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Qhov zoo tshaj plaws underfill epoxy nplaum manufacturers thiab tsum

Shenzhen DeepMaterial Technologies Co., Ltd yog flip nti bga underfill epoxy khoom thiab epoxy encapsulant chaw tsim tshuaj paus nyob rau hauv Suav teb, tsim underfill encapsulants, smt pcb underfill epoxy, ib tug tivthaiv epoxy underfill compounds, ntxeev nti underfill epoxy rau csp thiab bga thiab hais txog.

Underfill yog cov khoom siv epoxy uas ua rau qhov sib txawv ntawm cov nti thiab nws cov cab kuj lossis cov pob tiav thiab PCB substrate. Underfill tiv thaiv cov khoom siv hluav taws xob los ntawm kev poob siab, poob, thiab kev co thiab txo qhov kev nyuaj siab ntawm kev sib txuas ntawm cov khoom tawg yooj yim tshwm sim los ntawm qhov sib txawv ntawm thermal expansion ntawm silicon nti thiab cov cab kuj (ob yam tsis zoo li cov khoom siv).

Hauv daim ntawv thov capillary underfill, lub ntim ntim ntawm cov khoom siv hauv qab tau muab faib rau ntawm ib sab ntawm cov nti lossis pob kom ntws hauv qab los ntawm kev ua haujlwm capillary, sau cov pa tawm ntawm cov khoom sib txuas uas txuas cov pob khoom rau PCB lossis cov chips stacked hauv ntau lub pob. Cov ntaub ntawv tsis muaj dej tsis txaus, qee zaum siv rau underfilling, muab tso rau ntawm lub substrate ua ntej ib nti los yog pob txuas thiab rov qab. Moulded underfill yog lwm txoj hauv kev uas siv cov resin los ua qhov sib txawv ntawm cov nti thiab substrate.

Yog tsis muaj underfill, lub neej expectancy ntawm ib yam khoom yuav txo qis vim yog tawg ntawm interconnects. Underfill yog siv rau cov theem hauv qab no ntawm cov txheej txheem tsim khoom los txhim kho kev ntseeg tau.

Ua tiav Daim Ntawv Qhia Ntawm Underfill Epoxy:

Epoxy Underfill yog dab tsi?

Underfill yog ib hom khoom siv epoxy uas yog siv los sau qhov khoob ntawm cov khoom siv semiconductor thiab nws cov cab kuj lossis nruab nrab ntawm cov pob tiav thiab cov ntawv luam tawm Circuit Board (PCB) substrate hauv cov khoom siv hluav taws xob. Nws yog feem ntau yog siv nyob rau hauv advanced semiconductor ntim technologies, xws li flip-chip thiab nti-scale pob, los txhim kho cov neeg kho tshuab thiab thermal kev ntseeg tau ntawm cov khoom siv.

Epoxy underfill feem ntau yog ua los ntawm epoxy resin, thermosetting polymer nrog cov khoom siv zoo heev thiab tshuaj lom neeg, ua rau nws zoo tagnrho rau siv hauv kev thov siv hluav taws xob. Cov epoxy resin feem ntau ua ke nrog lwm cov khoom siv ntxiv, xws li hardeners, fillers, thiab modifiers, los txhim kho nws cov kev ua tau zoo thiab kho nws cov khoom kom tau raws li cov kev xav tau tshwj xeeb.

Epoxy underfill yog cov khoom ua kua los yog cov kua semi-kua dispensed mus rau substrate ua ntej cov semiconductor tuag yog muab tso rau saum. Nws yog tom qab ntawd kho los yog khov kho, feem ntau yog los ntawm cov txheej txheem thermal, tsim cov txheej txheem nruj, tiv thaiv txheej uas encapsulates cov semiconductor tuag thiab sau qhov sib txawv ntawm qhov tuag thiab cov substrate.

Epoxy underfill yog cov khoom siv tshwj xeeb uas siv rau hauv kev tsim khoom siv hluav taws xob los thaiv thiab tiv thaiv cov khoom muag, xws li microchips, los ntawm kev sau qhov sib txawv ntawm cov khoom thiab cov substrate, feem ntau yog cov ntawv luam tawm Circuit Board (PCB). Nws yog feem ntau siv nyob rau hauv flip-chip technology, qhov twg cov nti yog mounted ntsej muag-down ntawm lub substrate los txhim kho thermal thiab hluav taws xob kev ua tau zoo.

Lub hom phiaj tseem ceeb ntawm epoxy underfills yog muab cov cuab yeej cuab tam rau lub flip-chip pob, txhim kho nws cov kev tiv thaiv rau cov neeg kho tshuab kev ntxhov siab xws li thermal cycling, mechanical shocks, thiab vibrations. Nws kuj tseem yuav pab txo qis txoj kev pheej hmoo ntawm kev sib koom tes ua tsis tiav vim kev qaug zog thiab thermal expansion tsis sib haum, uas tuaj yeem tshwm sim thaum lub sijhawm ua haujlwm ntawm cov khoom siv hluav taws xob.

Epoxy underfill cov ntaub ntawv feem ntau yog tsim nrog epoxy resins, curing agents, thiab fillers kom ua tiav cov khoom xav tau, thermal, thiab hluav taws xob. Lawv tau tsim kom muaj qhov zoo adhesion rau cov semiconductor tuag thiab cov substrate, tsis tshua muaj coefficient ntawm thermal expansion (CTE) kom txo thermal kev nyuaj siab, thiab siab thermal conductivity los pab kom kub dissipation ntawm lub cuab yeej.

Dab tsi yog Underfill Epoxy siv rau?

Underfill epoxy yog ib qho epoxy resin nplaum siv nyob rau hauv ntau daim ntawv thov los muab txhua yam kev txhawb zog thiab kev tiv thaiv. Nov yog qee qhov kev siv ntawm underfill epoxy:

Semiconductor Ntim: Underfill epoxy feem ntau yog siv rau hauv cov ntim khoom semiconductor los muab kev txhawb nqa thiab kev tiv thaiv rau cov khoom siv hluav taws xob, xws li microchips, mounted ntawm cov ntawv luam tawm Circuit Board (PCBs). Nws puv qhov sib txawv ntawm cov nti thiab PCB, tiv thaiv kev ntxhov siab thiab kev puas tsuaj los ntawm thermal expansion thiab contraction thaum ua haujlwm.

Flip-Chip Bonding: Underfill epoxy yog siv nyob rau hauv flip-chip bonding, uas txuas semiconductor chips ncaj qha mus rau PCB yam tsis muaj hlau bonds. Lub epoxy sau qhov sib txawv ntawm cov nti thiab PCB, muab cov cuab yeej siv zog thiab hluav taws xob rwb thaiv tsev thaum txhim kho thermal kev ua haujlwm.

Display Manufacturing: Underfill epoxy yog siv los tsim cov duab, xws li kua siv lead ua kua (LCDs) thiab cov organic teeb-emitting diode (OLED) qhia. Nws yog siv los khi thiab txhawb nqa cov khoom siv me me, xws li cov tsav tsheb thiab kov cov sensors, kom ntseeg tau tias muaj kev ruaj ntseg thiab ua haujlwm ntev.

Optoelectronic Devices: Underfill epoxy yog siv rau hauv cov khoom siv optoelectronic, xws li optical transceivers, lasers, thiab photodiodes, los muab kev txhawb nqa txhua yam, txhim kho kev ua haujlwm thermal, thiab tiv thaiv cov khoom rhiab los ntawm ib puag ncig yam.

Automotive Electronics: Underfill epoxy yog siv nyob rau hauv automotive electronics, xws li hluav taws xob tswj units (ECUs) thiab sensors, muab mechanical reinforcement thiab tiv thaiv kub heev, kev co, thiab hnyav ib puag ncig tej yam kev mob.

Aerospace thiab Defense Applications: Underfill epoxy yog siv nyob rau hauv aerospace thiab tiv thaiv daim ntaub ntawv, xws li avionics, radar systems, thiab tub rog electronics, los muab txhua yam stability, tiv thaiv kub hloov, thiab tsis kam mus poob siab thiab kev co.

Consumer Electronics: Underfill epoxy yog siv nyob rau hauv ntau yam khoom siv hluav taws xob, suav nrog smartphones, ntsiav tshuaj, thiab gaming consoles, muab cov cuab yeej siv zog thiab tiv thaiv cov khoom siv hluav taws xob los ntawm kev puas tsuaj vim thermal cycling, cuam tshuam, thiab lwm yam kev ntxhov siab.

