia le faʻamaoni ma mea faʻainisinia o vaega, ma maua ai se puipuiga lelei mo oloa mai le pa'ū, mimilo, vibration, susu. , ma isi.
3. E mafai ona toe faʻaleleia le faiga, ma e mafai ona toe faʻaaogaina le laupapa matagaluega, lea e faʻasaoina tele ai tau.
Deepmaterial o le maualalo o le vevela fofo bga flip chip underfill pcb epoxy process adhesive kelu mea gaosi ma le vevela-resistant underfill coating supppliers, sapalai tasi vaega epoxy underfill compounds, epoxy underfill encapsulant, underfill mea encapsulation mo flip chip i le pcb electronic circuit board, epoxy- fa'avae chip underfill ma cob encapsulation mea ma isi.
