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Wopanga zomatira zomatira za epoxy komanso ogulitsa

Shenzhen DeepMaterial Technologies Co., Ltd ndi flip Chip bga underfill epoxy zakuthupi ndi epoxy encapsulant wopanga ku China, kupanga underfill encapsulants,smt pcb underfill epoxy, chigawo chimodzi epoxy underfill mankhwala,flip Chip underfill epoxy kwa csp ndi zina zotero.

Underfill ndi zinthu za epoxy zomwe zimadzaza mipata pakati pa chip ndi chonyamulira chake kapena phukusi lomalizidwa ndi gawo lapansi la PCB. Kudzaza kumateteza zinthu zamagetsi kuti zisagwedezeke, kugwetsa, ndi kugwedezeka ndipo kumachepetsa kupsinjika kwa ma solder osalimba omwe amayamba chifukwa cha kusiyana kwakukula kwamafuta pakati pa silicon chip ndi chonyamulira (zinthu ziwiri zosiyana).

M'magawo a capillary underfill, kuchuluka kwazinthu zomwe sizingakwaniritsidwe bwino zimaperekedwa m'mbali mwa chip kapena phukusi kuti ziziyenda pansi kudzera mu capillary action, kudzaza mipata ya mpweya mozungulira mipira yogulitsa yomwe imalumikiza mapaketi a chip ku PCB kapena tchipisi tambirimbiri. Zida zopanda madzi, zomwe nthawi zina zimagwiritsidwa ntchito pocheperapo, zimayikidwa pagawo laling'ono chip kapena phukusi lisanamangiridwe ndikubwezeredwa. Kuwumbidwa pansi ndi njira ina yomwe imaphatikizapo kugwiritsa ntchito utomoni kudzaza mipata pakati pa chip ndi gawo lapansi.

Popanda kudzaza, nthawi ya moyo wa chinthu imatha kuchepetsedwa kwambiri chifukwa cha kusweka kwa zolumikizira. Kudzaza pansi kumagwiritsidwa ntchito pamagawo otsatirawa akupanga kuti apititse patsogolo kudalirika.

Upangiri Wathunthu wa Underfill Epoxy:

Kodi Epoxy Underfill ndi chiyani?

Underfill ndi mtundu wa zinthu za epoxy zomwe zimagwiritsidwa ntchito kudzaza mipata pakati pa chip cha semiconductor ndi chonyamulira chake kapena pakati pa phukusi lomalizidwa ndi gawo lapansi losindikizidwa (PCB) pazida zamagetsi. Amagwiritsidwa ntchito pamakina apamwamba a semiconductor packaging, monga flip-chip ndi chip-scale phukusi, kupititsa patsogolo kudalirika kwamakina ndi kutentha kwa zida.

Epoxy underfill nthawi zambiri imapangidwa ndi epoxy resin, polima ya thermosetting yokhala ndi makina abwino kwambiri komanso mankhwala, kupangitsa kuti ikhale yoyenera kugwiritsidwa ntchito pamagetsi ofunikira. Utoto wa epoxy nthawi zambiri umaphatikizidwa ndi zowonjezera zina, monga zowumitsa, zodzaza, ndi zosintha, kuti ziwongolere magwiridwe ake ndikusintha mawonekedwe ake kuti akwaniritse zofunikira.

Epoxy underfill ndi zinthu zamadzimadzi kapena theka-zamadzimadzi zomwe zimaperekedwa pagawo laling'ono pomwe semiconductor kufa isanayikidwe pamwamba. Ndiye amachiritsidwa kapena olimba, kawirikawiri kupyolera mu kutentha kwa kutentha, kuti apange chinsalu cholimba, chotetezera chomwe chimaphatikizapo kufa kwa semiconductor ndikudzaza kusiyana pakati pa kufa ndi gawo lapansi.

Epoxy underfill ndi zinthu zomatira zapadera zomwe zimagwiritsidwa ntchito popanga zamagetsi kuti zitseke ndi kuteteza zinthu zosalimba, monga ma microchips, podzaza kusiyana pakati pa chinthucho ndi gawo lapansi, nthawi zambiri gulu losindikizidwa (PCB). Amagwiritsidwa ntchito kwambiri muukadaulo wa flip-chip, pomwe chip chimayikidwa chafufumimba pagawo lapansi kuti chiwongolere magwiridwe antchito amagetsi ndi matenthedwe.

Cholinga chachikulu cha epoxy underfills ndikupereka chilimbikitso pamakina pa flip-chip phukusi, kuwongolera kukana kwake kupsinjika kwamakina monga kupalasa njinga, kugwedezeka kwamakina, ndi kugwedezeka. Zimathandizanso kuchepetsa chiopsezo cha solder olowa kulephera chifukwa cha kutopa ndi matenthedwe kukula mismatches, zomwe zingachitike pa ntchito chipangizo chamagetsi.

Zida za epoxy underfill nthawi zambiri zimapangidwa ndi ma epoxy resins, machiritso, ndi zodzaza kuti akwaniritse zomwe amafunikira pamakina, matenthedwe, ndi magetsi. Amapangidwa kuti azikhala ndi kumamatira kwabwino kwa semiconductor kufa ndi gawo lapansi, chocheperako chochepa cha kufalikira kwamafuta (CTE) kuti muchepetse kupsinjika kwamafuta, komanso kutulutsa kwamafuta kwambiri kuti muchepetse kutentha kwa chipangizocho.

Kodi Underfill Epoxy Amagwiritsidwa Ntchito Bwanji?

Underfill epoxy ndi zomatira za epoxy resin zomwe zimagwiritsidwa ntchito pazinthu zosiyanasiyana kuti zithandizire kumakina ndi chitetezo. Nazi zina zomwe zimagwiritsidwa ntchito pa underfill epoxy:

Kupaka kwa Semiconductor: Underfill epoxy imagwiritsidwa ntchito popanga semiconductor kuti ipereke chithandizo chamakina ndi chitetezo kuzinthu zamagetsi, monga ma microchips, okwera pama board osindikizidwa (PCBs). Imadzaza kusiyana pakati pa chip ndi PCB, kuteteza kupsinjika ndi kuwonongeka kwamakina komwe kumachitika chifukwa chakukula kwamafuta ndi kutsika panthawi yogwira ntchito.

Kugwirizana kwa Flip-Chip: Underfill epoxy imagwiritsidwa ntchito polumikizana ndi flip-chip, yomwe imalumikiza tchipisi ta semiconductor molunjika ku PCB yopanda ma waya. Epoxy imadzaza kusiyana pakati pa chip ndi PCB, kupereka kulimbitsa kwamakina ndi kutchinjiriza kwamagetsi ndikuwongolera magwiridwe antchito amafuta.

Kupanga Zowonetsera: Underfill epoxy amagwiritsidwa ntchito kupanga zowonetsera, monga zowonetsera zamadzimadzi (LCDs) ndi ma organic light-emitting diode (OLED). Amagwiritsidwa ntchito kumangiriza ndi kulimbikitsa zida zosalimba, monga madalaivala owonetsa ndi masensa okhudza, kuwonetsetsa kukhazikika kwamakina ndi kulimba.

Zida za Optoelectronic: Underfill epoxy imagwiritsidwa ntchito pazida za optoelectronic, monga ma transceivers owoneka bwino, ma lasers, ndi ma photodiodes, kuti apereke chithandizo chamakina, kuwongolera magwiridwe antchito amafuta, ndikuteteza zida zodziwikiratu kuzinthu zachilengedwe.

Zamagetsi Zagalimoto: Underfill epoxy imagwiritsidwa ntchito mumagetsi amagalimoto, monga mayunitsi owongolera zamagetsi (ECUs) ndi masensa, kuti apereke chilimbikitso ndi chitetezo ku kutentha kwambiri, kugwedezeka, ndi zovuta zachilengedwe.

Ntchito Zamlengalenga ndi Chitetezo: Underfill epoxy imagwiritsidwa ntchito muzamlengalenga ndi chitetezo, monga ma avionics, makina a radar, ndi zida zamagetsi zankhondo, kupereka kukhazikika kwamakina, kuteteza kusinthasintha kwa kutentha, komanso kukana kugwedezeka ndi kugwedezeka.

