
glue wothandizira pazopanga zamagetsi.
Epoxy-Based Chip Underfill And COB Encapsulation Materials

DeepMaterial imapereka ma capillary flow underfill atsopano a flip chip, CSP ndi BGA zida. DeepMaterial's new capillary flow flow underfills ndi madzi otsika kwambiri, oyeretsedwa kwambiri, opangidwa ndi chigawo chimodzi cha zinthu zomwe zimapanga yunifolomu, zopanda kanthu zosadzaza zosanjikiza zomwe zimapangitsa kudalirika ndi makina a zigawo zikuluzikulu pochotsa kupsinjika komwe kumachitika chifukwa cha solder. DeepMaterial imapereka mawonekedwe odzaza mwachangu magawo abwino kwambiri, kuchiritsa mwachangu, kugwira ntchito kwautali komanso moyo wautali, komanso kusinthikanso. Reworkability imapulumutsa ndalama polola kuchotsedwa kwa underfill kuti agwiritsenso ntchito bolodi.
Flip chip msonkhano umafunikira kupsinjika kwa msoko wowotchereranso kuti ukalamba wotentha komanso moyo wozungulira. Msonkhano wa CSP kapena BGA umafunika kugwiritsa ntchito kudzaza pang'onopang'ono kuti pakhale kukhulupirika kwamakina pagulu panthawi yoyeserera, kugwedezeka kapena kugwa.
DeepMaterial's flip-chip underfills imakhala ndi zodzaza kwambiri kwinaku ikuyendetsa mwachangu m'mabwalo ang'onoang'ono, ndikutha kukhala ndi kutentha kwa magalasi apamwamba komanso modulus yayikulu. Zotsalira zathu za CSP zimapezeka mumitundu yosiyanasiyana yodzaza, zosankhidwa kuti zisinthe kutentha kwa galasi ndi modulus kuti tigwiritse ntchito.
COB encapsulant ingagwiritsidwe ntchito polumikizira mawaya kuti iteteze chilengedwe ndikuwonjezera mphamvu zamakina. Kusindikiza kotchinjiriza kwa tchipisi zomangika ndi waya kumaphatikizapo encapsulation yapamwamba, cofferdam, ndi kudzaza mipata. Zomatira zokhala ndi ntchito yoyenda bwino zimafunikira, chifukwa kuthekera kwawo koyenda kuyenera kuwonetsetsa kuti mawaya atsekedwa, ndipo zomatira sizidzatuluka mu chip, ndikuwonetsetsa kuti zitha kugwiritsidwa ntchito pazowongolera zabwino kwambiri.
Zomatira za DeepMaterial's COB zimatha kukhala zomatira kapena zomata za UV kuchiritsa DeepMaterial's COB zomatira zimatha kuchiritsidwa kutentha kapena kuchiritsidwa ndi UV ndi kudalirika kwambiri komanso kutsika kwamafuta otupa, komanso kutentha kwambiri kwa magalasi ndi ma ion otsika. Zomatira za DeepMaterial's COB zomata zimateteza ma lead ndi ma plumbum, ma chrome ndi silicon wafers kuchokera ku chilengedwe chakunja, kuwonongeka kwamakina ndi dzimbiri.
Zomatira zomata za DeepMaterial COB zimapangidwa ndi epoxy yochiritsa kutentha, acrylic wa UV-curing, kapena silicone chemistries kuti azitha kutsekereza magetsi. Zomatira zomata za DeepMaterial COB zimapereka kukhazikika kwa kutentha kwapamwamba komanso kukana kugwedezeka kwamafuta, zotchingira zamagetsi zamagetsi pamitundu yosiyanasiyana ya kutentha, komanso kuchepa pang'ono, kupsinjika pang'ono, komanso kukana mankhwala mukachiritsidwa.
