Mlandu Ku USA: American Partner's Chip Underfill Solution
Monga dziko laukadaulo wapamwamba, pali makampani ambiri a zida za BGA, CSP kapena Flip Chip ku USA, kotero zomatira zocheperako zikufunika kwambiri.
M'modzi mwamakasitomala athu ochokera kumakampani apamwamba kwambiri aku USA, amagwiritsa ntchito njira ya DeepMaterial underfill pakudzaza kwa chip, ndipo imagwira ntchito bwino.
DeepMaterial imapereka zida zogwirira ntchito kwambiri za Sintering and Die Attach, Surface Mount, ndi ntchito za Wave Soldering. Kukula kwazinthu kumaphatikizapo Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills ndi Edgebond, Soldering Alloys, Liquid Soldering Flux, Cord Wire, Surface Mount Adhesives, Electronic Cleaners, ndi Stencils.
DeepMaterial Chip Underfill Adhesive mndandanda ndi chigawo chimodzi, zipangizo zochiritsira kutentha. Zipangizo zakonzedwa kuti capillary underfill ndi reworkability. Zida za epoxy izi zitha kuperekedwa m'mphepete mwa zida za BGA, CSP kapena Flip Chip. Nkhaniyi idzayenda ndikudzaza malo omwe ali pansi pa zigawozi.
Monga momwe zilili ndi gawo limodzi la capillary underfill lomwe limapangidwira kuteteza mapaketi a chip omwe amasonkhanitsidwa pama board osindikizidwa.
Ndi kutentha kwa magalasi apamwamba kwambiri [Tg] komanso kukulitsa kwamafuta ocheperako [CTE] kumachepera. Zinthu izi zimabweretsa yankho lodalirika kwambiri.
Zambiri Zamalonda
· Amapereka kuphimba kwathunthu pamene aperekedwa pa gawo lapansi lotenthedwa pa 70 - 100 ° C
· Makhalidwe apamwamba a Tg ndi Low CTE amawongolera kwambiri kuthekera kopambana muyeso wovuta kwambiri wa Thermal Cycling Test
· Kuchita bwino kwambiri kwa Thermal Cycling Test
Zopanda halogen ndipo zimagwirizana ndi RoHS Directive 2015/863/EU
Underfill Chifukwa Chapadera Kutentha Kutopa Kukana
Imani nokha SAC solder joints mu BGA ndi CSP misonkhano amakonda kufooka mu thermally nkhanza magalimoto ntchito. High Tg ndi low CTE underfill [UF] ndi njira yolimbikitsira. Popeza kukonzanso sikofunikira, izi zimalola kuti zodzaza zambiri muzapangidwe zikhazikitse izi.
DeepMaterial Chip Underfill Adhesive series ili ndi Tg yapamwamba ya 165 ° C ndi CTE1 / CTE2 yotsika ya 31 ppm / 105 ppm, yosonkhanitsidwa ndipo yayesedwa kuti idutse maulendo a 5000 -40 + 125 ° C mayeso oyendetsa njinga otentha. Kuti muwongolere bwino, tenthetsani magawowo popereka.
Tikuyang'ananso mgwirizano wazinthu zomatira za DeepMaterial padziko lonse lapansi, ngati mukufuna kukhala wothandizira wa DeepMaterial's:
Industrial zomatira zomatira ogulitsa ku America,
Industrial zomatira zomatira ogulitsa ku Europe,
Industrial zomatira zomatira ku UK,
Industrial zomatira zomatira ku India,
Industrial zomatira zomatira ku Australia,
Industrial zomatira zomatira ku Canada,
Industrial zomatira zomatira ku South Africa,
Wogulitsa zomatira ku mafakitale ku Japan,
Industrial zomatira zomatira ogulitsa ku Europe,
Industrial zomatira zomatira ogulitsa ku Korea,
Wogulitsa zomatira ku mafakitale ku Malaysia,
Wogulitsa zomatira ku mafakitale ku Philippines,
Wothandizira zomatira ku mafakitale ku Vietnam,
Wogulitsa zomatira ku mafakitale ku Indonesia,
Industrial zomatira zomatira ogulitsa ku Russia,
Industrial zomatira zomatira katundu ku Turkey,
......
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