Consumer Electronics: Underfill epoxy imagwiritsidwa ntchito pamagetsi osiyanasiyana ogula, kuphatikiza mafoni a m'manja, mapiritsi, ndi ma consoles amasewera, kuti alimbikitse makina ndikuteteza zida zamagetsi kuti zisawonongeke chifukwa cha njinga zamatenthedwe, kukhudzidwa, ndi zovuta zina.

Zida Zachipatala: Underfill epoxy imagwiritsidwa ntchito pazida zamankhwala, monga zida zoyika, zida zowunikira, ndi zida zowunikira, kuti zithandizire kumakina ndikuteteza zida zamagetsi zamagetsi kumadera ovuta.

Kupaka kwa LED: Underfill epoxy imagwiritsidwa ntchito poyika ma diode otulutsa kuwala (ma LED) kuti apereke chithandizo chamakina, kasamalidwe ka kutentha, ndi chitetezo ku chinyezi ndi zinthu zina zachilengedwe.

Zamagetsi Zamagetsi: Underfill epoxy imagwiritsidwa ntchito pazinthu zambiri zamagetsi zomwe zimafunikira kulimbitsa kwamakina ndi kuteteza zida zamagetsi, monga zamagetsi zamagetsi, zamagetsi zamagetsi, ndi zida zamagetsi.

Kodi Underfill Material Kwa Bga Ndi Chiyani?

Underfill zinthu kwa BGA (Ball Grid Array) ndi epoxy kapena polima-based mfundo ntchito kudzaza kusiyana pakati BGA phukusi ndi PCB (Printed Circuit Board) pambuyo soldering. BGA ndi mtundu wa phukusi lokwera pamwamba lomwe limagwiritsidwa ntchito pazida zamagetsi zomwe zimapereka kulumikizana kwakukulu pakati pa gawo lophatikizika (IC) ndi PCB. Zinthu zomwe sizingakwaniritsidwe zimawonjezera kudalirika kwa ma solder a BGA ndi mphamvu zamakina, kuchepetsa chiopsezo cha kulephera chifukwa cha zovuta zamakina, kuyendetsa njinga zamatenthedwe, ndi zina zachilengedwe.

Zinthu zodzaza pansi nthawi zambiri zimakhala zamadzimadzi ndipo zimayenda pansi pa phukusi la BGA kudzera pa capillary action. Kenako imadutsa njira yochiritsira kuti ilimbitse ndikupanga kulumikizana kolimba pakati pa BGA ndi PCB, nthawi zambiri kudzera pakutentha kapena kuwonekera kwa UV. Zomwe zimadzaza pansi zimathandizira kugawa kupsinjika kwamakina komwe kumatha kuchitika panjinga yotentha, kuchepetsa chiwopsezo cha kusweka kwa solder ndikuwongolera kudalirika kwathunthu kwa phukusi la BGA.

Zinthu zomwe sizingakwaniritsidwe kwa BGA zimasankhidwa mosamalitsa kutengera zinthu monga kapangidwe ka phukusi la BGA, zida zomwe zimagwiritsidwa ntchito mu PCB ndi BGA, malo ogwirira ntchito, ndi zomwe akufuna. Zida zina zodziwika bwino za BGA zimaphatikizapo epoxy-based, no-flow, and underfill with different filler materials monga silika, alumina, kapena conductive particles. Kusankhidwa kwa zinthu zoyenera zochepetsera ndizofunikira kuti zitsimikizire kudalirika kwanthawi yayitali komanso magwiridwe antchito a phukusi la BGA pazida zamagetsi.

Komanso, zinthu underfill kwa BGA angapereke chitetezo ku chinyezi, fumbi, ndi zoipitsa zina kuti mwina kudutsa kusiyana pakati pa BGA ndi PCB, mwina kuchititsa dzimbiri kapena mabwalo lalifupi. Izi zitha kuthandiza kukulitsa kukhazikika kwa phukusi la BGA ndi kudalirika m'malo ovuta.

Kodi Underfill Epoxy mu IC ndi chiyani?

Underfill epoxy mu IC (Integrated Circuit) ndi zinthu zomatira zomwe zimadzaza kusiyana pakati pa semiconductor chip ndi gawo lapansi (monga bolodi losindikizidwa) pazida zamagetsi. Amagwiritsidwa ntchito kwambiri popanga ma ICs kuti apititse patsogolo mphamvu zamakina ndi kudalirika kwawo.

Ma IC nthawi zambiri amapangidwa ndi chip cha semiconductor chomwe chimakhala ndi zida zosiyanasiyana zamagetsi, monga ma transistors, resistors, ndi ma capacitor, omwe amalumikizidwa ndi magetsi akunja. Tchipisi izi zimayikidwa pagawo laling'ono, lomwe limapereka chithandizo ndi kulumikizidwa kwamagetsi kumagetsi ena onse. Komabe, chifukwa cha kusiyana kwa ma coefficients of thermal expansion (CTEs) pakati pa chip ndi gawo lapansi komanso kupsinjika ndi zovuta zomwe zimachitika panthawi yogwira ntchito, kupsinjika kwamakina, ndi zinthu zodalirika zimatha kubwera, monga kulephera koyambitsa njinga yamoto kapena ming'alu yamakina.

Underfill epoxy imayankha izi podzaza kusiyana pakati pa chip ndi gawo lapansi, ndikupanga chomangira cholimba. Ndi mtundu wa utomoni wa epoxy wopangidwa ndi zinthu zinazake, monga kukhuthala kochepa, mphamvu yomatira kwambiri, komanso zinthu zabwino zamatenthedwe komanso zamakina. Panthawi yopanga, epoxy yodzaza pansi imagwiritsidwa ntchito mumadzimadzi, kenako imachiritsidwa kuti ikhale yolimba ndikupanga mgwirizano wamphamvu pakati pa chip ndi gawo lapansi. Ma IC ndi zida zamagetsi zomwe zimatha kukhudzidwa ndi kupsinjika kwamakina, kuyendetsa njinga, ndi zinthu zina zachilengedwe panthawi yogwira ntchito, zomwe zingayambitse kulephera chifukwa cha kutopa kwa solder kapena delamination pakati pa chip ndi gawo lapansi.

The underfill epoxy imathandizira kugawanso ndikuchepetsa kupsinjika kwamakina ndi zovuta pakugwira ntchito komanso kumapereka chitetezo ku chinyezi, zoipitsidwa, ndi kugwedezeka kwamakina. Zimathandizanso kukonza kudalirika kwa njinga zamoto za IC pochepetsa chiopsezo cha kusweka kapena delamination pakati pa chip ndi gawo lapansi chifukwa cha kusintha kwa kutentha.

Kodi Underfill Epoxy Mu Smt Ndi Chiyani?

Underfill epoxy mu Surface Mount Technology (SMT) amatanthauza mtundu wa zomatira zomwe zimagwiritsidwa ntchito kudzaza kusiyana pakati pa chip cha semiconductor ndi gawo lapansi pazida zamagetsi monga ma board osindikizidwa (PCBs). SMT ndi njira yotchuka yosonkhanitsira zida zamagetsi pa PCBs, ndipo underfill epoxy imagwiritsidwa ntchito popititsa patsogolo mphamvu zamakina ndi kudalirika kwa zida zogulitsira pakati pa chip ndi PCB.

Pamene zipangizo zamagetsi zimakhudzidwa ndi njinga zamatenthedwe komanso kupsinjika kwamakina, monga pakugwira ntchito kapena kuyenda, kusiyana kwa coefficient of thermal expansion (CTE) pakati pa chip ndi PCB kungayambitse kupsinjika pamagulu a solder, zomwe zimapangitsa kuti pakhale zolephera monga ming'alu. kapena delamination. Underfill epoxy imagwiritsidwa ntchito pochepetsa zovutazi podzaza kusiyana pakati pa chip ndi gawo lapansi, kupereka chithandizo chamakina, ndikuletsa zolumikizira zogulitsira kuti zisavutike kwambiri.

