Chip Underfill / Packaging
Fa'agasologa o le gaosiga o Chip Fa'aaogaina o oloa fa'apipi'i DeepMaterial
Semiconductor Packaging
Tekinolosi Semiconductor, aemaise lava le afifiina o masini semiconductor, e leʻi paʻi atu i le tele o talosaga nai lo aso nei. A'o fa'atupula'ia vaega uma o le olaga i aso faisoo—mai ta'avale i le puipuiga o le fale i telefoni feavea'i ma atina'e 5G—o fa'afouga fa'apipi'i semiconductor o lo'o i le fatu o le tali atu, fa'atuatuaina, ma le malosi fa'aeletoroni.
O fa'amea manifinifi, la'ititi la'ititi, fa'ato'a sili atu, fa'apipi'i afifi, fa'ata'ita'iga 3D, fa'atekonolosi fa'a-vafe ma le fa'atamaoaigaina o fua i le tele o gaosiga e mana'omia mea e mafai ona lagolago ai mana'oga fou. O le fa'aogaina o fofo a Henkel e fa'aogaina ai le tele o alagaoa a le lalolagi e tu'uina atu ai tekonolosi mea fa'apipi'i semiconductor ma fa'atinoga fa'atauva'a tau. Mai mea fa'apipi'i fa'apipi'i mo afifi fa'amau uaea fa'aleaganu'u aga'i i lalo fa'atumu ma encapsulants mo fa'apipi'i fa'apipi'i fa'apipi'i, ua saunia e Henkel le fa'atekonolosi fa'aonaponei ma le lagolago i le lalolagi atoa e mana'omia e ta'ita'i kamupani microelectronics.
Su'e Chip i lalo ole faatumu
O le fa'atumu e fa'aoga mo le mautu fa'ainisinia o le va'a. E taua tele lenei mea pe a faʻapipiʻi meataalo polo grid array (BGA). Ina ia faʻaitiitia le faʻaogaina o le faʻalauteleina o le vevela (CTE), o le faʻapipiʻi o loʻo faʻatumu vaega i nanofillers.
O mea fa'apipi'i e fa'aaogaina e fai ma fa'atutumu pu'upu'u o lo'o i ai mea e tafe ai capillary mo le fa'aogaina vave ma faigofie. E masani ona fa'aogaina se mea fa'apipi'i lua fa'amalolo: o vaega pito o lo'o fa'amauina i le fa'amaloloina o le UV a'o le'i fa'amama fa'amalama vaega paolo.
Deepmaterial o le maualalo o le vevela fofo bga flip chip underfill pcb epoxy process adhesive kelu mea gaosi ma le vevela-resistant underfill coating supppliers, sapalai tasi vaega epoxy underfill compounds, epoxy underfill encapsulant, underfill mea encapsulation mo flip chip i le pcb electronic circuit board, epoxy- fa'avae chip underfill ma cob encapsulation mea ma isi.