Cov cuab yeej kho mob: Underfill epoxy yog siv rau hauv cov khoom siv kho mob, xws li cov khoom siv cog qoob loo, cov khoom siv tshuaj ntsuam xyuas, thiab cov cuab yeej saib xyuas, los muab cov cuab yeej siv zog thiab tiv thaiv cov khoom siv hluav taws xob me me los ntawm qhov hnyav ntawm lub cev.

LED Ntim: Underfill epoxy yog siv rau hauv ntim lub teeb-emitting diodes (LEDs) los muab kev txhawb nqa txhua yam, kev tswj xyuas thermal, thiab kev tiv thaiv kev ya raws thiab lwm yam ib puag ncig.

General Electronics: Underfill epoxy yog siv nyob rau hauv ntau yam kev siv hluav taws xob siv hluav taws xob uas yuav tsum muaj kev txhawb zog thiab kev tiv thaiv cov khoom siv hluav taws xob, xws li hauv hluav taws xob hluav taws xob, kev lag luam automation, thiab cov khoom siv sib txuas lus.

Dab tsi yog Underfill Material rau Bga?

Cov khoom siv hauv qab rau BGA (Ball Grid Array) yog cov khoom siv epoxy lossis polymer-raws li siv los sau qhov sib txawv ntawm pob BGA thiab PCB (Printed Circuit Board) tom qab soldering. BGA yog ib hom ntawm pob mount pob siv hauv cov khoom siv hluav taws xob uas muab kev sib txuas siab ntawm kev sib txuas ntawm kev sib txuas (IC) thiab PCB. Cov khoom siv hauv qab no txhim kho BGA cov pob qij txha 'kev ntseeg tau thiab lub zog ntawm lub zog, txo qhov kev pheej hmoo ntawm kev ua tsis tiav vim kev ntxhov siab, thermal cycling, thiab lwm yam ib puag ncig.

Cov khoom siv hauv qab yog feem ntau ua kua thiab ntws hauv BGA pob ntawm kev ua haujlwm capillary. Tom qab ntawd nws dhau los ua cov txheej txheem kho kom khov thiab tsim kom muaj kev sib txuas ntawm BGA thiab PCB, feem ntau yog los ntawm tshav kub lossis UV raug. Cov khoom siv underfill pab faib cov kev ntxhov siab uas tuaj yeem tshwm sim thaum lub sij hawm thermal cycling, txo qhov kev pheej hmoo ntawm kev sib koom ua ke tawg thiab txhim kho tag nrho kev ntseeg siab ntawm BGA pob.

Cov khoom siv tsis zoo rau BGA yog ua tib zoo xaiv raws li qhov tshwj xeeb BGA pob tsim, cov ntaub ntawv siv hauv PCB thiab BGA, qhov chaw ua haujlwm, thiab daim ntawv thov npaj. Qee cov ntaub ntawv tsis zoo rau BGA suav nrog epoxy-raws li, tsis muaj dej, thiab cov khoom siv nrog cov khoom sib txawv xws li silica, alumina, lossis cov khoom siv hluav taws xob. Kev xaiv cov khoom tsim nyog underfill yog qhov tseem ceeb los xyuas kom meej lub sijhawm ntev thiab kev ua haujlwm ntawm BGA pob hauv cov khoom siv hluav taws xob.

Tsis tas li ntawd, cov khoom siv tsis zoo rau BGA tuaj yeem muab kev tiv thaiv kev ya raws, plua plav, thiab lwm yam kab mob uas tuaj yeem nkag mus rau qhov sib txawv ntawm BGA thiab PCB, uas tuaj yeem ua rau corrosion lossis luv luv Circuit Court. Qhov no tuaj yeem pab txhim kho BGA pob 'kev ua haujlwm ntev thiab kev ntseeg siab hauv qhov chaw hnyav.

Dab tsi yog Underfill Epoxy Hauv Ic?

Underfill epoxy hauv IC (Integrated Circuit) yog cov khoom siv nplaum uas ua rau qhov sib txawv ntawm cov semiconductor nti thiab cov substrate (xws li lub rooj tsavxwm luam tawm) hauv cov khoom siv hluav taws xob. Nws yog feem ntau siv rau hauv cov txheej txheem tsim khoom ntawm ICs los txhim kho lawv cov khoom siv dag zog thiab kev ntseeg tau.

ICs feem ntau yog tsim los ntawm cov nti semiconductor uas muaj ntau yam khoom siv hluav taws xob, xws li transistors, resistors, thiab capacitors, uas txuas nrog cov hluav taws xob sab nraud. Cov chips no ces mounted mus rau ib lub substrate, uas muab kev txhawb nqa thiab hluav taws xob kev sib txuas mus rau tus so ntawm lub tshuab hluav taws xob. Txawm li cas los xij, vim qhov sib txawv ntawm cov coefficients ntawm thermal expansion (CTEs) ntawm cov nti thiab cov substrate thiab cov kev ntxhov siab thiab cov kab mob uas tau ntsib thaum lub sijhawm ua haujlwm, kev ntxhov siab thiab kev ntseeg siab tuaj yeem tshwm sim, xws li thermal cycling-induced failures lossis mechanical cracks.

Underfill epoxy daws cov teeb meem no los ntawm kev sau qhov sib txawv ntawm cov nti thiab cov substrate, tsim kom muaj kev sib cog lus zoo. Nws yog ib hom epoxy resin tsim nrog cov khoom tshwj xeeb, xws li qis viscosity, siab adhesion zog, thiab zoo thermal thiab mechanical zog. Thaum lub sij hawm tsim cov txheej txheem, lub underfill epoxy yog siv nyob rau hauv ib tug kua daim ntawv, thiab ces nws yog kho kom solidify thiab tsim ib tug muaj zog daim ntawv cog lus ntawm lub nti thiab lub substrate. ICs yog cov khoom siv hluav taws xob rhiab heev rau cov neeg kho tshuab kev ntxhov siab, kev caij tsheb kauj vab, thiab lwm yam kev ua haujlwm ib puag ncig thaum lub sijhawm ua haujlwm, uas tuaj yeem ua rau tsis ua haujlwm vim kev sib koom ua ke qaug zog lossis delamination ntawm cov nti thiab cov substrate.

Lub underfill epoxy pab rov faib thiab txo qis cov kev ntxhov siab thiab cov kab mob thaum lub sijhawm ua haujlwm thiab muab kev tiv thaiv kev ya raws, kab mob, thiab kev sib tsoo. Nws kuj tseem pab txhim kho cov thermal cycling kev ntseeg siab ntawm IC los ntawm kev txo qhov kev pheej hmoo ntawm kev tawg lossis delamination ntawm cov nti thiab cov substrate vim qhov kub thiab txias.

Dab tsi yog Underfill Epoxy hauv Smt?

Underfill epoxy hauv Surface Mount Technology (SMT) yog hais txog ib hom khoom siv nplaum uas siv los sau qhov sib txawv ntawm cov semiconductor nti thiab cov substrate hauv cov khoom siv hluav taws xob xws li cov ntawv luam tawm Circuit Board (PCBs). SMT yog ib txoj hauv kev nrov rau kev sib sau cov khoom siv hluav taws xob ntawm PCBs, thiab cov khoom siv epoxy feem ntau yog siv los txhim kho cov neeg kho tshuab lub zog thiab kev ntseeg siab ntawm cov pob qij txha ntawm cov nti thiab PCB.

Thaum cov khoom siv hluav taws xob tau raug thermal cycling thiab mechanical stress, xws li thaum lub sijhawm ua haujlwm lossis kev thauj mus los, qhov sib txawv ntawm coefficient ntawm thermal expansion (CTE) ntawm cov nti thiab PCB tuaj yeem ua rau muaj kev cuam tshuam ntawm cov pob qij txha, ua rau muaj peev xwm ua tsis tiav xws li tawg. los yog delamination. Underfill epoxy yog siv los txo cov teeb meem no los ntawm kev sau qhov sib txawv ntawm cov nti thiab cov substrate, muab kev txhawb nqa txhua yam, thiab tiv thaiv cov pob qij txha los ntawm kev ntxhov siab ntau dhau.