Underfill epoxy nthawi zambiri ndi chinthu chotenthetsera chomwe chimaperekedwa mumtundu wamadzimadzi pa PCB, ndipo chimadutsa mumpata pakati pa chip ndi gawo lapansi kudzera mu capillary action. Kenako imachiritsidwa kuti ipange chinthu cholimba komanso chokhazikika chomwe chimamangirira chip ku gawo lapansi, kuwongolera kukhulupirika kwa makina olumikizirana ma solder.

Underfill epoxy imagwira ntchito zingapo zofunika pamisonkhano ya SMT. Zimathandizira kuchepetsa mapangidwe a ming'alu ya solder kapena fractures chifukwa cha njinga zamatenthedwe komanso kupsinjika kwamakina pakugwiritsa ntchito zida zamagetsi. Zimapangitsanso kutentha kwa kutentha kuchokera ku IC kupita ku gawo lapansi, zomwe zimathandiza kupititsa patsogolo kudalirika ndi ntchito ya msonkhano wamagetsi.

Kudzaza epoxy mumisonkhano ya SMT kumafuna njira zoperekera zolondola kuti zitsimikizire kufalikira koyenera ndi kugawa kofanana kwa epoxy popanda kuwononga IC kapena gawo lapansi. Zida zamakono monga maloboti operekera ndi ma uvuni ochiritsira amagwiritsidwa ntchito nthawi zambiri pochepetsa kudzaza kuti akwaniritse zotsatira zogwirizana ndi zomangira zapamwamba.

Kodi Makhalidwe a Underfill Material Ndi Chiyani?

Zida zodzaza pansi zimagwiritsidwa ntchito kwambiri popanga zida zamagetsi, makamaka, ma semiconductor package, kuti apititse patsogolo kudalirika komanso kulimba kwa zida zamagetsi monga ma frequency ophatikizika (ICs), ma grid grid arrays (BGAs), ndi mapaketi a flip-chip. Makhalidwe a zinthu zodzaza pansi amatha kusiyanasiyana kutengera mtundu wake komanso kapangidwe kake koma nthawi zambiri amaphatikiza izi:

Thermal conductivity: Zida zodzaza pansi ziyenera kukhala ndi matenthedwe abwino otenthetsera kutentha kopangidwa ndi chipangizo chamagetsi panthawi yogwira ntchito. Izi zimathandiza kupewa kutenthedwa, zomwe zingayambitse kulephera kupanga.

Kugwirizana kwa CTE (Coefficient of Thermal Expansion): Zida zocheperapo ziyenera kukhala ndi CTE yomwe imagwirizana ndi CTE ya chipangizo chamagetsi ndi gawo lapansi lomwe limalumikizidwa. Izi zimathandizira kuchepetsa kupsinjika kwa kutentha panthawi yoyendetsa njinga ndikupewa delamination kapena kusweka.

Low mamasukidwe akayendedwe: Zida zodzaza pansi ziyenera kukhala ndi kachulukidwe kakang'ono kuti zizitha kuyenda mosavuta panthawi ya encapsulation ndi kudzaza mipata pakati pa chipangizo chamagetsi ndi gawo lapansi, kuonetsetsa kuti yunifolomu ikuphimbidwa ndi kuchepetsa voids.

Kumamatira: Zida zodzaza pansi ziyenera kumamatira bwino pazida zamagetsi ndi gawo lapansi kuti zipereke chomangira cholimba ndikupewa kusokoneza kapena kupatukana ndi kupsinjika kwamafuta ndi makina.

Insulation yamagetsi: Zida zodzaza pansi ziyenera kukhala ndi mphamvu zotchinjiriza kwambiri kuti ziteteze mabwalo amfupi ndi kulephera kwina kwamagetsi pazida.

Mphamvu zamakina: Zida zodzaziramo ziyenera kukhala ndi mphamvu zokwanira zamakina kuti zipirire zovuta zomwe zimakumana ndi kutentha kwa njinga, kugwedezeka, kugwedezeka, ndi katundu wina wamakina popanda kusweka kapena kupunduka.

Nthawi yochizira: Zinthu zocheperako ziyenera kukhala ndi nthawi yoyenera yochizira kuti zitsimikizire kulumikizana koyenera ndikuchiritsa popanda kuchititsa kuchedwa pakupanga.

Kugawa ndi reworkability: Zipangizo zocheperako ziyenera kukhala zogwirizana ndi zida zoperekera zomwe zimagwiritsidwa ntchito popanga ndikulola kukonzanso kapena kukonzanso ngati pakufunika.

Kukana chinyezi: Zida zosadzaza ziyenera kukhala ndi chinyezi chabwino kuti chiteteze kulowera kwa chinyezi, zomwe zingayambitse kulephera kwa chipangizocho.

Moyo wazitali: Zida zosadzaza ziyenera kukhala ndi alumali wokwanira, kulola kusungidwa koyenera komanso kugwiritsidwa ntchito pakapita nthawi.

Kodi Zinthu Zosakwanira Zopangidwa Ndi Molded?

Chida chopangidwa ndi underfill chimagwiritsidwa ntchito pamapaketi amagetsi kuti atseke ndi kuteteza zida za semiconductor, monga ma frequency ophatikizika (ICs), kuzinthu zakunja zachilengedwe komanso kupsinjika kwamakina. Amagwiritsidwa ntchito ngati zinthu zamadzimadzi kapena phala ndipo kenako amachiritsidwa kuti alimbitse ndikupanga wosanjikiza woteteza mozungulira chipangizo cha semiconductor.

Zida zomangidwira pansi zimagwiritsidwa ntchito kwambiri popanga ma flip-chip, omwe amalumikiza zida za semiconductor ku bolodi losindikizidwa (PCB) kapena gawo lapansi. Kuyika kwa chip-chip kumapangitsa kuti pakhale ndondomeko yolumikizana kwambiri, yomwe imagwira ntchito kwambiri, pomwe chipangizo cha semiconductor chimayikidwa moyang'anizana ndi gawo lapansi kapena PCB, ndipo kulumikizana kwamagetsi kumapangidwa pogwiritsa ntchito mabampu achitsulo kapena mipira ya solder.

Zomwe zimapangidwira pansi zimayikidwa mumadzi kapena phala ndipo zimayenda pansi pa chipangizo cha semiconductor ndi capillary action, kudzaza mipata pakati pa chipangizocho ndi gawo lapansi kapena PCB. Zinthuzo zimachiritsidwa pogwiritsa ntchito kutentha kapena njira zina zochiritsira kuti zikhazikike ndi kupanga chinsalu chotetezera chomwe chimaphimba chipangizocho, kupereka chithandizo cha makina, kutsekemera kwa kutentha, ndi chitetezo ku chinyezi, fumbi, ndi zonyansa zina.

Zipangizo zopangira zopangira zinthu zomwe zimapangidwira zimapangidwira kuti zikhale ndi zinthu monga kukhuthala pang'ono kuti zitheke kugawa mosavuta, kukhazikika kwamafuta ambiri kuti zigwire ntchito modalirika pamatenthedwe osiyanasiyana ogwiritsira ntchito, kumamatira bwino kumagawo osiyanasiyana, kutsika kwamphamvu kwapang'onopang'ono (CTE) kuti muchepetse nkhawa pakutentha. kupalasa njinga, ndi katundu mkulu magetsi kutchinjiriza kuteteza mabwalo lalifupi.

Ndithudi! Kuphatikiza pa zomwe tazitchula kale, zida zowumbidwa pansi zitha kukhala ndi mawonekedwe ena ogwirizana ndi ntchito kapena zofunikira. Mwachitsanzo, zida zina zomwe zidapangidwa mopitilira muyeso zitha kupititsa patsogolo kutentha kwamafuta kuti zithandizire kutulutsa kutentha kuchokera ku chipangizo cha semiconductor, chomwe ndi chofunikira pakugwiritsa ntchito mphamvu zapamwamba komwe kuwongolera kutentha ndikofunikira.

Kodi Mumachotsa Bwanji Zinthu Zosadzaza?

