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Epoxy-Based Chip Underfill And COB Encapsulation Materials

DeepMaterial imapereka ma capillary flow underfill atsopano a flip chip, CSP ndi BGA zida. DeepMaterial's new capillary flow flow underfills ndi madzi otsika kwambiri, oyeretsedwa kwambiri, opangidwa ndi chigawo chimodzi cha zinthu zomwe zimapanga yunifolomu, zopanda kanthu zosadzaza zosanjikiza zomwe zimapangitsa kudalirika ndi makina a zigawo zikuluzikulu pochotsa kupsinjika komwe kumachitika chifukwa cha solder. DeepMaterial imapereka mawonekedwe odzaza mwachangu magawo abwino kwambiri, kuchiritsa mwachangu, kugwira ntchito kwautali komanso moyo wautali, komanso kusinthikanso. Reworkability imapulumutsa ndalama polola kuchotsedwa kwa underfill kuti agwiritsenso ntchito bolodi.

Flip chip msonkhano umafunikira kupsinjika kwa msoko wowotchereranso kuti ukalamba wotentha komanso moyo wozungulira. Msonkhano wa CSP kapena BGA umafunika kugwiritsa ntchito kudzaza pang'onopang'ono kuti pakhale kukhulupirika kwamakina pagulu panthawi yoyeserera, kugwedezeka kapena kugwa.

DeepMaterial's flip-chip underfills imakhala ndi zodzaza kwambiri kwinaku ikuyendetsa mwachangu m'mabwalo ang'onoang'ono, ndikutha kukhala ndi kutentha kwa magalasi apamwamba komanso modulus yayikulu. Zotsalira zathu za CSP zimapezeka mumitundu yosiyanasiyana yodzaza, zosankhidwa kuti zisinthe kutentha kwa galasi ndi modulus kuti tigwiritse ntchito.

COB encapsulant ingagwiritsidwe ntchito polumikizira mawaya kuti iteteze chilengedwe ndikuwonjezera mphamvu zamakina. Kusindikiza kotchinjiriza kwa tchipisi zomangika ndi waya kumaphatikizapo encapsulation yapamwamba, cofferdam, ndi kudzaza mipata. Zomatira zokhala ndi ntchito yoyenda bwino zimafunikira, chifukwa kuthekera kwawo koyenda kuyenera kuwonetsetsa kuti mawaya atsekedwa, ndipo zomatira sizidzatuluka mu chip, ndikuwonetsetsa kuti zitha kugwiritsidwa ntchito pazowongolera zabwino kwambiri.

Zomatira za DeepMaterial's COB zimatha kukhala zomatira kapena zomata za UV kuchiritsa DeepMaterial's COB zomatira zimatha kuchiritsidwa kutentha kapena kuchiritsidwa ndi UV ndi kudalirika kwambiri komanso kutsika kwamafuta otupa, komanso kutentha kwambiri kwa magalasi ndi ma ion otsika. Zomatira za DeepMaterial's COB zomata zimateteza ma lead ndi ma plumbum, ma chrome ndi silicon wafers kuchokera ku chilengedwe chakunja, kuwonongeka kwamakina ndi dzimbiri.

Zomatira zomata za DeepMaterial COB zimapangidwa ndi epoxy yochiritsa kutentha, acrylic wa UV-curing, kapena silicone chemistries kuti azitha kutsekereza magetsi. Zomatira zomata za DeepMaterial COB zimapereka kukhazikika kwa kutentha kwapamwamba komanso kukana kugwedezeka kwamafuta, zotchingira zamagetsi zamagetsi pamitundu yosiyanasiyana ya kutentha, komanso kuchepa pang'ono, kupsinjika pang'ono, komanso kukana mankhwala mukachiritsidwa.

Deepmaterial ndi yabwino pamwamba madzi structural zomatira zomatira pulasitiki kwa zitsulo ndi galasi wopanga, kupereka sanali conductive epoxy zomatira sealant guluu kwa underfill pcb pakompyuta zigawo zikuluzikulu, semiconductor zomatira kwa msonkhano pakompyuta, otsika kutentha mankhwala bga flip chip underfill pcb epoxy ndondomeko zomatira zomatira zakuthupi ndi zina zotero. pa

DeepMaterial Epoxy Resin Base Chip Pansi Kudzazitsa Ndi Cob Packaging Material Selection Table
Kutentha Kwambiri Kuchiritsa Epoxy Adhesive Product Selection