Underfill epoxy feem ntau yog cov khoom siv thermosetting uas tau muab tso rau hauv cov kua hauv daim ntawv mus rau PCB, thiab nws ntws mus rau hauv qhov sib txawv ntawm cov nti thiab cov substrate los ntawm kev ua haujlwm capillary. Nws yog tom qab ntawd kho kom tsim tau cov khoom siv ruaj khov thiab ruaj khov uas txuas cov nti rau hauv lub substrate, txhim kho tag nrho cov neeg kho tshuab kev ncaj ncees ntawm cov pob qij txha.

Underfill epoxy pab ntau yam haujlwm tseem ceeb hauv SMT cov rooj sib txoos. Nws pab txo qis kev tsim cov pob qij txha pob txha los yog pob txha vim yog thermal cycling thiab mechanical stresses thaum lub sijhawm ua haujlwm ntawm cov khoom siv hluav taws xob. Nws kuj tseem txhim kho cov thermal dissipation los ntawm IC mus rau lub substrate, uas pab txhim kho kev ntseeg tau thiab kev ua tau zoo ntawm cov khoom siv hluav taws xob.

Underfill epoxy nyob rau hauv SMT cov rooj sib txoos yuav tsum muaj cov txheej txheem xa tawm kom paub meej kom zoo thiab kev faib tawm ntawm cov epoxy tsis ua rau muaj kev puas tsuaj rau IC lossis substrate. Cov cuab yeej siv siab tshaj plaws xws li kev xa cov neeg hlau thiab cov qhov cub kho yog feem ntau siv rau hauv cov txheej txheem underfill kom ua tiav cov txiaj ntsig zoo thiab cov txiaj ntsig zoo.

Dab tsi yog Cov Khoom Ntawm Cov Khoom Siv Tsis Txaus?

Cov khoom siv hluav taws xob feem ntau yog siv rau hauv cov txheej txheem tsim khoom siv hluav taws xob, tshwj xeeb, ntim khoom semiconductor, txhawm rau txhim kho kev ntseeg tau thiab ua haujlwm ntev ntawm cov khoom siv hluav taws xob xws li kev sib koom ua ke (ICs), pob kab sib chaws (BGAs), thiab flip-chip pob. Cov khoom ntawm cov ntaub ntawv tsis zoo tuaj yeem sib txawv nyob ntawm qhov tshwj xeeb thiab kev tsim tab sis feem ntau suav nrog cov hauv qab no:

Thermal conductivity: Cov khoom siv hauv qab yuav tsum muaj cov thermal conductivity zoo kom dissipate cua sov tsim los ntawm cov khoom siv hluav taws xob thaum ua haujlwm. Qhov no pab tiv thaiv overheating, uas tuaj yeem ua rau tsim tsis ua haujlwm.

CTE (Coefficient of Thermal Expansion) compatibility: Underfill cov ntaub ntawv yuav tsum muaj CTE uas yog sib xws nrog CTE ntawm cov khoom siv hluav taws xob thiab cov substrate uas nws tau txuas nrog. Qhov no yuav pab txo qis kev ntxhov siab thaum lub caij kub thiab tiv thaiv delamination lossis tawg.

Tsawg viscosity: Cov khoom siv hauv qab yuav tsum muaj qhov ntom ntom ntom ntom kom ua rau lawv ntws tau yooj yim thaum lub sijhawm txheej txheem encapsulation thiab sau qhov khoob ntawm cov khoom siv hluav taws xob thiab cov substrate, kom ntseeg tau tias muaj kev tiv thaiv zoo thiab txo qhov voids.

Adhesion: Cov khoom siv hauv qab yuav tsum muaj qhov zoo adhesion rau cov khoom siv hluav taws xob thiab cov substrate kom muaj kev sib raug zoo thiab tiv thaiv kev delamination lossis sib cais raws li thermal thiab mechanical stresses.

Hluav taws xob rwb thaiv tsev: Cov khoom siv hauv qab yuav tsum muaj cov khoom siv hluav taws xob zoo tiv thaiv hluav taws xob tiv thaiv luv luv thiab lwm yam hluav taws xob tsis ua haujlwm hauv lub cuab yeej.

Mechanical zog: Cov khoom siv hauv qab yuav tsum muaj lub zog txhua yam txaus los tiv thaiv cov kev ntxhov siab uas tau ntsib thaum caij tsheb kauj vab, kev poob siab, kev vibration, thiab lwm yam khoom siv tsis tau tawg lossis deforming.

Kho lub sijhawm: Cov khoom siv tsis zoo yuav tsum muaj lub sijhawm kho kom tsim nyog los xyuas kom muaj kev sib raug zoo thiab kev kho kom zoo yam tsis ua rau qeeb hauv kev tsim khoom.

Dispensing thiab reworkability: Cov khoom siv tsis zoo yuav tsum sib haum nrog cov khoom siv uas siv hauv kev tsim khoom thiab tso cai rau rov ua dua lossis kho dua yog tias xav tau.

Moisture resistance: Cov khoom siv hauv qab yuav tsum muaj cov dej noo zoo tiv thaiv kom tsis txhob ya raws, uas tuaj yeem ua rau cov cuab yeej tsis ua haujlwm.

Txee lub neej: Cov khoom siv tsis zoo yuav tsum muaj lub neej txee tsim nyog, tso cai rau kev khaws cia thiab siv tau raws sijhawm.

Dab tsi yog Moulded Underfill Material?

Cov khoom siv molded underfill yog siv nyob rau hauv cov khoom siv hluav taws xob los encapsulate thiab tiv thaiv cov khoom siv hluav taws xob, xws li kev sib koom ua ke (ICs), los ntawm ib puag ncig ib puag ncig thiab kev ntxhov siab. Nws feem ntau yog siv los ua cov khoom siv ua kua lossis muab tshuaj txhuam thiab tom qab ntawd kho kom khov thiab tsim cov txheej tiv thaiv ib puag ncig cov khoom siv semiconductor.

Moulded underfill cov ntaub ntawv feem ntau yog siv nyob rau hauv flip-chip ntim, uas interconnects semiconductor li mus rau ib tug luam Circuit Court board (PCB) los yog substrate. Flip-chip ntim tso cai rau cov txheej txheem kev sib txuas ua haujlwm siab, kev ua haujlwm siab, qhov twg cov khoom siv hluav taws xob tau teeb tsa ntsej muag ntawm lub substrate lossis PCB, thiab cov khoom siv hluav taws xob sib txuas yog tsim los ntawm cov hlau nplaum los yog cov khoom siv.

Cov khoom molded underfill feem ntau yog dispensed nyob rau hauv ib tug ua kua los yog muab tshuaj txhuam thiab ntws nyob rau hauv lub semiconductor ntaus ntawv los ntawm capillary txiav txim, sau qhov khoob ntawm lub cuab yeej thiab lub substrate los yog PCB. Cov khoom siv tom qab ntawd kho tau siv cov cua sov lossis lwm txoj hauv kev kho kom khov thiab tsim cov txheej txheem tiv thaiv uas encapsulates cov cuab yeej, muab cov cuab yeej txhawb nqa, thermal rwb thaiv tsev, thiab tiv thaiv cov dej noo, plua plav, thiab lwm yam kab mob.

Moulded underfill cov ntaub ntawv feem ntau yog tsim los kom muaj cov khoom xws li qis viscosity rau kev yooj yim dispensing, siab thermal stability rau kev txhim khu kev qha nyob rau hauv ib tug ntau yam ntawm kev khiav hauj lwm kub, zoo adhesion rau sib txawv substrates, tsis tshua muaj coefficient ntawm thermal expansion (CTE) kom txo tau kev ntxhov siab thaum kub. kev caij tsheb kauj vab, thiab cov khoom siv hluav taws xob siab tiv thaiv kom tsis txhob muaj luv luv.

Muaj tseeb! Ntxiv rau cov khoom uas tau hais ua ntej lawm, cov ntaub ntawv molded underfill tej zaum yuav muaj lwm yam ntxwv raws li cov kev siv tshwj xeeb lossis cov kev xav tau. Piv txwv li, qee qhov tsim cov khoom siv tsis zoo tuaj yeem txhim kho cov thermal conductivity los txhim kho cov cua sov los ntawm cov khoom siv semiconductor, uas yog qhov tseem ceeb hauv kev siv hluav taws xob siab uas kev tswj xyuas thermal yog qhov tseem ceeb.

