Epoxy Underfill

DeepMaterial, monga mafakitale epoxy zomatira zomatira, ife anataya kafukufuku wa underfill epoxy, non conductive guluu zamagetsi, non conductive epoxy, zomatira kwa electronic assembly, underfill zomatira, mkulu refractive index epoxy. Kutengera izi, tili ndi ukadaulo waposachedwa kwambiri wa zomatira za epoxy zamakampani.

DeepMaterial yapanga zomatira m'mafakitale zopangira ndi kuyesa ma chip, zomatira zama board-level level, ndi zomatira pazinthu zamagetsi. Kutengera zomatira, yapanga mafilimu odzitchinjiriza, zodzaza semiconductor, ndi zida zoyikapo za semiconductor wafer processing ndi kuyika chip ndikuyesa.

Kupereka zomatira pakompyuta ndi zomatira zamagetsi zamagetsi zamagetsi zamagetsi zamagetsi ndi njira zothetsera makampani olumikizirana, makampani ogwiritsira ntchito zamagetsi, makampani opanga ma semiconductor ndi kuyesa makampani, ndi opanga zida zoyankhulirana, kuthetsa makasitomala omwe tawatchulawa poteteza njira, kulumikiza zinthu mwachangu kwambiri. , ndi ntchito zamagetsi.

DeepMaterial imapereka mitundu yosiyanasiyana yazomatira zamafakitale, zomatira za UV zomata za UV, zomatira zomata zotentha zotentha komanso zomatira zomatira zomatira, zomatira za epoxy-based chip underfill ndi COB encapsulation materials series, potting board protection potting and conformal coating coating. mndandanda, epoxy yochokera conductive siliva zomatira mndandanda, structural bonding zomatira mndandanda, zinchito zoteteza mafilimu mndandanda, semiconductor zoteteza filimu mndandanda.

DeepMaterial ndi bwino chigawo chimodzi epoxy underfill encapsulants ogulitsa kampani ku China, kupereka mbali underfill epoxy kwa flip chip zipangizo mpira gululi gululi Chip sikelo ma CD csp bga wLCsp LG, otsika kutentha mankhwala bga flip chip underfill pcb epoxy ndondomeko zomatira guluu conduction guluu, zomatira sealant guluu kwa underfill pcb zipangizo zamagetsi, zomatira semiconductor kwa msonkhano pakompyuta. ndi zina zotero