Deepmaterial ndi yabwino pamwamba madzi structural zomatira zomatira pulasitiki kwa zitsulo ndi galasi wopanga, kupereka sanali conductive epoxy zomatira sealant guluu kwa underfill pcb pakompyuta zigawo zikuluzikulu, semiconductor zomatira kwa msonkhano pakompyuta, otsika kutentha mankhwala bga flip chip underfill pcb epoxy ndondomeko zomatira zomatira zakuthupi ndi zina zotero. pa


DeepMaterial Epoxy Resin Base Chip Pansi Kudzazitsa Ndi Cob Packaging Material Selection Table
Kutentha Kwambiri Kuchiritsa Epoxy Adhesive Product Selection
Zotsatira Zamalonda | dzina mankhwala | Ntchito yodziwika bwino |
Low kutentha kuchiritsa zomatira | Chithunzi cha DM-6108 |
Zomatira zochepetsera kutentha, zomwe zimagwiritsidwa ntchito nthawi zambiri zimaphatikizapo memori khadi, msonkhano wa CCD kapena CMOS. Izi ndizoyenera kuchiritsa kutentha pang'ono ndipo zimatha kumamatira bwino kuzinthu zosiyanasiyana munthawi yochepa. Ntchito zodziwika bwino zimaphatikizapo makhadi okumbukira, zida za CCD/CMOS. Ndizoyenera makamaka nthawi zomwe chinthu chopanda kutentha chiyenera kuchiritsidwa pa kutentha kochepa. |
Chithunzi cha DM-6109 |
Ndi gawo limodzi lotentha lochiritsa epoxy resin. Izi ndizoyenera kuchiritsa kutentha kwapang'onopang'ono ndipo zimamatira bwino kuzinthu zosiyanasiyana munthawi yochepa kwambiri. Ntchito zodziwika bwino zimaphatikizapo memori khadi, msonkhano wa CCD/CMOS. Ndizoyenera makamaka kwa ntchito zomwe kutentha kochepa kumachiritsira kumafunika pazigawo zomwe sizimva kutentha. |
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Chithunzi cha DM-6120 |
Zomatira zochiritsira zotsika kutentha, zomwe zimagwiritsidwa ntchito pagulu la module la LCD backlight. |
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Chithunzi cha DM-6180 |
Kuchiritsa mwachangu pa kutentha kochepa, komwe kumagwiritsidwa ntchito popanga zida za CCD kapena CMOS ndi ma mota a VCM. Izi zimapangidwira makamaka kuti zisamatenthedwe ndi kutentha zomwe zimafuna kuchiritsidwa ndi kutentha kochepa. Itha kupatsa makasitomala mwachangu mapulogalamu apamwamba, monga kuyika ma lens owunikira ku ma LED, ndikuphatikiza zida zowonera zithunzi (kuphatikiza ma module a kamera). Nkhaniyi ndi yoyera kuti iwonetsere kwambiri. |
Encapsulation Epoxy Product Selection
Mzere wogulitsa | Zotsatira Zamalonda | Name mankhwala | Mtundu | Kukhuthala kofananira (cps) | Nthawi yoyamba yokonza / kukonza kwathunthu | Njira yochiritsa | TG/°C | Kulimba /D | Sungani/°C/M |
Zolemba | Encapsulation Adhesive | Chithunzi cha DM-6216 | Black | 58000-62000 | 150 ° C 20min | Kuchiritsa kutentha | 126 | 86 | 2-8/6M |
Chithunzi cha DM-6261 | Black | 32500-50000 | 140°C 3H | Kuchiritsa kutentha | 125 | * | 2-8/6M | ||
Chithunzi cha DM-6258 | Black | 50000 | 120 ° C 12min | Kuchiritsa kutentha | 140 | 90 | -40/6M | ||
Chithunzi cha DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Kuchiritsa kutentha | 137 | 90 | 2-8/6M |
Kusankhidwa kwa Zogulitsa za Epoxy
Zotsatira Zamalonda | dzina mankhwala | Ntchito yodziwika bwino |
Kudzaza pansi | Chithunzi cha DM-6307 | Ndi gawo limodzi, thermosetting epoxy resin. Ndi CSP (FBGA) yogwiritsidwanso ntchito kapena BGA filler yomwe imagwiritsidwa ntchito kuteteza ma solder kupsinjika kwamakina pazida zamagetsi zam'manja. |
Chithunzi cha DM-6303 | Chigawo chimodzi chomatira cha epoxy resin ndi utomoni wodzaza womwe ungagwiritsidwenso ntchito mu CSP (FBGA) kapena BGA. Amachiritsa mwamsanga akangotenthedwa. Zapangidwa kuti zipereke chitetezo chabwino kuti chiteteze kulephera chifukwa cha kupsinjika kwamakina. Low mamasukidwe akayendedwe amalola kudzaza mipata pansi CSP kapena BGA. | |
