onye na-enye gluu maka mmepụta elektrọnik.
Ihe mkpuchi mgbawa dabere na Epoxy yana ihe mkpuchi COB
DeepMaterial na-enye ihe njupụta nke capillary ọhụrụ maka mgbape, CSP na ngwaọrụ BGA. DeepMaterial ọhụrụ capillary eruba n'okpuru na-ejuputa bụ mmiri dị elu, ịdị ọcha dị elu, ihe nwere otu akụkụ nke na-etolite otu, akwa akwa na-enweghị ihe na-eme ka ọ dịkwuo mma ntụkwasị obi na akụrụngwa akụrụngwa nke akụrụngwa site na iwepu nrụgide sitere na ihe na-ere ahịa. DeepMaterial na-enye usoro maka imeju ngwa ngwa nke akụkụ dị mma nke ukwuu, ike ọgwụgwọ ngwa ngwa, ogologo ọrụ na ogologo ndụ, yana arụkwa ọrụ. Reworkability na-azọpụta ụgwọ site n'ikwe ka mwepụ nke underfill maka ojiji nke osisi.
Mgbakọ mgbawa na-achọ enyemaka mgbakasị ahụ nke eriri ịgbado ọkụ ọzọ maka ogologo ịka nká na ndụ okirikiri. Mgbakọ CSP ma ọ bụ BGA chọrọ iji ihe eji eme ihe na-eme ka ọ dịkwuo mma n'ezi ihe n'ike nke mgbakọ n'oge ule mgbanwe, ịma jijiji ma ọ bụ dobe.
DeepMaterial's flip-chip underfills nwere ọdịnaya njupụta dị elu ka ọ na-ejigide ọsọ ọsọ na obere olulu, na-enwe ike inwe okpomọkụ mgbanwe iko dị elu na modul dị elu. Ihe mkpuchi CSP anyị dị na ọkwa dị iche iche, ahọpụtara maka ọnọdụ mgbanwe iko na modul maka ngwa ezubere.
Enwere ike iji COB encapsulant maka njikọ waya iji nye nchebe gburugburu ebe obibi na ịbawanye ike igwe. Ihe mkpuchi mkpuchi nke ibe ejikọtara waya gụnyere mkpuchi elu, cofferdam, na ndochi oghere. A chọrọ nrapado nwere ọrụ nhazi nke ọma, n'ihi na ike ịgbasa ha ga-ahụrịrị na wires ndị ahụ kpuchiri ekpuchi, na nrapado agaghị esi na mgbawa ahụ pụta, wee hụ na enwere ike iji ya mee ihe dị mma.
DeepMaterial's COB encapsulating adhesives nwere ike ịbụ thermally ma ọ bụ UV gwọrọ DeepMaterial's COB encapsulation adhesive nwere ike gwọọ ọkụ ma ọ bụ gwọọ UV na ntụkwasị obi dị elu yana ọnụọgụ ọzịza dị ala, yana nnukwu mgbanwe mgbanwe iko na ọdịnaya ion dị ala. DeepMaterial's COB encapsulating adhesives na-echebe ụzọ na plumbum, chrome na silicon wafers site na gburugburu mpụta, mmebi akụrụngwa na corrosion.
A na-eji epoxy na-agwọ ọkụ, UV-curing acrylic, ma ọ bụ silicone chemistries maka ezigbo mkpuchi ọkụ. DeepMaterial COB encapsulating adhesives na-enye ezigbo nkwụsi ike dị elu nke okpomọkụ na nkwụsi ike ọkụ ọkụ, ihe mkpuchi ọkụ eletrik n'elu oke okpomọkụ, na nkwụsịtụ dị ala, nrụgide dị ala, na nguzogide kemịkal mgbe a gwọrọ ya.
Deepmaterial kasị mma n'elu waterproof structural nrapado gluu maka plastic ka metal na iko emeputa, ọkọnọ non conductive epoxy nrapado sealant gluu maka underfill pcb electronic components, semiconductor adhesives maka electronic mgbakọ, ala okpomọkụ ọgwụgwọ bga tụgharịa mgbawa underfill pcb epoxy usoro nrapado gluu ihe na otú na
DeepMaterial Epoxy Resin Base Chip Na-ejuputa na Tebụl Nhọrọ Ihe Ngwa.