Yuav Ua Li Cas Tshem Tawm Cov Khoom Siv Tsis Txaus?

Tshem tawm cov khoom siv tsis txaus tuaj yeem ua rau nyuaj, vim nws yog tsim los ua kom ruaj khov thiab tiv taus ib puag ncig yam. Txawm li cas los xij, ntau txoj hauv kev tuaj yeem siv los tshem tawm cov khoom siv tsis zoo, nyob ntawm seb hom kev underfill thiab cov txiaj ntsig xav tau. Nov yog qee qhov kev xaiv:

Thermal method: Cov ntaub ntawv hauv qab feem ntau yog tsim los ua kom muaj kev ruaj khov, tab sis qee zaum lawv tuaj yeem ua softened los yog melted los ntawm kev siv cua sov. Qhov no tuaj yeem ua tau los ntawm kev siv cov cuab yeej tshwj xeeb xws li qhov chaw ua haujlwm cua kub, cov hlau nplaum nrog lub tshuab cua sov, lossis lub tshuab cua sov infrared. Cov softened los yog melted underfill ces yuav ua tib zoo scraped los yog lifted tam sim ntawd siv ib tug haum lub cuab tam, xws li ib tug yas los yog hlau scraper.

Cov txheej txheem tshuaj: Cov kuab tshuaj tshuaj tuaj yeem yaj lossis muag qee cov ntaub ntawv tsis txaus. Hom kuab tshuaj xav tau nyob ntawm hom tshwj xeeb ntawm cov khoom siv underfill. Cov kuab tshuaj rau kev tshem tawm tsis zoo suav nrog isopropyl cawv (IPA), acetone, lossis cov kev daws teeb meem tshwj xeeb underfill tshem tawm. Cov kuab tshuaj feem ntau yog siv rau cov khoom siv underfill thiab tso cai rau nkag mus thiab muag nws, tom qab ntawd cov khoom tuaj yeem ua tib zoo khawb los yog wiped tawm.

Mechanical txoj kev: Cov khoom siv hauv qab tuaj yeem raug tshem tawm mechanically siv abrasive lossis mechanical method. Qhov no tuaj yeem suav nrog cov txheej txheem xws li kev sib tsoo, xuab zeb, lossis milling, siv cov cuab yeej tshwj xeeb lossis khoom siv. Cov txheej txheem tsis siv neeg feem ntau yog nruj dua thiab tuaj yeem tsim nyog rau cov xwm txheej uas lwm txoj hauv kev tsis zoo, tab sis lawv tuaj yeem ua rau muaj kev pheej hmoo ntawm kev puas tsuaj rau hauv qab substrate lossis cov khoom siv thiab yuav tsum tau siv ceev faj.

Kev sib xyaw ua ke: Qee zaum, kev sib xyaw ua ke ntawm cov txheej txheem yuav tshem tawm cov khoom tsis txaus. Piv txwv li, ntau yam txheej txheem thermal thiab tshuaj siv tau, qhov twg cov cua sov tau siv los ua kom cov khoom tsis zoo, cov kuab tshuaj kom yaj ntxiv los yog muag cov khoom, thiab cov txheej txheem siv tshuab kom tshem tawm cov seem seem.

Yuav ua li cas sau Underfill Epoxy

Ntawm no yog ib daim ntawv qhia ib kauj ruam ntawm yuav ua li cas rau underfill epoxy:

Kauj Ruam 1: Sau cov khoom siv thiab khoom siv

Cov khoom siv epoxy underfill: Xaiv cov khoom zoo tshaj plaws underfill epoxy uas yog sib xws nrog cov khoom siv hluav taws xob uas koj ua haujlwm nrog. Ua raws li cov chaw tsim khoom cov lus qhia rau kev sib xyaw thiab kho lub sijhawm.

Dispensing khoom: Koj yuav xav tau lub tshuab xa tawm, xws li lub koob txhaj tshuaj lossis lub tshuab xa tawm, txhawm rau siv cov epoxy kom raug thiab sib npaug.

Thaum tshav kub kub (yeem): Qee cov ntaub ntawv tsis muaj epoxy yuav tsum tau kho nrog cov cua sov, yog li koj yuav xav tau cov cua sov, xws li qhov cub lossis lub phaj kub.

Cov ntaub ntawv ntxuav: Muaj isopropyl cawv lossis ib tus neeg saib xyuas zoo sib xws, cov ntaub so tsis muaj lint, thiab hnab looj tes los ntxuav thiab tuav cov epoxy.

Kauj ruam 2: Npaj cov Cheebtsam

Ntxuav cov khoom xyaw: Xyuas kom meej tias cov khoom yuav tsum tau ua kom tsis muaj dej huv thiab tsis muaj cov kab mob, xws li plua plav, roj, lossis dej noo. Ntxuav lawv kom huv si siv isopropyl cawv lossis tshuaj ntxuav zoo sib xws.

Siv cov nplaum los yog flux (yog tias xav tau): Nyob ntawm cov khoom siv epoxy underfill thiab cov khoom siv, koj yuav tsum tau siv cov nplaum los yog flux rau cov khoom ua ntej siv epoxy. Ua raws li cov chaw tsim khoom cov lus qhia rau cov khoom siv tshwj xeeb.

Kauj Ruam 3: Sib tov Epoxy

Ua raws li cov chaw tsim khoom cov lus qhia kom sib tov cov khoom siv epoxy underfill kom zoo. Qhov no yuav koom nrog kev sib txuas ntawm ob lossis ntau dua epoxy Cheebtsam hauv qhov sib piv tshwj xeeb thiab sib xyaw kom zoo kom ua tiav qhov sib xyaw ua ke. Siv lub thawv huv thiab qhuav rau kev sib tov.

Kauj Ruam 4: Siv Epoxy

Thauj cov epoxy rau hauv qhov system dispensing: Sau lub tshuab xa tawm, xws li lub koob txhaj tshuaj lossis lub tshuab xa khoom, nrog cov khoom sib xyaw epoxy.

Siv cov epoxy: Dispense cov khoom epoxy mus rau qhov chaw uas yuav tsum tau underfilled. Nco ntsoov siv cov epoxy nyob rau hauv ib qho kev sib xws thiab kev tswj xyuas kom ua tiav cov kev pab cuam ntawm cov khoom.

Tsis txhob cua npuas: Tsis txhob cuam tshuam cov npuas npuas hauv epoxy, vim tias lawv tuaj yeem cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm cov khoom tsis zoo. Siv cov txheej txheem xa tawm kom raug, xws li qeeb thiab khov kho, thiab maj mam tshem tawm cov npuas npuas nrog lub tshuab nqus tsev lossis coj mus rhaub lub rooj sib txoos.

Kauj Ruam 5: Kho cov Epoxy

Kho cov epoxy: Ua raws li cov chaw tsim khoom cov lus qhia rau kev kho cov epoxy underfill. Nyob ntawm seb cov khoom siv epoxy siv, qhov no yuav cuam tshuam nrog kev kho ntawm chav tsev kub lossis siv qhov cua sov.

Cia lub sijhawm kho kom zoo: Muab lub sijhawm epoxy txaus los kho tag nrho ua ntej tuav lossis ua cov khoom ntxiv. Nyob ntawm cov khoom siv epoxy thiab kho cov mob, qhov no yuav siv sij hawm ob peb teev mus rau ob peb hnub.

Kauj Ruam 6: Ntxuav thiab tshuaj xyuas

Ntxuav cov epoxy ntau dhau: Thaum cov epoxy tau kho lawm, tshem tawm cov epoxy ntau dhau los ntawm kev siv kev tu kom tsim nyog, xws li khawb lossis txiav.

Tshawb xyuas cov khoom tsis txaus ntseeg: Tshawb xyuas cov khoom tsis txaus ntseeg rau txhua qhov tsis xws luag, xws li voids, delamination, lossis tsis tiav kev pab them nqi. Yog tias pom muaj qhov tsis xws luag, siv cov kev kho kom tsim nyog, xws li rov ua dua lossis rov kho dua, raws li xav tau.

