Chip Underfill / Packaging
Chip Manufacturing Process Kugwiritsa Ntchito Zomatira za DeepMaterial
Semiconductor Packaging
Tekinoloje ya semiconductor, makamaka kuyika kwa zida za semiconductor, sinakhudzepo ntchito zambiri kuposa masiku ano. Pamene mbali zonse za moyo watsiku ndi tsiku zikuchulukirachulukira, kuyambira pamagalimoto kupita kuchitetezo chanyumba kupita ku mafoni a m'manja ndi zida za 5G - zopangira zopangira ma semiconductor zili pamtima pamphamvu zomvera, zodalirika, komanso zamphamvu zamagetsi.
Zowonda zowonda, miyeso yaying'ono, mazenera abwino kwambiri, kuphatikiza phukusi, kapangidwe ka 3D, matekinoloje ophatikizika ndi chuma chambiri pakupanga zinthu zambiri zimafunikira zida zomwe zingathandizire zokhumba zaukadaulo. Mayankho athunthu a Henkel amathandizira chuma chambiri padziko lonse lapansi kuti apereke ukadaulo wapamwamba kwambiri wapackaging semiconductor komanso magwiridwe antchito okwera mtengo. Kuchokera pa zomatira zomata zomata zomangira zachikhalidwe zamawaya mpaka zodzaza ndi ma encapsulants opangira ma CD apamwamba kwambiri, Henkel imapereka ukadaulo wazinthu zamakono komanso chithandizo chapadziko lonse lapansi chofunikira ndi makampani otsogola a microelectronics.
Flip Chip Underfill
Kudzaza pansi kumagwiritsidwa ntchito pokhazikika pamakina a flip chip. Izi ndi zofunika makamaka pamene soldering mpira gululi array (BGA) tchipisi. Kuti muchepetse kuchuluka kwa kuchuluka kwamafuta (CTE), zomatirazo zimadzazidwa pang'ono ndi nanofillers.
Zomatira zomwe zimagwiritsidwa ntchito ngati chip underfill zimakhala ndi capillary flow flow kuti zigwiritsidwe mwachangu komanso zosavuta. Zomatira zochiritsira zapawiri zimagwiritsidwa ntchito: madera am'mphepete amasungidwa ndi kuchiritsa kwa UV malo omwe ali ndi mithunzi asanachiritsidwe ndi thermally.
Deepmaterial ndi otsika kutentha mankhwala bga flip Chip underfill pcb epoxy ndondomeko zomatira zakuthupi wopanga ndi kutentha zosagwira underfill ❖ kuyatira zinthu suppliers, kupereka chigawo chimodzi epoxy underfill mankhwala, epoxy underfill encapsulant, underfill encapsulation zipangizo flip chip mu pcpoxy electronic circuit board zochokera Chip underfill ndi chisononkho encapsulation zipangizo ndi zina zotero.