Chithunzi cha DM-6309 | Ndi machiritso othamanga, othamanga kwambiri amadzimadzi a epoxy opangidwira mapaketi a kukula kwa capillary flow flowing chip, ndikuwongolera kuthamanga kwapang'onopang'ono ndikupanga kapangidwe kake ka rheological, kulola kuti lilowetse chilolezo cha 25μm, kuchepetsa kupsinjika komwe kumapangitsa, kuwongolera magwiridwe antchito apanjinga, ndi kwambiri kukana mankhwala. | |
Mtengo wa DM-6308 | Classic underfill, ultra-low viscosity oyenera ntchito zambiri underfill. | |
Chithunzi cha DM-6310 | The reusable epoxy primer idapangidwira CSP ndi BGA application. Ikhoza kuchiritsidwa mwamsanga pa kutentha kwapakati kuti muchepetse kupanikizika kwa mbali zina. Pambuyo kuchiritsa, zinthuzo zimakhala ndi zida zabwino kwambiri zamakina ndipo zimatha kuteteza zolumikizira za solder panthawi yotentha. | |
Chithunzi cha DM-6320 | The underfill reusable anapangidwira mwapadera CSP, WLCSP ndi BGA ntchito. Njira yake ndi yochiza mwamsanga pa kutentha kwapakati kuti muchepetse kupsinjika kwa mbali zina. Zomwe zili ndi kutentha kwa galasi lokwera kwambiri komanso kulimba kwapang'onopang'ono, ndipo zimatha kupereka chitetezo chabwino pamalumikizidwe a solder panthawi yanjinga yotentha. |
DeepMaterial Epoxy Based Chip Underfill Ndi COB Packaging Material Data Sheet
Kutentha Kwambiri Kuchiritsa Epoxy Adhesive Product Data Sheet
Mzere wogulitsa | Zotsatira Zamalonda | Name mankhwala | Mtundu | Kukhuthala kofananira (cps) | Nthawi yoyamba yokonza / kukonza kwathunthu | Njira yochiritsa | TG/°C | Kulimba /D | Sungani/°C/M |
Zolemba | Low kutentha kuchiritsa encapsulant | Chithunzi cha DM-6108 | Black | 7000-27000 | 80 ° C 20min 60 ° C 60min | Kuchiritsa kutentha | 45 | 88 | -20/6M |
Chithunzi cha DM-6109 | Black | 12000-46000 | 80 ° C 5-10 min | Kuchiritsa kutentha | 35 | 88A | -20/6M | ||
Chithunzi cha DM-6120 | Black | 2500 | 80 ° C 5-10 min | Kuchiritsa kutentha | 26 | 79 | -20/6M | ||
Chithunzi cha DM-6180 | White | 8700 | 80 ° C 2min | Kuchiritsa kutentha | 54 | 80 | -40/6M |
Mapepala a Epoxy Adhesive Product Data Sheet
Mzere wogulitsa | Zotsatira Zamalonda | Name mankhwala | Mtundu | Kukhuthala kofananira (cps) | Nthawi yoyamba yokonza / kukonza kwathunthu | Njira yochiritsa | TG/°C | Kulimba /D | Sungani/°C/M |
Zolemba | Encapsulation Adhesive | Chithunzi cha DM-6216 | Black | 58000-62000 | 150 ° C 20min | Kuchiritsa kutentha | 126 | 86 | 2-8/6M |
Chithunzi cha DM-6261 | Black | 32500-50000 | 140°C 3H | Kuchiritsa kutentha | 125 | * | 2-8/6M | ||
Chithunzi cha DM-6258 | Black | 50000 | 120 ° C 12min | Kuchiritsa kutentha | 140 | 90 | -40/6M | ||
Chithunzi cha DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Kuchiritsa kutentha | 137 | 90 | 2-8/6M |
Lembani Mapepala a Epoxy Adhesive Product Data
Mzere wogulitsa | Zotsatira Zamalonda | Name mankhwala | Mtundu | Kukhuthala kofananira (cps) | Nthawi yoyamba yokonza / kukonza kwathunthu | Njira yochiritsa | TG/°C | Kulimba /D | Sungani/°C/M |
Zolemba | Kudzaza pansi | Chithunzi cha DM-6307 | Black | 2000-4500 | 120 ° C 5min 100 ° C 10min | Kuchiritsa kutentha | 85 | 88 | 2-8/6M |
Chithunzi cha DM-6303 | Madzi achikasu owoneka bwino | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Kuchiritsa kutentha | 69 | 86 | 2-8/6M | ||
Chithunzi cha DM-6309 | Madzi akuda | 3500-7000 | 165 ° C 3min 150 ° C 5min | Kuchiritsa kutentha | 110 | 88 | 2-8/6M | ||
Chithunzi cha DM-6308 | Madzi akuda | 360 | 130 ° C 8min 150 ° C 5min | Kuchiritsa kutentha | 113 | * | -20/6M | ||
Chithunzi cha DM-6310 | Madzi akuda | 394 | 130 ° C 8min | Kuchiritsa kutentha | 102 | * | -20/6M | ||
Chithunzi cha DM-6320 | Madzi akuda | 340 | 130°C 10min 150°C 5min 160°C 3min | Kuchiritsa kutentha | 134 | * | -20/6M |