Kuchotsa zinthu zomwe sizidzadzaza kwambiri kungakhale kovuta, chifukwa zimapangidwira kuti zikhale zolimba komanso zosagwirizana ndi chilengedwe. Komabe, njira zingapo zokhazikika zitha kugwiritsidwa ntchito pochotsa zinthu zomwe sizidzadzaza, kutengera mtundu wina wa kudzaza ndi zotsatira zomwe mukufuna. Nazi zina zomwe mungachite:

Njira zotentha: Zida zodzaza pansi nthawi zambiri zimapangidwira kuti zikhale zokhazikika, koma nthawi zina zimatha kufewetsa kapena kusungunuka pogwiritsa ntchito kutentha. Izi zitha kuchitika pogwiritsa ntchito zida zapadera monga malo opangira mpweya wotentha, chitsulo cholumikizira chokhala ndi tsamba lotenthetsera, kapena chotenthetsera cha infrared. Chotsitsa chofewa kapena chosungunuka chimatha kupukutidwa bwino kapena kukwezedwa pogwiritsa ntchito chida choyenera, monga pulasitiki kapena zitsulo.

Njira zama Chemical: Zosungunulira mankhwala zimatha kusungunula kapena kufewetsa zinthu zina zomwe sizidzadzaza. Mtundu wa zosungunulira zofunika zimadalira mtundu enieni wa underfill zakuthupi. Zosungunulira zodziwikiratu zochotsa kudzaza kumaphatikizapo isopropyl alcohol (IPA), acetone, kapena njira zapadera zochotsera kudzaza. Chosungunuliracho chimagwiritsidwa ntchito kuzinthu zodzaza pansi ndikuloledwa kulowa mkati ndikuzifewetsa, kenako zinthuzo zimatha kupukutidwa kapena kufufutidwa.

Njira zamakina: Zinthu zomwe sizingakwaniritsidwe zimatha kuchotsedwa mwamakani pogwiritsa ntchito abrasive kapena makina. Izi zingaphatikizepo njira monga pera, mchenga, kapena mphero, pogwiritsa ntchito zida kapena zipangizo zapadera. Njira zodzipangira zokha nthawi zambiri zimakhala zankhanza kwambiri ndipo zitha kukhala zoyenera ngati njira zina sizothandiza, koma zimathanso kuwononga gawo lamkati kapena zigawo zake ndipo ziyenera kugwiritsidwa ntchito mosamala.

Njira zophatikizira: Nthawi zina, kuphatikiza njira kumatha kuchotsa zinthu zosadzaza. Mwachitsanzo, njira zosiyanasiyana zotenthetsera ndi mankhwala zingagwiritsidwe ntchito, kumene kutentha kumagwiritsidwa ntchito pofuna kufewetsa zinthu zotsalira, zosungunulira kuti zipitirize kusungunuka kapena kufewetsa zinthuzo, ndi njira zamakina kuchotsa zotsalira.

Momwe Mungadzazire Underfill Epoxy

Nayi chitsogozo cham'mbali chamomwe mungatsitsire epoxy:

1: Sonkhanitsani Zida ndi Zida

Kudzaza zinthu za epoxy: Sankhani chida cha epoxy chapamwamba kwambiri chomwe chimagwirizana ndi zida zamagetsi zomwe mukugwira nazo ntchito. Tsatirani malangizo a wopanga kusakaniza ndi kuchiritsa nthawi.

Zida zoperekera: Mudzafunika makina operekera, monga syringe kapena dispenser, kuti mugwiritse ntchito epoxy molondola komanso mofanana.

Gwero la kutentha (ngati mukufuna): Zida zina zosadzaza ndi epoxy zimafuna kuchiritsidwa ndi kutentha, kotero mungafunike gwero la kutentha, monga uvuni kapena mbale yotentha.

Zida zoyeretsera: Khalani ndi mowa wa isopropyl kapena choyeretsera chofananira, zopukuta zopanda zingwe, ndi magolovesi otsuka ndi kusamalira epoxy.

Gawo 2: Konzani Zigawo

Yeretsani zigawozo: Onetsetsani kuti zida zomwe sizidzadzaza ndi zoyera komanso zopanda zodetsa zilizonse, monga fumbi, mafuta, kapena chinyezi. Ayeretseni bwino pogwiritsa ntchito mowa wa isopropyl kapena chotsukira chofananira.

Ikani zomatira kapena flux (ngati kuli kofunikira): Malingana ndi underfill epoxy material ndi zigawo zomwe zikugwiritsidwa ntchito, mungafunike kuyika zomatira kapena zotsekemera ku zigawozo musanagwiritse ntchito epoxy. Tsatirani malangizo a wopanga zinthu zomwe zikugwiritsidwa ntchito.

Khwerero 3: Sakanizani epoxy

Tsatirani malangizo a wopanga kuti musakanizane bwino ndi epoxy. Izi zitha kuphatikizira kuphatikiza zigawo ziwiri kapena zingapo za epoxy m'magawo enaake ndikuwalimbikitsa bwino kuti akwaniritse kusakaniza kofanana. Gwiritsani ntchito chidebe choyera ndi chowuma posakaniza.

Khwerero 4: Ikani Epoxy

Kwezani epoxy mu dongosolo logawa: Lembani dongosolo loperekera, monga syringe kapena dispenser, ndi zinthu zosakanikirana za epoxy.

Ikani epoxy: Tayani zinthu za epoxy pamalo omwe akuyenera kudzazidwa pang'ono. Onetsetsani kuti mugwiritse ntchito epoxy mu yunifolomu komanso yoyendetsedwa bwino kuti mutsimikizire kuphimba kwathunthu kwa zigawozo.

Pewani thovu la mpweya: Pewani kutchera ma thovu a mpweya mu epoxy, chifukwa amatha kusokoneza magwiridwe antchito ndi kudalirika kwa zigawo zosadzaza. Gwiritsani ntchito njira zoyenera zoperekera, monga kuthamanga pang'onopang'ono komanso kosasunthika, ndipo mwapang'onopang'ono chotsani thovu lililonse lomwe latsekeka ndi vacuum kapena kugogoda polumikizira.

Khwerero 5: Chiritsani Epoxy

Kuchiza epoxy: Tsatirani malangizo a wopanga kuti muchiritse epoxy yodzaza. Kutengera ndi zinthu za epoxy zomwe zimagwiritsidwa ntchito, izi zingaphatikizepo kukonza kutentha kwa firiji kapena kugwiritsa ntchito gwero la kutentha.

Limbikitsani nthawi yoyenera yochiritsa: Perekani epoxy nthawi yokwanira kuti ichire mokwanira musanagwire kapena kukonzanso zigawozo. Kutengera ndi zinthu za epoxy komanso machiritso, izi zitha kutenga maola angapo mpaka masiku angapo.

Gawo 6: Yeretsani ndikuwunika

Chotsani epoxy yochulukirapo: Epoxy ikachira, chotsani epoxy yochulukirapo pogwiritsa ntchito njira zoyenera zoyeretsera, monga kukwapula kapena kudula.

Onani zigawo zosadzaza: Yang'anani zomwe sizinadzazidwe bwino ngati zili ndi vuto lililonse, monga ma voids, delamination, kapena kusakwanira. Ngati pali cholakwika chilichonse, tengani njira zoyenera zokonzetsera, monga kudzazanso kapena kuchiritsa, ngati pakufunika.

Mumadzadza Liti Kudzaza Epoxy

Nthawi ya underfill epoxy application idzadalira ndondomeko yeniyeni ndi ntchito. Underfill epoxy nthawi zambiri amagwiritsidwa ntchito pambuyo poti microchip itayikidwa pa bolodi lozungulira ndipo zolumikizira zidapangidwa. Pogwiritsira ntchito dispenser kapena syringe, epoxy yodzaza pansi imayikidwa mumpata wawung'ono pakati pa microchip ndi bolodi lozungulira. Epoxy imachiritsidwa kapena kuumitsidwa, nthawi zambiri imatenthetsa kutentha kwina.

