Semiconductor Packaging & Testing UV Viscosity Reduction Special Film

Productum PO utitur ut materiae superficialis tutelae, praesertim pro QFN incisione, SMD microphonii substrati sectione, FR4 substrato secante (LED).

Description

Product Specification posuere tristique

Model Product Product Type Crassitudo Cortices Force Ante UV Peel Force post UV
DM-208A PO+UV convertendi reductionem 170μm 800gf/25mm 15gf/25mm
DM-208B PO+UV convertendi reductionem 170μm 1200gf/25mm 20gf/25mm
DM-208C PO+UV convertendi reductionem 170μm 1500gf/25mm 30gf/25mm