Thaum twg koj sau Underfill Epoxy

Lub sij hawm ntawm underfill epoxy daim ntawv thov yuav nyob ntawm seb cov txheej txheem tshwj xeeb thiab daim ntawv thov. Underfill epoxy feem ntau yog siv tom qab lub microchip tau muab tso rau hauv lub rooj tsavxwm Circuit Court thiab cov pob qij txha tau tsim. Siv lub dispenser los yog syringe, lub underfill epoxy yog ces dispensed nyob rau hauv ib tug me me qhov sib txawv ntawm lub microchip thiab lub Circuit Court board. Cov epoxy yog tom qab ntawd kho los yog tawv, feem ntau ua kom sov rau qhov kub thiab txias.

Lub sijhawm caij nyoog ntawm daim ntawv thov epoxy underfill yuav nyob ntawm seb yam xws li hom epoxy siv, qhov loj thiab geometry ntawm qhov sib txawv yuav tsum tau sau, thiab cov txheej txheem kho tshwj xeeb. Ua raws li cov chaw tsim khoom cov lus qhia thiab cov txheej txheem pom zoo rau kev siv epoxy tshwj xeeb yog qhov tseem ceeb.

Nov yog qee qhov xwm txheej niaj hnub thaum siv epoxy underfill:

Flip-chip bonding: Underfill epoxy feem ntau yog siv nyob rau hauv flip-chip bonding, ib txoj kev ntawm kev txuas ib semiconductor nti ncaj qha mus rau PCB yam tsis muaj hlau sib txuas. Tom qab lub flip-chip txuas rau PCB, underfill epoxy feem ntau yog siv los sau qhov sib txawv ntawm cov nti thiab PCB, muab cov cuab yeej siv zog thiab tiv thaiv cov nti los ntawm ib puag ncig xws li noo noo thiab kub hloov.

Nto mount thev naus laus zis (SMT): Underfill epoxy kuj tseem siv tau rau hauv cov txheej txheem saum npoo av (SMT) cov txheej txheem, qhov chaw hluav taws xob xws li kev sib koom ua ke (ICs) thiab cov resistors raug ntsia ncaj qha rau saum npoo ntawm PCB. Underfill epoxy tuaj yeem siv los txhawb thiab tiv thaiv cov khoom no tom qab muag rau PCB.

Chip-on-board (COB) sib dhos: Nyob rau hauv chip-on-board (COB) los ua ke, liab qab semiconductor chips yog txuas ncaj qha mus rau PCB siv cov nplaum nplaum, thiab underfill epoxy tej zaum yuav siv los encapsulate thiab txhawb cov chips, txhim kho lawv cov kev ruaj ntseg thiab kev ntseeg tau.

Component-theem kho: Underfill epoxy kuj tseem tuaj yeem siv rau hauv cov txheej txheem kho cov txheej txheem, qhov uas puas los yog cov khoom siv hluav taws xob tsis zoo ntawm PCB raug hloov nrog cov tshiab. Underfill epoxy tuaj yeem siv rau cov khoom hloov pauv kom ntseeg tau tias muaj kev sib raug zoo thiab kev ruaj ntseg.

Yog Epoxy Filler Waterproof

Yog lawm, epoxy muab tub lim feem ntau yog dej tsis qab thaum nws tau kho. Epoxy fillers paub txog lawv cov adhesion zoo heev thiab dej tsis kam, ua rau lawv muaj kev xaiv nrov rau ntau yam kev siv uas yuav tsum tau muaj kev ruaj khov thiab tsis muaj dej.

Thaum siv los ua tus muab tub lim, epoxy tuaj yeem ua rau cov kab nrib pleb thiab qhov khoob hauv ntau yam ntaub ntawv, suav nrog ntoo, hlau, thiab pob zeb. Thaum kho, nws tsim ib qho nyuaj, ruaj khov nto resistant rau dej thiab ya raws, ua rau nws zoo tagnrho rau siv nyob rau hauv cov chaw raug dej los yog high humidity.

Txawm li cas los xij, nws tseem ceeb heev uas yuav tsum nco ntsoov tias tsis yog tag nrho cov epoxy fillers raug tsim sib npaug, thiab qee qhov yuav muaj cov dej tsis sib txawv. Nws yog ib lub tswv yim zoo los xyuas cov khoom tshwj xeeb daim ntawv lo lossis sab laj nrog cov chaw tsim khoom kom paub tseeb tias nws tsim nyog rau koj qhov project thiab npaj siv.

Txhawm rau kom tau txais txiaj ntsig zoo tshaj plaws, nws yog ib qho tseem ceeb uas yuav tsum tau npaj qhov chaw kom zoo ua ntej siv epoxy muab tub lim. Qhov no feem ntau suav nrog kev tu thaj chaw kom huv si thiab tshem tawm cov khoom xoob lossis puas. Thaum lub npoo tau npaj kom raug, epoxy muab tub lim tuaj yeem sib xyaw thiab siv raws li cov chaw tsim khoom cov lus qhia.

Nws tseem ceeb heev uas yuav tsum nco ntsoov tias tsis yog txhua tus epoxy fillers raug tsim sib npaug. Qee cov khoom yuav tsim nyog rau cov kev siv tshwj xeeb lossis qhov chaw ntau dua li lwm tus, yog li xaiv cov khoom tsim nyog rau txoj haujlwm yog qhov tseem ceeb. Tsis tas li ntawd, qee qhov epoxy fillers yuav xav tau cov coatings ntxiv los yog sealers los muab kev tiv thaiv kev tiv thaiv ntev ntev.

Epoxy fillers muaj npe nrov rau lawv cov khoom tsis muaj dej tsis zoo thiab muaj peev xwm los tsim cov ntawv cog lus ruaj khov thiab ruaj khov. Txawm li cas los xij, ua raws li cov txheej txheem thov kom raug thiab xaiv cov khoom tsim nyog yog qhov tseem ceeb los xyuas kom meej cov txiaj ntsig zoo tshaj plaws.

Cov txheej txheem ntawm Epoxy Flip Chip

Nov yog cov kauj ruam los ua cov txheej txheem underfill epoxy flip nti:

Tu: Lub substrate thiab flip nti raug ntxuav kom tshem tawm cov plua plav, khib nyiab, lossis cov kab mob uas tuaj yeem cuam tshuam nrog cov ntawv cog lus epoxy underfilled.

Kev faib tawm: Lub underfilled epoxy yog dispensed mus rau lub substrate nyob rau hauv ib tug tswj txoj kev, siv ib tug dispenser los yog ib rab koob. Cov txheej txheem muab tshuaj yuav tsum yog qhov tseeb kom tsis txhob muaj cov dej ntws los yog voids.

Txheej Txheem: Lub flip nti yog tom qab ntawd ua ke nrog lub substrate siv lub tshuab tsom iav kom paub meej qhov kev tso kawm.

Reflow: Lub flip nti yog reflowed siv lub cub tawg los yog lub qhov cub kom yaj cov pob qij txha thiab khi cov nti rau substrate.

Kho: Lub underfilled epoxy yog kho los ntawm cua sov nws nyob rau hauv lub qhov cub ntawm ib tug tshwj xeeb kub thiab lub sij hawm. Cov txheej txheem curing tso cai rau cov epoxy ntws thiab sau txhua qhov khoob ntawm flip nti thiab substrate.

Tu: Tom qab cov txheej txheem kho, ib qho epoxy tshaj tawm raug tshem tawm ntawm cov npoo ntawm cov nti thiab substrate.

Kev Tshawb Fawb: Cov kauj ruam kawg yog los tshuaj xyuas lub flip nti nyob rau hauv lub tshuab tsom kom paub tseeb tias tsis muaj qhov khoob lossis qhov khoob hauv cov epoxy underfilled.

Tom qab kho: Qee zaum, cov txheej txheem tom qab kho yuav tsim nyog los txhim kho cov khoom siv kho tshuab thiab thermal ntawm cov epoxy underfilled. Qhov no suav nrog cua sov lub nti dua ntawm qhov kub siab dua rau lub sijhawm ntev dua kom ua tiav qhov sib txuas ntawm epoxy ntau dua.

Kev kuaj hluav taws xob: Tom qab cov txheej txheem underfill epoxy flip-chip, cov cuab yeej raug kuaj xyuas kom nws ua haujlwm zoo. Qhov no yuav suav nrog kev tshuaj xyuas luv luv lossis qhib hauv Circuit Court thiab kuaj cov yam ntxwv hluav taws xob ntawm lub cuab yeej.