Nthawi yeniyeni ya ntchito ya underfill epoxy ingadalire zinthu monga mtundu wa epoxy wogwiritsidwa ntchito, kukula ndi geometry ya kusiyana koyenera kudzazidwa, ndi njira yochiritsira yeniyeni. Kutsatira malangizo a wopanga ndi njira yovomerezeka ya epoxy yomwe ikugwiritsidwa ntchito ndikofunikira.

Nazi zochitika zatsiku ndi tsiku pamene underfill epoxy ingagwiritsidwe ntchito:

Kugwirizana kwa chip-chip: Underfill epoxy imagwiritsidwa ntchito kwambiri polumikizira chip-chip, njira yolumikizira chip cha semiconductor molunjika ku PCB popanda kulumikizana ndi waya. Flip-chip ikalumikizidwa ku PCB, underfill epoxy imagwiritsidwa ntchito kudzaza kusiyana pakati pa chip ndi PCB, kupereka kulimbitsa kwamakina ndikuteteza chip kuzinthu zachilengedwe monga chinyezi ndi kusintha kwa kutentha.

Ukadaulo wa Surface Mount Technology (SMT): Underfill epoxy itha kugwiritsidwanso ntchito paukadaulo waukadaulo wa pamwamba (SMT), pomwe zida zamagetsi monga ma circulating ophatikizika (ICs) ndi zopinga zimayikidwa pamwamba pa PCB. Underfill epoxy angagwiritsidwe ntchito kulimbikitsa ndi kuteteza zigawozi pambuyo kugulitsidwa pa PCB.

Msonkhano wa Chip-on-board (COB): Pamsonkhano wa chip-on-board (COB), tchipisi tating'onoting'ono ta semiconductor timamangiriridwa mwachindunji ku PCB pogwiritsa ntchito zomatira, ndipo underfill epoxy ingagwiritsidwe ntchito kutsekereza ndi kulimbikitsa tchipisi, kuwongolera kukhazikika kwamakina ndi kudalirika.

Kukonza kwagawo: Underfill epoxy itha kugwiritsidwanso ntchito pokonzanso magawo, pomwe zida zowonongeka kapena zolakwika pa PCB zimasinthidwa ndi zatsopano. Underfill epoxy ingagwiritsidwe ntchito m'malo mwake kuti zitsimikizire kuti zimamatira bwino komanso kukhazikika kwamakina.

Ndi Epoxy Filler Madzi

Inde, epoxy filler nthawi zambiri imakhala yopanda madzi ikachira. Ma epoxy fillers amadziwika chifukwa chomamatira komanso kukana madzi, kuwapangitsa kukhala chisankho chodziwika bwino pamagwiritsidwe osiyanasiyana omwe amafunikira chomangira cholimba komanso chosalowa madzi.

Ikagwiritsidwa ntchito ngati chodzaza, epoxy imatha kudzaza ming'alu ndi mipata muzinthu zosiyanasiyana, kuphatikiza matabwa, zitsulo, ndi konkriti. Akachira, amapanga malo olimba, olimba osagwirizana ndi madzi ndi chinyezi, zomwe zimapangitsa kuti zikhale zoyenera kugwiritsidwa ntchito m'madera omwe ali ndi madzi kapena chinyezi chambiri.

Komabe, ndikofunikira kuzindikira kuti si onse odzaza epoxy omwe amapangidwa mofanana, ndipo ena amatha kukhala ndi milingo yosiyana yamadzi. Nthawi zonse ndi bwino kuyang'ana chizindikiro cha chinthucho kapena kukaonana ndi wopanga kuti muwonetsetse kuti ndi yoyenera pulojekiti yanu komanso momwe mungagwiritsire ntchito.

Kuti muwonetsetse zotsatira zabwino, ndikofunikira kukonzekera bwino pamwamba musanagwiritse ntchito epoxy filler. Izi zimaphatikizapo kuyeretsa malo bwino lomwe ndikuchotsa chilichonse chotayirira kapena chowonongeka. Kumwamba kukakonzedwa bwino, chodzaza epoxy chimatha kusakanikirana ndikugwiritsidwa ntchito molingana ndi malangizo a wopanga.

Ndikofunikanso kuzindikira kuti si onse odzaza epoxy omwe amapangidwa mofanana. Zogulitsa zina zitha kukhala zoyenererana ndi ntchito kapena malo enaake kuposa zina, kotero kusankha chinthu choyenera pantchitoyo ndikofunikira. Kuonjezera apo, ena epoxy fillers angafunike zokutira zowonjezera kapena zosindikizira kuti apereke chitetezo chosatha kwa madzi.

Ma epoxy fillers ndi otchuka chifukwa cha zinthu zoletsa madzi komanso kuthekera kopanga mgwirizano wolimba komanso wokhazikika. Komabe, kutsatira njira zoyenera zogwiritsira ntchito ndikusankha chinthu choyenera ndikofunikira kuti muwonetsetse zotsatira zabwino.

Kudzaza Epoxy Flip Chip Njira

Nazi njira zopangira underfill epoxy flip chip process:

Kukonza: Gawo lapansi ndi flip chip zimatsukidwa kuti zichotse fumbi, zinyalala, kapena zowononga zomwe zitha kusokoneza chomangira chocheperako cha epoxy.

Kugawa: Epoxy yodzaza kwambiri imaperekedwa ku gawo lapansi mwadongosolo, pogwiritsa ntchito dispenser kapena singano. Njira yogawayi iyenera kukhala yolondola kuti asasefukire kapena kuphulika.

Kugwirizana: Flip chip ndiye imalumikizidwa ndi gawo lapansi pogwiritsa ntchito maikulosikopu kuti atsimikizire kuyika kolondola.

Bweretsaninso: Flip chip imayendetsedwanso pogwiritsa ntchito ng'anjo kapena uvuni kuti isungunuke tokhala ndi solder ndikumangirira chip ku gawo lapansi.

Kuchiritsa: The underfilled epoxy amachiritsidwa ndi kutentha mu uvuni pa kutentha kwapadera ndi nthawi. Njira yochiritsa imalola epoxy kuyenda ndikudzaza mipata iliyonse pakati pa flip chip ndi gawo lapansi.

Kukonza: Pambuyo pochiritsa, epoxy iliyonse yowonjezereka imachotsedwa m'mphepete mwa chip ndi gawo lapansi.

kasamalidwe: Chomaliza ndikuwunika chip chip pansi pa maikulosikopu kuti muwonetsetse kuti palibe mipata kapena mipata mu epoxy yodzaza.

Kuchiza: Nthawi zina, njira yochiritsira pambuyo pa chithandizo ingakhale yofunikira kuwongolera makina ndi kutentha kwa epoxy yodzaza. Izi zimaphatikizapo kutenthetsa chip kachiwiri pa kutentha kwakukulu kwa nthawi yotalikirapo kuti mukwaniritse kulumikizana kokwanira kwa epoxy.

Mayeso amagetsi: Pambuyo pa underfill epoxy flip-chip process, chipangizocho chimayesedwa kuti chiwonetsetse kuti chimagwira ntchito bwino. Izi zitha kuphatikizira kuyang'ana zazifupi kapena kutsegulira kozungulira ndikuyesa mawonekedwe amagetsi a chipangizocho.

CD: Chipangizocho chikayesedwa ndikutsimikiziridwa, chikhoza kuikidwa ndi kutumizidwa kwa kasitomala. Kupakako kungaphatikizepo chitetezo chowonjezera, monga chophimba choteteza kapena encapsulation, kuonetsetsa kuti chipangizocho sichikuwonongeka panthawi yoyendetsa kapena kunyamula.