Zotsatira Zamalonda dzina mankhwala Ntchito yodziwika bwino
Low kutentha kuchiritsa zomatira Chithunzi cha DM-6108

Zomatira zochepetsera kutentha, zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo memori khadi, msonkhano wa CCD kapena CMOS. Izi ndizoyenera kuchiritsa kutentha pang'ono ndipo zimatha kumamatira bwino kuzinthu zosiyanasiyana munthawi yochepa. Ntchito zodziwika bwino zimaphatikizapo makhadi okumbukira, zida za CCD/CMOS. Ndizoyenera makamaka nthawi zomwe chinthu chopanda kutentha chiyenera kuchiritsidwa pa kutentha kochepa.
Chithunzi cha DM-6109

Ndi gawo limodzi lotentha lochiritsa epoxy resin. Izi ndizoyenera kuchiritsa kutentha kwapang'onopang'ono ndipo zimamatira bwino kuzinthu zosiyanasiyana munthawi yochepa kwambiri. Ntchito zodziwika bwino zimaphatikizapo memori khadi, msonkhano wa CCD/CMOS. Ndizoyenera makamaka kwa ntchito zomwe kutentha kochepa kumachiritsira kumafunika pazigawo zomwe sizimva kutentha.
Chithunzi cha DM-6120

Zomatira zochiritsira zotsika kutentha, zomwe zimagwiritsidwa ntchito pagulu la module la LCD backlight.
Chithunzi cha DM-6180

Kuchiritsa mwachangu pa kutentha kochepa, komwe kumagwiritsidwa ntchito popanga zida za CCD kapena CMOS ndi ma mota a VCM. Izi zimapangidwira makamaka kuti zisamatenthedwe ndi kutentha zomwe zimafuna kuchiritsidwa ndi kutentha kochepa. Itha kupatsa makasitomala mwachangu mapulogalamu apamwamba, monga kuyika ma lens owunikira ku ma LED, ndikuphatikiza zida zowonera zithunzi (kuphatikiza ma module a kamera). Nkhaniyi ndi yoyera kuti iwonetsere kwambiri.

Encapsulation Epoxy Product Selection

Mzere wogulitsa Zotsatira Zamalonda Name mankhwala Mtundu Kukhuthala kofananira (cps) Nthawi yoyamba yokonza / kukonza kwathunthu Njira yochiritsa TG/°C Kulimba /D Sungani/°C/M
Zolemba Encapsulation Adhesive Chithunzi cha DM-6216 Black 58000-62000 150 ° C 20min Kuchiritsa kutentha 126 86 2-8/6M
Chithunzi cha DM-6261 Black 32500-50000 140°C 3H Kuchiritsa kutentha 125 * 2-8/6M
Chithunzi cha DM-6258 Black 50000 120 ° C 12min Kuchiritsa kutentha 140 90 -40/6M
Chithunzi cha DM-6286 Black 62500 120°C 30min1 150°C 15min Kuchiritsa kutentha 137 90 2-8/6M

Kusankhidwa kwa Zogulitsa za Epoxy

Zotsatira Zamalonda dzina mankhwala Ntchito yodziwika bwino
Kudzaza pansi Chithunzi cha DM-6307 Ndi gawo limodzi, thermosetting epoxy resin. Ndi CSP (FBGA) yogwiritsidwanso ntchito kapena BGA filler yomwe imagwiritsidwa ntchito kuteteza ma solder kupsinjika kwamakina pazida zamagetsi zam'manja.
Chithunzi cha DM-6303 Chigawo chimodzi chomatira cha epoxy resin ndi utomoni wodzaza womwe ungagwiritsidwenso ntchito mu CSP (FBGA) kapena BGA. Amachiritsa mwamsanga akangotenthedwa. Zapangidwa kuti zipereke chitetezo chabwino kuti chiteteze kulephera chifukwa cha kupsinjika kwamakina. Low mamasukidwe akayendedwe amalola kudzaza mipata pansi CSP kapena BGA.
Chithunzi cha DM-6309 Ndi machiritso othamanga, othamanga kwambiri amadzimadzi a epoxy opangidwira mapaketi a kukula kwa capillary flow flowing chip, ndikuwongolera kuthamanga kwapang'onopang'ono ndikupanga kapangidwe kake ka rheological, kulola kuti lilowetse chilolezo cha 25μm, kuchepetsa kupsinjika komwe kumapangitsa, kuwongolera magwiridwe antchito apanjinga, ndi kwambiri kukana mankhwala.
Mtengo wa DM-6308 Classic underfill, ultra-low viscosity oyenera ntchito zambiri underfill.
Chithunzi cha DM-6310 The reusable epoxy primer idapangidwira CSP ndi BGA application. Ikhoza kuchiritsidwa mwamsanga pa kutentha kwapakati kuti muchepetse kupanikizika kwa mbali zina. Pambuyo kuchiritsa, zinthuzo zimakhala ndi zida zabwino kwambiri zamakina ndipo zimatha kuteteza zolumikizira za solder panthawi yotentha.
Chithunzi cha DM-6320 The underfill reusable anapangidwira mwapadera CSP, WLCSP ndi BGA ntchito. Njira yake ndi yochiza mwamsanga pa kutentha kwapakati kuti muchepetse kupsinjika kwa mbali zina. Zomwe zili ndi kutentha kwa galasi lokwera kwambiri komanso kulimba kwapang'onopang'ono, ndipo zimatha kupereka chitetezo chabwino pamalumikizidwe a solder panthawi yanjinga yotentha.

