UV Moisture Dual Curing Adhesive

Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.

Category:

Description

Product Specifications & Parameters

Product

Name

Product

Name 2

Color Typical

Viscosity

(cps)

Mixing Ratio Initial Fixation Time /

Full Fixation

TG/°C Hardness/D Temperature

Resistance/°C

Stored Typical Product

Applications

DM-6060F UV moisture dual curing adhesive Translucent Light Blue 18000 Single

component

<[email protected]/cm 2Humidity 8 days 75 76 -55°C-120°C 2-8°C Non-flow, UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (Black). Mainly used for local protection of WLCSP and BGA on circuit boards.
DM-6061F UV moisture dual curing adhesive Translucent Light Blue 23000 Single

component

<[email protected]/cm 2Humidity 7 days 56 75 -55°C-120°C 2-8°C Non-flow, UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (Black). Mainly used for local protection of WLCSP and BGA on circuit boards.
DM-6290 UV moisture

dual curing

adhesive

Transparent amber 100~350 Hardness:

60~90

<[email protected]/cm2Moisture curing for 5 days -45 -53°C – 204°C 2-8°C It is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
DM-6040 UV moisture

dual curing

adhesive

Transparent

liquid

500 Single

component

<[email protected]/cm 2Moisture 2-3 days * 80 -40°C – 135°C 20-30°C It is a single component, VOC free conformable coating. The product is specially formulated to gel and fix quickly when exposed to UV light and then cure when exposed to atmospheric moisture, thus ensuring optimum performance even in shaded areas. Thin layers of the coating can be set almost instantly to a depth of 7mils. The product has a strong Black fluorescence and excellent adhesion to a wide range of metal, ceramic and glass filled epoxy surfaces, meeting the needs of the most demanding environmentally friendly applications.

Product Features

Fast Curing High toughness, excellent thermal cycling properties Suitable for stress sensitive materials
Resistant to prolonged moisture or water immersion High viscosity, high thixotropy Strong adhesive properties

Product Advantages

UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (black). It is mainly used for local protection of WLCSP and BGA on circuit boards. The product is specially formulated for fast gelation and fixing when exposed to UV light and then curing when exposed to atmospheric moisture, thus ensuring optimum performance.