1. Kunyumba
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3. Zambiri zaife

Masiku ano ogula amafuna zipangizo zing'onozing'ono, ntchito zambiri, kudalirika kwapadera komanso, ndithudi, mtengo wotsika. Pamene zofuna za msika wa semiconductor zikuchulukirachulukira chaka ndi chaka, DeepMaterial ili ndi mbiri yathunthu ya die attach, underfill, encapsulant, ndi zomatira zapaderazi ndi zomatira zamtundu uliwonse wapamwamba komanso ntchito iliyonse kuphatikiza Flip Chip, Wafer Level Packaging ndi Memory 3D TSV. Kupaka.

Ndi mafoni & cloud computing, kukumbukira ndi makina othandizira oyendetsa galimoto omwe amathandizira kufunikira kochepetsera mawonekedwe, kusakanikirana kwa dongosolo, kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe ka kayendetsedwe kake Poyankha kachulukidwe wapamwamba pa board level DeepMaterial ndiye mtsogoleri wazomatira zomwe zimalola mapangidwe atsopano a phukusi, ukadaulo watsopano wolumikizidwa komanso kutengera zambiri. Zikafika pazinthu zatsopano zomwe zili patsogolo pa msika wapamwamba wolumikizidwa, DeepMaterial ndiye chisankho chotsogola.

DeepMaterial ndi polyurethane reactive PUR otentha kusungunula kuthamanga tcheru zomatira wopanga ndi katundu, kupanga chigawo chimodzi epoxy underfill zomatira, otentha kusungunula zomatira, UV kuchiritsa zomatira, mkulu refractive index kuwala zomatira, zomatira maginito zomata, zomatira zabwino kwambiri zomatira madzi pulasitiki. ndi magalasi, zomatira zamagetsi zamagetsi zamagalimoto amagetsi ndi ma motors ang'onoang'ono pazida zapakhomo