Nhọrọ ngwaahịa Epoxy na-edozi ahụ dị ala
| Ngwaahịa | Product aha | Ngwa ahụkarị ngwaahịa |
| Obere okpomọkụ ọgwụgwọ nrapado | DM-6108 |
Nrapado na-agwọta okpomọkụ dị ala, ngwa a na-ahụkarị gụnyere kaadị ebe nchekwa, CCD ma ọ bụ mgbakọ CMOS. Ngwaahịa a dabara adaba maka ọgwụgwọ dị ala ma nwee ike ịnwe mmachi dị mma na ihe dị iche iche n'ime obere oge. Ngwa a na-ahụkarị gụnyere kaadị ebe nchekwa, akụrụngwa CCD/CMOS. Ọ dị mma karịsịa maka oge ndị na-ekpo ọkụ na-ekpo ọkụ chọrọ ka a gwọọ ya na obere okpomọkụ. |
| DM-6109 |
Ọ bụ resin epoxy na-agwọ ọrịa nwere otu akụkụ. Ngwaahịa a dabara adaba maka ọgwụgwọ dị ala ma nwee ezigbo nrapado na ihe dị iche iche n'ime obere oge. Ngwa a na-ahụkarị gụnyere kaadị ebe nchekwa, mgbakọ CCD/CMOS. Ọ kachasị mma maka ngwa ebe a na-achọrọ okpomọkụ ọgwụgwọ dị ala maka ihe ndị nwere mmetụta okpomọkụ. |
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| DM-6120 |
Omuma dị ala na-agwọ nrapado, ejiri maka mgbakọ modul backlight LCD. |
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| DM-6180 |
Ngwọta ngwa ngwa na obere okpomọkụ, ejiri maka mgbakọ nke CCD ma ọ bụ CMOS na moto VCM. Emebere ngwaahịa a maka ngwa na-enwe mmetụta okpomọkụ nke chọrọ ọgwụgwọ dị ala. Ọ nwere ike na-enye ndị ahịa ngwa ngwa ngwa dị elu, dị ka itinye lensị mgbasa ozi ọkụ na LEDs, na ikpokọta ngwa ihe na-ahụ maka onyonyo (gụnyere modul igwefoto). Ihe a na-acha ọcha ka ọ na-enye echiche dị ukwuu. |
Nhọrọ ngwaahịa Epoxy encapsulation
| Ahịa ngwaahịa | Ngwaahịa | Product Name | Agba | Isi viscosity (cps) | Oge nhazi oge mbụ / nhazi zuru oke | Usoro ọgwụgwọ | TG/°C | Isi ike /D | Ụlọ ahịa/°C/M |
| Epoxy dabere | Encapsulation nrapado | DM-6216 | Black | 58000-62000 | 150°C 20 nkeji | Ngwọta okpomọkụ | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Ngwọta okpomọkụ | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120°C 12 nkeji | Ngwọta okpomọkụ | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Ngwọta okpomọkụ | 137 | 90 | 2-8/6M |
Nhọrọ ngwaahịa Epoxy n'okpuru
| Ngwaahịa | Product aha | Ngwa ahụkarị ngwaahịa |
| Ejuju | DM-6307 | Ọ bụ otu ihe mejupụtara, resin epoxy nke na-ekpo ọkụ. Ọ bụ ihe eji emegharị CSP (FBGA) ma ọ bụ BGA filler ejiri kpuchido nkwonkwo solder site na nrụgide igwe na ngwaọrụ eletrọnịkị ejiri aka. |
| DM-6303 | Otu ihe mejupụtara epoxy resin nrapado bụ resin na-ejuputa nke enwere ike ijikwa ya na CSP (FBGA) ma ọ bụ BGA. Ọ na-agwọ ngwa ngwa ozugbo ọ dị ọkụ. Emebere ya iji nye nchebe dị mma iji gbochie ọdịda n'ihi nrụgide igwe. Viscosity dị ala na-enye ohere imeju oghere n'okpuru CSP ma ọ bụ BGA. | |
| DM-6309 | Ọ bụ ọgwụgwọ ngwa ngwa, resin epoxy nke na-agba ọsọ ngwa ngwa emebere maka ngwugwu nha nha nke capillary, bụ iji melite ọsọ usoro na mmepụta ma chepụta usoro nhazi ya, mee ka ọ banye n'ime 25μm mkpochapụ, belata nrụgide na-akpata, melite arụmọrụ ịgba ígwè, yana magburu onwe chemical iguzogide. | |