DeepMaterial Epoxy Based Chip Underfill Ndi COB Packaging Material Data Sheet
Kutentha Kwambiri Kuchiritsa Epoxy Adhesive Product Data Sheet

Mzere wogulitsa Zotsatira Zamalonda Name mankhwala Mtundu Kukhuthala kofananira (cps) Nthawi yoyamba yokonza / kukonza kwathunthu Njira yochiritsa TG/°C Kulimba /D Sungani/°C/M
Zolemba Low kutentha kuchiritsa encapsulant Chithunzi cha DM-6108 Black 7000-27000 80 ° C 20min 60 ° C 60min Kuchiritsa kutentha 45 88 -20/6M
Chithunzi cha DM-6109 Black 12000-46000 80 ° C 5-10 min Kuchiritsa kutentha 35 88A -20/6M
Chithunzi cha DM-6120 Black 2500 80 ° C 5-10 min Kuchiritsa kutentha 26 79 -20/6M
Chithunzi cha DM-6180 White 8700 80 ° C 2min Kuchiritsa kutentha 54 80 -40/6M

Mapepala a Epoxy Adhesive Product Data Sheet

Mzere wogulitsa Zotsatira Zamalonda Name mankhwala Mtundu Kukhuthala kofananira (cps) Nthawi yoyamba yokonza / kukonza kwathunthu Njira yochiritsa TG/°C Kulimba /D Sungani/°C/M
Zolemba Encapsulation Adhesive Chithunzi cha DM-6216 Black 58000-62000 150 ° C 20min Kuchiritsa kutentha 126 86 2-8/6M
Chithunzi cha DM-6261 Black 32500-50000 140°C 3H Kuchiritsa kutentha 125 * 2-8/6M
Chithunzi cha DM-6258 Black 50000 120 ° C 12min Kuchiritsa kutentha 140 90 -40/6M
Chithunzi cha DM-6286 Black 62500 120°C 30min1 150°C 15min Kuchiritsa kutentha 137 90 2-8/6M

Lembani Mapepala a Epoxy Adhesive Product Data

Mzere wogulitsa Zotsatira Zamalonda Name mankhwala Mtundu Kukhuthala kofananira (cps) Nthawi yoyamba yokonza / kukonza kwathunthu Njira yochiritsa TG/°C Kulimba /D Sungani/°C/M
Zolemba Kudzaza pansi Chithunzi cha DM-6307 Black 2000-4500 120 ° C 5min 100 ° C 10min Kuchiritsa kutentha 85 88 2-8/6M
Chithunzi cha DM-6303 Madzi achikasu owoneka bwino 3000-6000 100°C 30min 120°C 15min 150°C 10min Kuchiritsa kutentha 69 86 2-8/6M
Chithunzi cha DM-6309 Madzi akuda 3500-7000 165 ° C 3min 150 ° C 5min Kuchiritsa kutentha 110 88 2-8/6M
Chithunzi cha DM-6308 Madzi akuda 360 130 ° C 8min 150 ° C 5min Kuchiritsa kutentha 113 * -20/6M
Chithunzi cha DM-6310 Madzi akuda 394 130 ° C 8min Kuchiritsa kutentha 102 * -20/6M
Chithunzi cha DM-6320 Madzi akuda 340 130°C 10min 150°C 5min 160°C 3min Kuchiritsa kutentha 134 * -20/6M