Epoxy Underfill Bga Njira

Njirayi imaphatikizapo kudzaza malo pakati pa chipangizo cha BGA ndi bolodi la dera ndi epoxy, yomwe imapereka chithandizo chowonjezera cha makina ndikuwongolera kutentha kwa kugwirizana. Nawa masitepe omwe akukhudzidwa mu njira ya epoxy underfill BGA:

• Konzani phukusi la BGA ndi PCB powayeretsa ndi zosungunulira kuti muchotse zonyansa zomwe zingakhudze mgwirizano.
• Ikani kusinthasintha pang'ono pakati pa phukusi la BGA.
• Ikani phukusi la BGA pa PCB ndikugwiritsa ntchito uvuni wa reflow kuti mugulitse phukusilo pa bolodi.
• Ikani kudzaza pang'ono kwa epoxy pakona ya phukusi la BGA. Kutsikira pansi kuyenera kuyikidwa pakona pafupi ndi pakati pa phukusi, ndipo sayenera kuphimba mipira iliyonse ya solder.
• Gwiritsani ntchito capillary kapena vacuum kuti mujambule kudzaza pansi pa phukusi la BGA. The underfill ayenera kuyenda mozungulira mipira solder, kudzaza voids aliyense ndi kupanga chomangira olimba pakati BGA ndi PCB.
• Chiritsani kudzaza pansi molingana ndi malangizo a wopanga. Izi kawirikawiri zimaphatikizapo kutenthetsa msonkhano ku kutentha kwapadera kwa nthawi yeniyeni.
• Tsukani gululo ndi zosungunulira kuti muchotse kuchulukira kulikonse kapena kudzaza.
• Yang'anani pansi kuti muwone ma voids, thovu, kapena zolakwika zina zomwe zingasokoneze magwiridwe antchito a chipangizo cha BGA.
• Tsukani epoxy iliyonse yowonjezereka kuchokera ku chipangizo cha BGA ndi bolodi yozungulira pogwiritsa ntchito zosungunulira.
• Yesani chipangizo cha BGA kuti muwonetsetse kuti chikuyenda bwino.

Epoxy underfill imapereka maubwino angapo a phukusi la BGA, kuphatikiza mphamvu zamakina, kuchepetsa kupsinjika pamalumikizidwe a solder, komanso kukana kupalasa njinga yamoto. Komabe, kutsatira malangizo a Mlengi mosamala kuonetsetsa mgwirizano wamphamvu ndi odalirika pakati pa phukusi BGA ndi PCB.

Momwe Mungapangire Underfill Epoxy Resin

Underfill epoxy resin ndi mtundu wa zomatira zomwe zimagwiritsidwa ntchito kudzaza mipata ndikulimbitsa zida zamagetsi. Nazi njira zambiri zopangira epoxy resin yodzaza:

• Zosakaniza:
• Utali wamkati
• Hardener
• Zida zodzaza (monga silika kapena mikanda yagalasi)
• zosungunulira (monga acetone kapena isopropyl mowa)
• Zothandizira (posankha)

masitepe:

Sankhani utomoni woyenera wa epoxy: Sankhani utomoni wa epoxy womwe uli woyenera kugwiritsa ntchito kwanu. Ma epoxy resins amabwera mumitundu yosiyanasiyana yokhala ndi zinthu zosiyanasiyana. Kuti mugwiritse ntchito mocheperapo, sankhani utomoni wamphamvu kwambiri, wocheperako, komanso womamatira bwino.

Sakanizani utomoni wa epoxy ndi chowumitsa: Mitundu yambiri ya epoxy resins imabwera m'magulu awiri, ndipo utomoni ndi zowumitsa zimayikidwa padera. Sakanizani zigawo ziwirizo mogwirizana ndi malangizo a wopanga.

Onjezani zida zodzaza: Onjezani zida zodzaza kusakaniza kwa epoxy resin kuti muwonjezere kukhuthala kwake ndikupereka chithandizo chowonjezera. Mikanda ya silika kapena magalasi imagwiritsidwa ntchito ngati zodzaza. Onjezani zodzaza pang'onopang'ono ndikusakaniza bwino mpaka kugwirizana komwe mukufuna kukwaniritsidwa.

Onjezani zosungunulira: Zosungunulira zitha kuwonjezeredwa kusakaniza kwa epoxy resin kuti muwongolere kutulutsa kwake komanso kunyowa kwake. Acetone kapena isopropyl mowa nthawi zambiri amagwiritsidwa ntchito. Onjezani zosungunulira pang'onopang'ono ndikusakaniza bwino mpaka kugwirizana komwe mukufuna kukwaniritsidwa.

Mwasankha: Onjezani zopangira: Zothandizira zitha kuwonjezeredwa kusakaniza kwa epoxy resin kuti muchepetse kuchiritsa. Komabe, zoyambitsa zimathanso kuchepetsa moyo wa mphika wa kusakaniza, choncho muzigwiritsa ntchito mosamala. Tsatirani malangizo a wopanga kuti muwonjezere kuchuluka koyenera kwa chothandizira.

Ikani underfill epoxy resin kuti mudzaze kusakaniza kwa epoxy resin ku kusiyana kapena mgwirizano. Gwiritsani ntchito syringe kapena dispenser kuti muphatikize bwino ndikupewa thovu la mpweya. Onetsetsani kuti kusakaniza kumagawidwa mofanana ndikuphimba malo onse.

Kuchiza epoxy resin: The epoxy resin akhoza kuchiza molingana ndi malangizo a wopanga. Ambiri underfill epoxy resins amachiritsa kutentha firiji, koma ena angafunike kutentha kwapamwamba kuti achire mwachangu.

 Kodi Pali Zolepheretsa Kapena Zovuta Zogwirizana ndi Epoxy Underfill?

Inde, pali zolepheretsa ndi zovuta zomwe zimagwirizanitsidwa ndi epoxy underfill. Zina mwazolepheretsa komanso zovuta ndizo:

Kusakanizika kwa kutentha: Epoxy underfills ali ndi coefficient of thermal expansion (CTE) yomwe ndi yosiyana ndi CTE ya zigawo zomwe zimagwiritsidwa ntchito kudzaza. Izi zingayambitse kupsinjika kwa kutentha ndipo zingayambitse kulephera kwa zigawo, makamaka m'malo otentha kwambiri.

Kukonza zovuta: Epoxy imadzaza ndi zida zapadera zopangira ndi njira, kuphatikiza zida zoperekera ndi kuchiritsa. Ngati sichinachitike bwino, kudzaza pansi sikungadzaze bwino mipata pakati pa zigawo zikuluzikulu kapena kungayambitse kuwonongeka kwa zigawozo.

Kutengera chinyezi: Epoxy underfills imakhudzidwa ndi chinyezi ndipo imatha kuyamwa chinyezi kuchokera ku chilengedwe. Izi zitha kuyambitsa zovuta ndi zomatira ndipo zitha kupangitsa kulephera kwazinthu.

Kugwirizana kwa Chemical: Epoxy underfills amatha kuchitapo kanthu ndi zinthu zina zomwe zimagwiritsidwa ntchito pazinthu zamagetsi, monga masks a solder, zomatira, ndi ma fluxes. Izi zitha kuyambitsa zovuta ndi zomatira ndipo zitha kupangitsa kulephera kwazinthu.

mtengo: Ma epoxy underfills amatha kukhala okwera mtengo kuposa zida zina zosadzaza, monga capillary underfills. Izi zitha kuwapangitsa kukhala osawoneka bwino kuti azigwiritsa ntchito m'malo opangira zinthu zambiri.

Zokhudza chilengedwe: Epoxy underfill imatha kukhala ndi mankhwala ndi zida zowopsa, monga bisphenol A (BPA) ndi phthalates, zomwe zitha kuyika pachiwopsezo ku thanzi la anthu komanso chilengedwe. Opanga akuyenera kusamala kuti awonetsetse kuti zidazi zikugwira ntchito motetezeka ndikutayidwa.

 Nthawi yokonzekera: Epoxy underfill imafuna nthawi yochulukirapo kuti ichiritsidwe isanayambe kugwiritsidwa ntchito. Nthawi yochiritsa imatha kusiyanasiyana kutengera momwe kutayirako kumapangidwira, koma nthawi zambiri kumakhala kuyambira mphindi zingapo mpaka maola angapo. Izi zitha kuchepetsa ntchito yopanga ndikuwonjezera nthawi yonse yopanga.

Ngakhale kuti epoxy underfills imapereka maubwino ambiri, kuphatikiza kudalirika komanso kukhazikika kwa zida zamagetsi, imaperekanso zovuta ndi zolephera zomwe ziyenera kuganiziridwa mosamala musanagwiritse ntchito.

