Industrial Adhesive Glue Global Cases

DeepMaterial ipanga tsogolo labwino kudzera mu chemistry ndi othandizana nawo padziko lonse lapansi
Kugwiritsa ntchito mphamvu zama chemistry ndi ukadaulo, kumbuyo kuti mupange china chatsopano. Timagwiritsa ntchito ukadaulo wathu wopeza kuti tipange zinthu zapadera padziko lonse lapansi monga ma epoxy resins apadera komanso ma polima a acrylic.
Timapereka zinthu zambiri zomwe zimathandizira zatsopano pogwiritsa ntchito ukadaulo wapamwamba wopangira zomwe zimapindula kwambiri ndi zida. Timapereka mayankho kwa makasitomala athu mwachangu komanso pakufunika pogwiritsa ntchito luso la fermentation lomwe tapanga kwazaka zambiri komanso laibulale yathu yayikulu yama enzymes a actinomycete.
DeepMaterial ndi polyurethane reactive PUR otentha kusungunula kuthamanga tcheru zomatira wopanga ndi katundu, kupanga chigawo chimodzi epoxy underfill zomatira, otentha kusungunula zomatira, UV kuchiritsa zomatira, mkulu refractive index kuwala zomatira, zomatira maginito zomata, zomatira zabwino kwambiri zomatira madzi pulasitiki. ndi magalasi, zomatira zamagetsi zamagetsi zamagalimoto amagetsi ndi ma motors ang'onoang'ono pazida zapakhomo
DeepMaterial ndi yabwino pamwamba madzi structural zomatira zomatira pulasitiki kwa zitsulo ndi galasi wopanga, kupereka non conductive epoxy zomatira sealant guluu kwa underfill pcb zipangizo zamagetsi, semiconductor zomatira kwa magetsi msonkhano, otsika kutentha mankhwala bga flip chip underfill pcb epoxy ndondomeko zomatira zomatira zakuthupi ndi zina zotero. pa
American Partner's Chip Underfill Solution
Ubwino Wa DeepMaterial UV Curable System
Mangani Zamphamvu, Zopepuka Zokhala Ndi Zomatira Zozama Kwambiri
Zomatira za DeepMaterial Kwa Magalimoto a Magnetic Bonding
Mini Vibration Motor Mounting Adhesive Glue
Kugwiritsa ntchito PCB Adhesive Glue Pa Electronics
Njira Yosavuta Yopangira Ma Inductors
Zomatira Zopanga Laputopu & Mapiritsi
Zomatira Zatsopano ndi Zosindikizira Zimathandizira Kukumana ndi Zovuta Zamsonkhano Wamagetsi
Zomatira za Smart Phone ndi Mobile Devices Assembly