Ntim: Thaum cov cuab yeej tau kuaj thiab kuaj xyuas, nws tuaj yeem ntim thiab xa mus rau cov neeg siv khoom. Lub ntim yuav muaj kev tiv thaiv ntxiv, xws li cov txheej tiv thaiv los yog encapsulation, kom ntseeg tau tias lub cuab yeej tsis puas thaum thauj lossis tuav.

Epoxy Underfill Bga Txoj Kev

Cov txheej txheem suav nrog kev sau qhov chaw nruab nrab ntawm BGA nti thiab lub rooj tsav xwm hauv Circuit Court nrog epoxy, uas muab kev txhawb nqa cov neeg kho tshuab ntxiv thiab txhim kho cov thermal ua haujlwm ntawm kev sib txuas. Nov yog cov kauj ruam koom nrog hauv epoxy underfill BGA txoj kev:

• Npaj BGA pob thiab PCB los ntawm kev ntxuav lawv nrog cov kuab tshuaj kom tshem tawm cov kab mob uas yuav cuam tshuam rau daim ntawv cog lus.
• Siv ib qho me me ntawm flux mus rau qhov chaw ntawm pob BGA.
• Muab lub pob BGA tso rau hauv PCB thiab siv lub qhov cub reflow los ua cov pob rau ntawm lub rooj tsavxwm.
• Siv ib qho me me ntawm epoxy underfill rau lub ces kaum ntawm BGA pob. Lub underfill yuav tsum tau siv rau lub ces kaum ze tshaj plaws rau qhov chaw ntawm lub pob, thiab yuav tsum tsis txhob npog ib qho ntawm cov khoom siv.
• Siv cov kev ua capillary los yog lub tshuab nqus tsev los kos cov underfill hauv BGA pob. Lub underfill yuav tsum ntws nyob ib ncig ntawm cov pob qij txha, sau cov voids thiab tsim kom muaj kev sib raug zoo ntawm BGA thiab PCB.
• Kho qhov underfill raws li cov neeg tsim khoom cov lus qhia. Qhov no feem ntau yog ua kom sov lub rooj sib txoos rau qhov kub thiab txias rau ib lub sijhawm tshwj xeeb.
• Ntxuav lub rooj sib txoos nrog cov kuab tshuaj kom tshem tawm cov dej ntau dhau los yog cov dej tsis qab.
• Tshawb xyuas qhov tsis txaus rau qhov tsis muaj dab tsi, npuas, lossis lwm yam tsis xws luag uas tuaj yeem cuam tshuam kev ua haujlwm ntawm BGA nti.
• Ntxuav cov epoxy ntau dhau los ntawm BGA nti thiab Circuit Court board siv cov kuab tshuaj.
• Kuaj BGA nti kom paub meej tias nws ua haujlwm raug.

Epoxy underfill muab ntau cov txiaj ntsig rau cov pob BGA, suav nrog kev txhim kho cov khoom siv dag zog, txo kev ntxhov siab ntawm cov pob qij txha, thiab ua kom muaj zog tiv thaiv thermal cycling. Txawm li cas los xij, ua raws li cov chaw tsim khoom cov lus qhia ua tib zoo ua kom muaj kev ruaj khov thiab txhim khu kev qha ntawm pob BGA thiab PCB.

Yuav Ua Li Cas Ua Kom Tsis Muaj Epoxy Resin

Underfill epoxy resin yog ib hom nplaum siv los sau qhov khoob thiab ntxiv dag zog rau cov khoom siv hluav taws xob. Nov yog cov kauj ruam dav dav rau kev ua cov epoxy resin underfilled:

• Cov khoom xyaw:
• Epoxy cob
• Hardener
• Cov ntaub ntawv muab tub lim (xws li silica lossis iav hlaws)
• Cov kuab tshuaj (xws li acetone lossis isopropyl cawv)
• Catalysts (yeem)

Cov kauj ruam:

Xaiv qhov tsim nyog epoxy resin: Xaiv ib qho epoxy resin uas haum rau koj daim ntawv thov. Epoxy resins tuaj nyob rau hauv ntau hom nrog ntau yam khoom. Rau cov ntawv thov underfill, xaiv cov resin nrog lub zog siab, qis shrinkage, thiab zoo adhesion.

Sib tov cov epoxy resin thiab hardener: Feem ntau underfill epoxy resins tuaj nyob rau hauv ib qho khoom siv ob feem, nrog cov resin thiab hardener ntim nyias. Muab ob qhov sib xyaw ua ke raws li cov neeg tsim khoom cov lus qhia.

Ntxiv cov ntaub ntawv muab tub lim: Ntxiv cov ntaub ntawv muab tub lim rau epoxy resin sib tov kom nws viscosity thiab muab kev txhawb nqa ntxiv. Silica lossis iav hlaws feem ntau yog siv los ua cov khoom ntim. Ntxiv cov fillers maj mam thiab sib tov kom huv si kom txog thaum qhov kev xav tau sib xws.

Ntxiv cov kuab tshuaj: Cov kuab tshuaj tuaj yeem muab ntxiv rau epoxy resin sib tov los txhim kho nws cov dej ntws thiab cov khoom ntub dej. Acetone lossis isopropyl cawv feem ntau yog siv cov kuab tshuaj. Ntxiv cov kuab tshuaj maj mam thiab sib tov kom huv si kom txog thaum qhov kev xav tau ua tiav.

Yeem: Ntxiv cov catalysts: Catalysts tuaj yeem muab ntxiv rau epoxy resin sib tov kom nrawm cov txheej txheem kho. Txawm li cas los xij, cov txiaj ntsig tseem tuaj yeem txo lub lauj kaub lub neej ntawm kev sib tov, yog li siv lawv me ntsis. Ua raws li cov chaw tsim khoom cov lus qhia rau qhov tsim nyog tus nqi ntawm cov catalyst ntxiv.

Siv lub underfill epoxy resin los sau epoxy resin sib tov rau qhov sib txawv los yog sib koom ua ke. Siv lub syringe lossis dispenser los siv cov khoom sib xyaw kom meej thiab tsis txhob muaj cua npuas. Xyuas kom meej tias qhov sib tov sib npaug sib npaug thiab npog txhua qhov chaw.

Kho cov epoxy resin: Cov epoxy resin tuaj yeem kho tau raws li cov chaw tsim khoom cov lus qhia. Feem ntau underfill epoxy resins kho nyob rau hauv chav tsev kub, tab sis qee qhov yuav xav tau qhov kub thiab txias kom kho sai.

 Puas muaj kev txwv lossis cov kev sib tw cuam tshuam nrog Epoxy Underfill?

Yog, muaj cov kev txwv thiab cov teeb meem cuam tshuam nrog epoxy underfill. Qee qhov kev txwv thiab cov teeb meem feem ntau yog:

Thermal expansion mismatch: Epoxy underfills muaj cov coefficient ntawm thermal expansion (CTE) uas txawv ntawm CTE ntawm cov khoom siv los sau. Qhov no tuaj yeem ua rau muaj kev ntxhov siab thermal thiab tuaj yeem ua rau cov khoom tsis ua haujlwm, tshwj xeeb tshaj yog nyob rau hauv qhov chaw kub kub.

Cov kev sib tw ua haujlwm: Epoxy underfills tshwj xeeb cov cuab yeej ua haujlwm thiab cov txheej txheem, suav nrog cov khoom siv tshuaj thiab kho. Yog tias tsis ua kom raug, qhov underfill yuav tsis ua kom zoo rau qhov sib txawv ntawm cov khoom lossis yuav ua rau cov khoom puas tsuaj.

Moisture rhiab heev: Epoxy underfills yog rhiab heev rau cov dej noo thiab tuaj yeem nqus dej los ntawm ib puag ncig. Qhov no tuaj yeem ua rau muaj teeb meem nrog adhesion thiab tuaj yeem ua rau cov khoom tsis ua haujlwm.

Tshuaj compatibility: Epoxy underfills tuaj yeem cuam tshuam nrog qee cov ntaub ntawv siv hauv cov khoom siv hluav taws xob, xws li cov npog ntsej muag, cov nplaum, thiab cov fluxes. Qhov no tuaj yeem ua rau muaj teeb meem nrog adhesion thiab tuaj yeem ua rau cov khoom tsis ua haujlwm.