Kodi Ubwino Wogwiritsa Ntchito Epoxy Underfill Ndi Chiyani?

Nazi zina mwazabwino zogwiritsa ntchito epoxy underfill:

Gawo 1: Kuchulukitsa kudalirika

Ubwino umodzi wofunikira kwambiri wogwiritsa ntchito epoxy underfill ndikuwonjezera kudalirika. Zida zamagetsi zimakhala pachiwopsezo chowonongeka chifukwa cha kupsinjika kwamafuta ndi makina, monga kuyendetsa njinga yamoto, kugwedezeka, ndi kugwedezeka. Epoxy underfill imathandizira kuteteza zida za solder pazigawo zamagetsi kuti zisawonongeke chifukwa cha zovuta izi, zomwe zitha kuwonjezera kudalirika komanso nthawi ya moyo wa chipangizo chamagetsi.

Gawo 2: Kuchita bwino

Pochepetsa kuwonongeka kwa zida zamagetsi, epoxy underfill ingathandize kukonza magwiridwe antchito a chipangizocho. Zida zamagetsi zomwe sizinakhazikitsidwe bwino zimatha kudwala chifukwa cha kuchepa kwa magwiridwe antchito kapena kulephera kwathunthu, ndipo ma epoxy underfill angathandize kupewa izi, zomwe zimapangitsa kuti pakhale chipangizo chodalirika komanso chogwira ntchito kwambiri.

Gawo 3: Kuwongolera bwino kwa kutentha

Epoxy underfill imakhala ndi matenthedwe abwino kwambiri, omwe amathandizira kutulutsa kutentha kuchokera kuzinthu zamagetsi. Izi zitha kukonza kasamalidwe ka kutentha kwa chipangizocho ndikuletsa kutenthedwa. Kutentha kwambiri kungayambitse kuwonongeka kwa zipangizo zamagetsi ndikuyambitsa zovuta zogwirira ntchito kapena kulephera kwathunthu. Popereka kasamalidwe koyenera ka kutentha, epoxy underfill ingalepheretse mavutowa ndikuwongolera magwiridwe antchito ndi moyo wa chipangizocho.

Gawo 4: Mphamvu zamakina zowonjezera

Epoxy underfill imapereka chithandizo chowonjezera pamakina pazinthu zamagetsi, zomwe zingathandize kupewa kuwonongeka chifukwa cha kugwedezeka kapena kugwedezeka. Zida zamagetsi zomwe sizimalimbikitsidwa mokwanira zimatha kuvutika ndi kupsinjika kwamakina, zomwe zimapangitsa kuvulala kapena kulephera kwathunthu. Epoxy ingathandize kupewa izi popereka mphamvu zowonjezera zamakina, zomwe zimatsogolera ku chipangizo chodalirika komanso chokhazikika.

Khwerero 5: Kuchepetsa masamba ankhondo

Epoxy underfill kungathandize kuchepetsa warpage PCB pa ndondomeko soldering, zomwe zingachititse kuti bwino kudalirika ndi bwino solder olowa khalidwe. PCB warpage zingayambitse nkhani ndi mayikidwe a zigawo zamagetsi, kumabweretsa zofooka wamba solder amene angayambitse nkhani kudalirika kapena kulephera kwathunthu. Epoxy underfill ingathandize kupewa izi pochepetsa tsamba lankhondo panthawi yopanga.

Kodi Epoxy Underfill Imagwiritsidwa Ntchito Motani Pakupanga Zamagetsi?

Nawa masitepe omwe amakhudzidwa pogwiritsira ntchito epoxy underfill pakupanga zamagetsi:

Kukonzekera zigawo: Zida zamagetsi ziyenera kupangidwa musanagwiritse ntchito epoxy underfill. Zigawozi zimatsukidwa kuti zichotse dothi, fumbi, kapena zinyalala zomwe zingasokoneze kumamatira kwa epoxy. Zigawozo zimayikidwa pa PCB ndikugwiridwa pogwiritsa ntchito zomatira zosakhalitsa.

Kutulutsa epoxy: Epoxy underfill imaperekedwa pa PCB pogwiritsa ntchito makina operekera. Makina operekera amasinthidwa kuti apereke epoxy mu kuchuluka kwake komanso malo. Epoxy imaperekedwa mumtsinje wopitirira m'mphepete mwa chigawocho. Mtsinje wa epoxy uyenera kukhala wautali kuti utseke kusiyana konse pakati pa chinthucho ndi PCB.

Kufalitsa epoxy: Pambuyo popereka, iyenera kufalikira kuphimba kusiyana pakati pa chigawocho ndi PCB. Izi zitha kuchitika pamanja pogwiritsa ntchito burashi yaying'ono kapena makina ofalitsa okha. The epoxy ayenera kufalikira mofanana popanda kusiya voids kapena mpweya thovu.

Kukonzekera kwa epoxy: Epoxy underfill ndiye imakhazikika kuti iwumitse ndikupanga mgwirizano wolimba pakati pa chigawocho ndi PCB. Njira yochiritsira imatha kuchitika m'njira ziwiri: kutentha kapena UV. Pochiritsa matenthedwe, PCB imayikidwa mu uvuni ndikutenthedwa ndi kutentha kwanthawi yayitali. Mu kuchiritsa kwa UV, epoxy imawululidwa ndi kuwala kwa ultraviolet kuyambitsa njira yochiritsa.

Kuyeretsa: Pambuyo pa epoxy underfills kuchiritsidwa, epoxy yowonjezera ikhoza kuchotsedwa pogwiritsa ntchito scraper kapena zosungunulira. Ndikofunikira kuchotsa epoxy yochulukirapo kuti isasokoneze magwiridwe antchito a gawo lamagetsi.

Kodi Zina Zomwe Zimagwiritsidwira Ntchito Za Epoxy Underfill Ndi Ziti?

Nazi zina zomwe zimagwiritsidwa ntchito pa epoxy underfill:

Kupaka kwa Semiconductor: Epoxy underfill imagwiritsidwa ntchito kwambiri pakuyika zida za semiconductor, monga ma microprocessors, ma circuit Integrated (ICs), ndi mapaketi a flip-chip. Pakugwiritsa ntchito, epoxy underfill imadzaza kusiyana pakati pa semiconductor chip ndi gawo lapansi, kupereka kulimbitsa kwamakina ndi kupititsa patsogolo matenthedwe amafuta kuti athetse kutentha komwe kumapangidwa panthawi yogwira ntchito.

Msonkhano wa board board (PCB): Epoxy underfill imagwiritsidwa ntchito m'thupi la ma PCB kuti apititse patsogolo kudalirika kwa ma solder. Amagwiritsidwa ntchito pansi pazigawo monga mpira gululi array (BGA) ndi chip scale phukusi (CSP) zipangizo pamaso reflow soldering. The epoxy underfills amayenda mu mipata pakati chigawo ndi PCB, kupanga chomangira amphamvu amene amathandiza kupewa solder olowa kulephera chifukwa cha kupsyinjika makina, monga matenthedwe njinga ndi mantha / kugwedera.

Optoelectronics: Epoxy underfill imagwiritsidwanso ntchito pakuyika zida za optoelectronic, monga ma light-emitting diode (LED) ndi ma laser diode. Zidazi zimapanga kutentha panthawi yogwira ntchito, ndipo epoxy underfill imathandizira kutulutsa kutentha kumeneku ndikuwongolera magwiridwe antchito a chipangizocho. Kuphatikiza apo, epoxy underfill imapereka chilimbikitso pamakina kuti ateteze zida za optoelectronic ku zovuta zamakina ndi zinthu zachilengedwe.

Zamagetsi zamagalimoto: Epoxy underfill imagwiritsidwa ntchito mu zamagetsi zamagalimoto pazinthu zosiyanasiyana, monga ma unit control unit (ECUs), transmission control units (TCUs), ndi masensa. Zida zamagetsi izi zimakumana ndi zovuta zachilengedwe, kuphatikiza kutentha kwambiri, chinyezi, komanso kugwedezeka. Epoxy underfill imateteza ku zinthu izi, kuonetsetsa kuti magwiridwe antchito odalirika komanso kukhazikika kwanthawi yayitali.

