Epoxy ngwungwu BGA
Mmiri dị elu
Ọcha Dị Ọcha
nsogbu
Ngwaahịa elektrọnik nke ikuku na igodo, ụgbọ ala, ụgbọ ala, ọkụ ọkụ n'èzí, ike anyanwụ na ụlọ ọrụ ndị agha nwere ihe ntụkwasị obi dị elu, ngwaọrụ bọọlụ solder (BGA / CSP / WLP / POP) na ngwaọrụ pụrụ iche na bọọdụ sekit niile na-eche microelectronics ihu. The omume nke miniaturization, na mkpa PCBs na a ọkpụrụkpụ nke na-erughị 1.0mm ma ọ bụ mgbanwe elu-njupụta mgbakọ substrates, solder nkwonkwo n'etiti ngwaọrụ na substrates na-aghọ na-emebi emebi n'okpuru n'ibu na thermal nrụgide.
Solutions
Maka nkwakọ ngwaahịa BGA, DeepMaterial na-enye usoro ngwucha usoro - ihe ọhụrụ capillary eruba underfill. A na-ekesa ihe mkpuchi ahụ ma tinye ya na nsọtụ ngwaọrụ ahụ gbakọtara, a na-eji "mmetụta capillary" nke mmiri mmiri ahụ mee ka gluu banye ma jupụta ala nke mgbawa ahụ, wee kpoo ọkụ iji jikọta ihe nkpuchi na mgbawa mgbawa, solder nkwonkwo na PCB mkpụrụ.
Uru usoro njuputa DeepMaterial
1. Mmiri mmiri dị elu, ịdị ọcha dị elu, otu akụkụ, ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa ngwa nke ngwa ngwa dị oke mma;
2. Ọ nwere ike ịmepụta akwa akwa akwa akwa akwa na-enweghị ihe na-enweghị ihe ọ bụla, nke nwere ike iwepụ nrụgide nke ihe ịgbado ọkụ na-akpata, melite ntụkwasị obi na ihe eji arụ ọrụ nke ihe ndị ahụ, ma na-enye nchebe dị mma maka ngwaahịa site na ịdaba, ntụgharị, vibration, mmiri mmiri. , wdg.
3. Enwere ike ịrụzi usoro ahụ, a pụkwara iji bọọdụ sekit mee ihe, nke na-echekwa ego dị ukwuu.
Deepmaterial bụ obere okpomọkụ ọgwụgwọ bga flip mgbawa underfill pcb epoxy usoro nrapado gluu ihe emeputa na okpomọkụ na-eguzogide underfill mkpuchi ihe suppliers, na-enye otu akụrụngwa epoxy underfill ogige, epoxy underfill encapsulant, underfill encapsulation ihe maka tụgharịa mgbawa na pcb electronic circuit osisi, epoxy- dabere mgbawa underfill na cob encapsulation ihe na na.