Tus nqi: Epoxy underfills tuaj yeem kim dua li lwm cov khoom siv hauv qab, xws li capillary underfills. Qhov no tuaj yeem ua rau lawv tsis tshua txaus nyiam siv rau hauv qhov chaw tsim khoom loj.

Environmental kev txhawj xeeb: Epoxy underfill tuaj yeem muaj cov tshuaj phem thiab cov khoom siv, xws li bisphenol A (BPA) thiab phthalates, uas tuaj yeem ua rau muaj kev pheej hmoo rau tib neeg kev noj qab haus huv thiab ib puag ncig. Cov neeg tsim khoom yuav tsum tau ceev faj kom zoo kom ntseeg tau tias cov ntaub ntawv no muaj kev nyab xeeb thiab pov tseg.

 Lub sijhawm kho: Epoxy underfill xav tau qee lub sijhawm los kho ua ntej nws tuaj yeem siv rau hauv daim ntawv thov. Lub sijhawm kho tuaj yeem sib txawv nyob ntawm qhov tshwj xeeb tsim ntawm cov dej tsis qab, tab sis nws feem ntau yog nyob ntawm ob peb feeb mus rau ob peb teev. Qhov no tuaj yeem ua rau qeeb ntawm cov txheej txheem tsim khoom thiab ua kom lub sijhawm tsim khoom tag nrho.

Thaum epoxy underfills muaj ntau yam txiaj ntsig, suav nrog kev txhim kho kev ntseeg tau thiab ua haujlwm ntev ntawm cov khoom siv hluav taws xob, lawv kuj nthuav tawm qee qhov kev sib tw thiab kev txwv uas yuav tsum tau ua tib zoo xav ua ntej siv.

Dab tsi yog qhov zoo ntawm kev siv Epoxy Underfill?

Nov yog qee qhov zoo ntawm kev siv epoxy underfill:

Kauj Ruam 1: Ntxiv kev ntseeg tau

Ib qho txiaj ntsig tseem ceeb tshaj plaws ntawm kev siv epoxy underfill yog kev ntseeg tau. Cov khoom siv hluav taws xob muaj kev puas tsuaj vim yog thermal thiab mechanical stresses, xws li thermal cycling, vibration, thiab shock. Epoxy underfill pab tiv thaiv cov pob qij txha ntawm cov khoom siv hluav taws xob los ntawm kev puas tsuaj vim cov kev ntxhov siab no, uas tuaj yeem ua rau kom muaj kev ntseeg siab thiab kev ua neej nyob ntawm cov khoom siv hluav taws xob.

Kauj Ruam 2: Txhim kho kev ua haujlwm

Los ntawm kev txo qhov kev pheej hmoo ntawm kev puas tsuaj rau cov khoom siv hluav taws xob, epoxy underfill tuaj yeem pab txhim kho lub cuab yeej kev ua haujlwm tag nrho. Tsis yog cov khoom siv hluav taws xob muaj zog tuaj yeem raug kev txom nyem los ntawm kev txo qis los yog ua tsis tiav, thiab epoxy underfills tuaj yeem pab tiv thaiv cov teeb meem no, ua rau muaj kev txhim khu kev qha thiab ua haujlwm siab.

Kauj Ruam 3: Kev tswj xyuas thermal zoo dua

Epoxy underfill muaj cov thermal conductivity zoo heev, uas pab kom cov cua sov los ntawm cov khoom siv hluav taws xob. Qhov no tuaj yeem txhim kho kev tswj xyuas thermal ntawm lub cuab yeej thiab tiv thaiv kom tsis txhob muaj cua sov. Overheating tuaj yeem ua rau cov khoom siv hluav taws xob puas tsuaj thiab ua rau muaj teeb meem kev ua haujlwm lossis ua tsis tiav. Los ntawm kev muab kev tswj xyuas thermal zoo, epoxy underfill tuaj yeem tiv thaiv cov teeb meem no thiab txhim kho kev ua haujlwm tag nrho thiab kev ua neej nyob ntawm lub cuab yeej.

Kauj Ruam 4: Txhim kho txhua yam muaj zog

Epoxy underfill muab kev txhawb nqa txhua yam rau cov khoom siv hluav taws xob, uas tuaj yeem pab tiv thaiv kev puas tsuaj vim kev co lossis kev poob siab. Tsis muaj cov khoom siv hluav taws xob muaj zog txaus tuaj yeem raug kev txom nyem los ntawm kev ntxhov siab, ua rau raug mob lossis ua tsis tiav. Epoxy tuaj yeem pab tiv thaiv cov teeb meem no los ntawm kev muab cov khoom siv dag zog ntxiv, ua rau muaj kev txhim khu kev qha thiab ruaj khov.

Kauj Ruam 5: Txo warpage

Epoxy underfill tuaj yeem pab txo qis PCB's warpage thaum lub sij hawm soldering txheej txheem, uas tuaj yeem ua rau kev txhim kho kev ntseeg tau thiab kev sib koom ua ke zoo dua qub. PCB warpage tuaj yeem ua rau muaj teeb meem nrog kev sib haum xeeb ntawm cov khoom siv hluav taws xob, uas ua rau muaj qhov tsis xws luag uas tuaj yeem ua rau muaj teeb meem kev ntseeg siab lossis ua tsis tiav. Epoxy underfill tuaj yeem pab tiv thaiv cov teeb meem no los ntawm kev txo qis warpage thaum tsim khoom.

Yuav ua li cas yog Epoxy Underfill Applied hauv Electronics Manufacturing?

Nov yog cov kauj ruam koom nrog hauv kev thov epoxy underfill hauv kev tsim hluav taws xob:

Kev npaj cov khoom xyaw: Cov khoom siv hluav taws xob yuav tsum tau tsim ua ntej siv epoxy underfill. Cov khoom siv tau raug ntxuav kom tshem tawm cov av, plua plav, lossis cov khib nyiab uas tuaj yeem cuam tshuam nrog cov adhesion ntawm epoxy. Tom qab ntawd cov khoom yuav raug muab tso rau ntawm PCB thiab tuav siv cov nplaum ib ntus.

Kev faib tawm epoxy: Lub epoxy underfill yog xa mus rau PCB siv lub tshuab xa khoom. Lub tshuab dispensing yog calibrated rau dispense epoxy nyob rau hauv ib tug meej npaum li cas thiab qhov chaw. Lub epoxy yog dispensed nyob rau hauv ib tug tas mus li kwj raws ntawm ntug ntawm cov khoom. Cov kwj ntawm epoxy yuav tsum ntev txaus los npog tag nrho qhov sib txawv ntawm cov khoom thiab PCB.

Spreading epoxy: Tom qab dispensing nws, nws yuav tsum tau nthuav tawm los npog qhov sib txawv ntawm cov khoom thiab PCB. Qhov no tuaj yeem ua tau manually siv txhuam me me los yog lub tshuab automated kis. Cov epoxy yuav tsum tau kis tusyees yam tsis muaj qhov khoob lossis cov npuas cua.

Kho cov epoxy: Tom qab ntawd cov epoxy underfill yog tsau rau harden thiab tsim ib qho khoom sib txuas ntawm cov khoom thiab PCB. Txoj kev kho tuaj yeem ua tau ob txoj hauv kev: thermal lossis UV. Hauv thermal curing, PCB tau muab tso rau hauv qhov cub thiab ua kom sov rau qhov kub tshwj xeeb rau ib lub sijhawm tshwj xeeb. Hauv UV curing, epoxy yog raug rau ultraviolet lub teeb los pib txheej txheem kho.

Kev ntxuav tu: Tom qab cov epoxy underfills raug kho, tshaj epoxy tuaj yeem raug tshem tawm siv lub scraper lossis hnyav hnyav. Nws yog ib qho tseem ceeb kom tshem tawm cov epoxy ntau dhau los tiv thaiv nws los ntawm kev cuam tshuam nrog kev ua haujlwm ntawm cov khoom siv hluav taws xob.

Dab tsi yog qee qhov kev thov ntawm Epoxy Underfill?

Nov yog qee qhov kev siv ntawm epoxy underfill:

Semiconductor ntim: Epoxy underfill yog dav siv nyob rau hauv ntim ntawm semiconductor li, xws li microprocessors, integrated circuits (ICs), thiab flip-chip tej pob khoom. Nyob rau hauv daim ntawv thov no, epoxy underfill nyob rau hauv qhov sib txawv ntawm cov semiconductor nti thiab substrate, muab cov neeg kho tshuab ntxiv dag zog thiab txhim kho thermal conductivity kom dissipate tshav kub generated thaum lub sij hawm ua hauj lwm.