| DM-6308 | Classic underfill, ultra-low viscosity dabara maka ọtụtụ ngwa emeju. | |
| DM-6310 | Emebere epoxy primer maka ngwa CSP na BGA. Enwere ike ịgwọ ya ngwa ngwa na oke okpomọkụ iji belata nrụgide n'akụkụ ndị ọzọ. Mgbe ọgwụgwọ gasịrị, ihe ahụ nwere ihe ndị na-arụ ọrụ nke ọma ma nwee ike ichebe nkwonkwo solder n'oge ịgba ígwè ọkụ. | |
| DM-6320 | Emebere ihe eji emegharị ọzọ maka ngwa CSP, WLCSP na BGA. Usoro ya bụ iji gwọọ ngwa ngwa na oke okpomọkụ iji belata nchekasị n'akụkụ ndị ọzọ. Ngwa ahụ nwere okpomọkụ mgbanwe iko dị elu na ike mgbaji dị elu, ma nwee ike inye nchebe dị mma maka nkwonkwo solder n'oge ịgba ígwè ọkụ. |
DeepMaterial Epoxy Based Chip Underfill yana mpempe akwụkwọ data ngwugwu COB
Mpempe akwụkwọ data ngwaahịa epoxy nrapado dị ala
| Ahịa ngwaahịa | Ngwaahịa | Product Name | Agba | Isi viscosity (cps) | Oge nhazi oge mbụ / nhazi zuru oke | Usoro ọgwụgwọ | TG/°C | Isi ike /D | Ụlọ ahịa/°C/M |
| Epoxy dabere | Obere okpomọkụ ọgwụgwọ encapsulant | DM-6108 | Black | 7000-27000 | 80°C 20min 60°C 60min | Ngwọta okpomọkụ | 45 | 88 | -20/6M |
| DM-6109 | Black | 12000-46000 | 80°C 5-10 nkeji | Ngwọta okpomọkụ | 35 | 88A | -20/6M | ||
| DM-6120 | Black | 2500 | 80°C 5-10 nkeji | Ngwọta okpomọkụ | 26 | 79 | -20/6M | ||
| DM-6180 | White | 8700 | 80°C 2 nkeji | Ngwọta okpomọkụ | 54 | 80 | -40/6M |
Mpempe akwụkwọ data ngwaahịa Epoxy nrapado
| Ahịa ngwaahịa | Ngwaahịa | Product Name | Agba | Isi viscosity (cps) | Oge nhazi oge mbụ / nhazi zuru oke | Usoro ọgwụgwọ | TG/°C | Isi ike /D | Ụlọ ahịa/°C/M |
| Epoxy dabere | Encapsulation nrapado | DM-6216 | Black | 58000-62000 | 150°C 20 nkeji | Ngwọta okpomọkụ | 126 | 86 | 2-8/6M |
| DM-6261 | Black | 32500-50000 | 140°C 3H | Ngwọta okpomọkụ | 125 | * | 2-8/6M | ||
| DM-6258 | Black | 50000 | 120°C 12 nkeji | Ngwọta okpomọkụ | 140 | 90 | -40/6M | ||
| DM-6286 | Black | 62500 | 120°C 30min1 150°C 15min | Ngwọta okpomọkụ | 137 | 90 | 2-8/6M |
Mpempe akwụkwọ data ngwaahịa Epoxy nrapado
| Ahịa ngwaahịa | Ngwaahịa | Product Name | Agba | Isi viscosity (cps) | Oge nhazi oge mbụ / nhazi zuru oke | Usoro ọgwụgwọ | TG/°C | Isi ike /D | Ụlọ ahịa/°C/M |
| Epoxy dabere | Ejuju | DM-6307 | Black | 2000-4500 | 120°C 5min 100°C 10min | Ngwọta okpomọkụ | 85 | 88 | 2-8/6M |
| DM-6303 | Mmiri mmiri na-acha odo odo na-adịghị ahụkebe | 3000-6000 | 100°C 30min 120°C 15min 150°C 10min | Ngwọta okpomọkụ | 69 | 86 | 2-8/6M | ||
| DM-6309 | Mmiri mmiri ojii | 3500-7000 | 165°C 3min 150°C 5min | Ngwọta okpomọkụ | 110 | 88 | 2-8/6M | ||
| DM-6308 | Mmiri mmiri ojii | 360 | 130°C 8min 150°C 5min | Ngwọta okpomọkụ | 113 | * | -20/6M | ||
| DM-6310 | Mmiri mmiri ojii | 394 | 130°C 8 nkeji | Ngwọta okpomọkụ | 102 | * | -20/6M | ||
| DM-6320 | Mmiri mmiri ojii | 340 | 130°C 10min 150°C 5min 160°C 3min | Ngwọta okpomọkụ | 134 | * | -20/6M |