Consumer electronics: Epoxy underfill imagwiritsidwa ntchito pazida zosiyanasiyana zamagetsi zogula, kuphatikiza mafoni a m'manja, mapiritsi, zotonthoza zamasewera, ndi zida zotha kuvala. Zimathandizira kukonza kukhulupirika kwamakina a zidazi ndi magwiridwe antchito amafuta, kuwonetsetsa kuti zikugwira ntchito modalirika pamikhalidwe yosiyanasiyana yogwiritsira ntchito.

Zamlengalenga ndi chitetezo: Epoxy underfill imagwiritsidwa ntchito muzamlengalenga ndi chitetezo, pomwe zida zamagetsi ziyenera kupirira malo owopsa, monga kutentha kwambiri, kukwera kwambiri, komanso kugwedezeka kwakukulu. Epoxy underfill imapereka kukhazikika kwamakina komanso kasamalidwe kamafuta, ndikupangitsa kuti ikhale yoyenera madera ovuta komanso ovuta.

Ndi Njira Zotani Zochiritsira za Epoxy Underfill?

Kuchiritsa kwa epoxy underfill kumaphatikizapo izi:

Kugawa: Epoxy underfill nthawi zambiri amaperekedwa ngati zinthu zamadzimadzi pagawo lapansi kapena chip pogwiritsa ntchito dispenser kapena jetting system. Epoxy imayikidwa m'njira yolondola kuti iphimbe dera lonse lomwe likufunika kudzaza.

Zowonjezera: Epoxy ikatulutsidwa, chip nthawi zambiri chimayikidwa pamwamba pa gawo lapansi, ndipo epoxy underfill imayenda mozungulira ndi pansi pa chip, ndikuchiyika. Zinthu za epoxy zimapangidwira kuti ziziyenda mosavuta ndikudzaza mipata pakati pa chip ndi gawo lapansi kuti apange yunifolomu wosanjikiza.

Pre-curing: Epoxy underfill nthawi zambiri imachiritsidwa kale kapena kuchiritsidwa pang'ono kuti ikhale yofanana ndi gel pambuyo pa encapsulation. Izi zimachitika poyika msonkhanowo ku njira yochiritsira yotsika kutentha, monga kuphika mu uvuni kapena infrared (IR). Kuchiza chisanadze kumathandiza kuchepetsa mamasukidwe akayendedwe a epoxy ndi kupewa kutuluka m'dera underfill pa masitepe wotsatira kuchiritsa.

Kuchiritsa pambuyo: Ma epoxy underfills akachiritsidwa kale, msonkhanowo umakhala ndi njira yochiritsira yotentha kwambiri, makamaka mu uvuni wa convection kapena chipinda chochiritsira. Sitepe iyi imadziwika kuti kuchiritsa kwapambuyo kapena kuchiritsa komaliza, ndipo kumachitidwa kuti kuchiritse kwathunthu zinthu za epoxy ndikukwaniritsa mawotchi ake apamwamba komanso matenthedwe. Nthawi ndi kutentha kwazomwe zimachitika pambuyo pochiritsa zimayendetsedwa mosamala kuti zitsimikizire kuchiritsa kwathunthu kwa epoxy underfill.

Kuzizira: Pambuyo pochiza, msonkhanowo umaloledwa kuziziritsa mpaka kutentha pang'onopang'ono. Kuzizira kofulumira kungayambitse kupsinjika kwa kutentha ndikusokoneza kukhulupirika kwa epoxy underfill, kotero kuziziritsa koyendetsedwa ndikofunikira kuti mupewe zovuta zilizonse.

kasamalidwe: Ma epoxy underfills akachiritsidwa bwino, ndipo msonkhanowo wazirala, nthawi zambiri umawunikidwa ngati pali vuto lililonse kapena zotsalira zomwe sizingakwaniritsidwe. X-ray kapena njira zina zoyesera zosawononga zitha kugwiritsidwa ntchito kuyang'ana mtundu wa epoxy underfill ndikuwonetsetsa kuti yalumikiza chip ndi gawo lapansi mokwanira.

Ndi Mitundu Yanji Yosiyaniranapo Yazida za Epoxy Underfill Zomwe Zilipo?

Pali mitundu ingapo ya zida za epoxy underfill, iliyonse ili ndi zake komanso mawonekedwe ake. Ena mwa mitundu yodziwika bwino ya epoxy underfill zida ndi:

Capillary Underfill: Kapilari underfill zipangizo ndi otsika mamasukidwe akayendedwe epoxy utomoni amene amayenda mu mipata yopapatiza pakati semiconductor Chip ndi gawo lapansi pa ndondomeko underfill. Amapangidwa kuti akhale ndi mamasukidwe otsika, omwe amawalola kuti azitha kuyenda mosavuta m'mipata yaying'ono kudzera mu capillary action, ndiyeno kuchiritsa kuti apange cholimba, thermosetting zakuthupi zomwe zimapereka kulimbitsa kwamakina ku msonkhano wa chip-substrate.

No-Flow Underfill: Monga momwe dzinalo likusonyezera, zinthu zopanda madzi zopanda madzi sizikuyenda panthawi ya kudzaza. Amapangidwa ndi ma epoxy resins apamwamba kwambiri ndipo amagwiritsidwa ntchito ngati phala la epoxy kapena filimu pagawo lapansi. Pamsonkhano wa msonkhano, chip chimayikidwa pamwamba pa chipwirikiti chosasunthika, ndipo msonkhanowo umatenthedwa ndi kutentha ndi kupanikizika, zomwe zimapangitsa kuti epoxy azichiritsa ndikupanga zinthu zolimba zomwe zimadzaza mipata pakati pa chip ndi gawo lapansi.

Molded Underfill: Zida zopangidwira zosadzaza ndi ma epoxy resins opangidwa kale omwe amayikidwa pagawo laling'ono ndikutenthedwa kuti aziyenda ndikuyika chip panthawi ya kudzaza. Amagwiritsidwa ntchito m'mapulogalamu omwe amafunikira kupanga kuchuluka kwamphamvu komanso kuwongolera moyenera kuyika kwa zinthu zocheperako.

Wafer-Level Underfill: Zida zodzaza mulingo wa Wafer ndi utomoni wa epoxy womwe umayikidwa pamtunda wonse tchipisi tating'ono tisanatchulidwe. Epoxy imachiritsidwa, ndikupanga chinthu cholimba chomwe chimapereka chitetezo chocheperako ku tchipisi zonse zomwe zili pawafa. Kudzaza kwa Wafer-level underfill nthawi zambiri kumagwiritsidwa ntchito pakupanga ma wafer-level packaging (WLP), pomwe tchipisi tambiri timapakidwa pamodzi pawafa imodzi tisanapatulidwe kukhala paketi imodzi.

Encapsulant Underfill: Zida za encapsulant underfill ndi ma epoxy resins omwe amagwiritsidwa ntchito kuyika chip chonse ndi msonkhano wa gawo lapansi, kupanga chotchinga choteteza kuzungulira zigawozo. Amagwiritsidwa ntchito pamakina omwe amafunikira mphamvu zamakina apamwamba, chitetezo cha chilengedwe, komanso kudalirika kowonjezereka.

Zogwirizana ndi Glue ya Epoxy Adhesive:

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Chigawo chimodzi cha Epoxy Underfill Encapsulant

Kutentha Kwambiri Kuchiza BGA Flip Chip Underfill PCB Epoxy

Epoxy-Based Chip Underfill And COB Encapsulation Materials

Flip-Chip Ndi BGA Underfills Process Epoxy Adhesive Glue

Ubwino Ndi Kugwiritsa Ntchito Kwa Underfill Epoxy Encapsulants Mu Zamagetsi

Momwe mungagwiritsire ntchito zomatira za smt underfill epoxy pamapulogalamu osiyanasiyana

Bga underfill underfill epoxy adhesive glue solutions kuti mugwire bwino ntchito pagawo la SMT

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Deepmaterial watsimikiza kukhala mtsogoleri pamagetsi underfill epoxy makampani, khalidwe ndi chikhalidwe chathu!

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