Printed Circuit Board (PCB) sib dhos: Epoxy underfill yog siv rau hauv lub cev ntawm PCBs los txhim kho kev ntseeg siab ntawm cov pob qij txha. Nws yog siv rau hauv qab ntawm cov khoom xws li pob kab sib chaws array (BGA) thiab nti nplai pob (CSP) li ua ntej reflow soldering. Cov epoxy underfills ntws mus rau hauv qhov sib txawv ntawm cov khoom siv thiab PCB, tsim cov ntawv cog lus muaj zog uas pab tiv thaiv kev sib koom ua ke tsis ua haujlwm vim muaj kev ntxhov siab, xws li thermal cycling thiab shock / vibration.

Optoelectronics: Epoxy underfill kuj tseem siv rau hauv ntim khoom siv optoelectronic, xws li lub teeb-emitting diodes (LEDs) thiab laser diodes. Cov cuab yeej no tsim kom muaj cua sov thaum ua haujlwm, thiab epoxy underfills pab kom dissipate cov cua sov no thiab txhim kho tag nrho cov thermal ua haujlwm ntawm lub cuab yeej. Tsis tas li ntawd, epoxy underfill muab cov cuab yeej siv dag zog los tiv thaiv cov khoom siv optoelectronic los ntawm cov neeg kho tshuab kev ntxhov siab thiab ib puag ncig.

Automotive electronics: Epoxy underfill yog siv nyob rau hauv automotive electronics rau ntau yam kev siv, xws li cav tswj units (ECUs), kis tswj units (TCUs), thiab sensors. Cov khoom siv hluav taws xob no raug rau ib puag ncig hnyav, nrog rau qhov kub thiab txias, av noo, thiab kev co. Epoxy underfill tiv thaiv cov xwm txheej no, ua kom ntseeg tau kev ua tau zoo thiab ua haujlwm ntev.

Consumer electronics: Epoxy underfill yog siv nyob rau hauv ntau yam khoom siv hluav taws xob, suav nrog smartphones, ntsiav tshuaj, gaming consoles, thiab cov khoom siv hnav. Nws pab txhim kho cov cuab yeej no 'kev ntseeg siab thiab kev ua haujlwm thermal, kom ntseeg tau tias kev ua haujlwm ruaj khov nyob rau hauv ntau yam kev siv.

Aerospace thiab kev tiv thaiv: Epoxy underfill yog ua haujlwm nyob rau hauv aerospace thiab tiv thaiv daim ntawv thov, qhov twg cov khoom siv hluav taws xob yuav tsum tiv taus qhov chaw huab cua, xws li qhov kub thiab txias, qhov siab siab, thiab kev vibrations hnyav. Epoxy underfill muab txhua yam kev ruaj ntseg thiab thermal tswj, ua rau nws haum rau rugged thiab xav tau ib puag ncig.

Dab tsi yog cov txheej txheem kho rau Epoxy Underfill?

Txoj kev kho rau epoxy underfill suav nrog cov kauj ruam hauv qab no:

Kev faib tawm: Epoxy underfill feem ntau yog dispensed raws li cov ntaub ntawv ua kua rau hauv lub substrate los yog nti siv lub dispenser los yog jetting system. Cov epoxy yog siv rau hauv qhov tseeb kom npog tag nrho cov cheeb tsam uas yuav tsum tau ua kom tsis muaj zog.

Encapsulation: Thaum cov epoxy yog dispensed, cov nti feem ntau yog muab tso rau saum lub substrate, thiab cov epoxy underfill ntws ncig thiab hauv qab cov nti, encapsulating nws. Cov khoom siv epoxy yog tsim los kom ntws tau yooj yim thiab sau qhov khoob ntawm cov nti thiab substrate los ua ib txheej txheej.

Pre-curing: Cov epoxy underfill feem ntau yog kho ua ntej lossis kho ib nrab kom zoo li gel zoo ib yam tom qab encapsulation. Qhov no yog ua los ntawm kev muab lub rooj sib dhos rau cov txheej txheem kub qis, xws li qhov cub ci lossis infrared (IR). Cov kauj ruam ua ntej kho pab txo cov epoxy viscosity thiab tiv thaiv nws los ntawm ntws tawm ntawm qhov chaw underfill thaum cov kauj ruam tom ntej.

Tom qab kho: Thaum cov epoxy underfills tau kho ua ntej, lub rooj sib txoos tau raug rau cov txheej txheem kub kub ntau dua, feem ntau nyob rau hauv qhov cub convection lossis chav kho kom sov. Cov kauj ruam no yog hu ua tom qab kho lossis kho zaum kawg, thiab nws tau ua tiav los kho cov khoom siv epoxy thiab ua tiav nws cov khoom siv ntau tshaj plaws thiab thermal. Lub sij hawm thiab qhov kub thiab txias ntawm cov txheej txheem tom qab kho yog ua tib zoo tswj kom ua tiav kev kho ntawm epoxy underfill.

Cua txias: Tom qab cov txheej txheem tom qab kho, lub rooj sib txoos feem ntau tso cai rau txias mus rau chav sov maj mam. Kev ua kom txias nrawm tuaj yeem ua rau muaj kev ntxhov siab thermal thiab cuam tshuam rau kev ncaj ncees ntawm epoxy underfill, yog li kev tswj kom txias yog qhov tseem ceeb kom tsis txhob muaj teeb meem tshwm sim.

Kev Tshawb Fawb: Thaum cov epoxy underfills tau kho tag nrho, thiab lub rooj sib txoos tau txias, nws feem ntau raug tshuaj xyuas rau tej yam tsis xws luag los yog voids hauv cov khoom underfill. X-ray lossis lwm txoj kev kuaj tsis muaj kev puas tsuaj yuav raug siv los kuaj xyuas qhov zoo ntawm epoxy underfill thiab xyuas kom meej tias nws muaj kev sib raug zoo ntawm cov nti thiab substrate.

Dab tsi yog Qhov txawv ntawm Epoxy Underfill Materials Muaj?

Muaj ntau hom epoxy underfill cov ntaub ntawv, txhua tus muaj nws tus kheej cov khoom thiab cov yam ntxwv. Qee yam ntawm cov khoom siv epoxy underfill yog:

Capillary Underfill: Capillary underfill cov ntaub ntawv yog cov tsis tshua muaj viscosity epoxy resins uas ntws mus rau hauv qhov chaw nqaim ntawm lub semiconductor nti thiab nws cov substrate thaum lub sij hawm underfill txheej txheem. Lawv tau tsim kom muaj viscosity tsawg, tso cai rau lawv yooj yim ntws mus rau hauv qhov me me los ntawm kev ua haujlwm capillary, thiab tom qab ntawd kho kom tsim cov khoom siv tsis zoo, cov khoom siv thermosetting uas muab cov cuab yeej siv zog rau cov chip-substrate sib dhos.

Tsis-Flow Underfill: Raws li lub npe qhia, cov ntaub ntawv tsis muaj dej tsis txaus tsis ntws thaum lub sij hawm cov txheej txheem underfill. Lawv feem ntau yog tsim nrog high-viscosity epoxy resins thiab yog siv raws li ib tug pre-dispensed epoxy paste los yog zaj duab xis ntawm lub substrate. Thaum lub sij hawm sib dhos txheej txheem, cov nti tau muab tso rau saum qhov tsis muaj dej ntws tawm, thiab lub rooj sib txoos tau raug cua sov thiab siab, ua rau cov epoxy kho thiab tsim cov khoom nruj uas ua rau qhov khoob ntawm cov nti thiab cov substrate.

Moulded Underfill: Moulded underfill cov ntaub ntawv yog pre-molded epoxy resins tso rau ntawm lub substrate thiab ces rhuab mus ntws thiab encapsulate lub nti thaum lub sij hawm underfill txheej txheem. Lawv feem ntau yog siv nyob rau hauv daim ntawv thov uas high-volume manufacturing thiab meej tswj ntawm underfill cov ntaub ntawv tso kawm yuav tsum tau.

Wafer-Level Underfill: wafer-theem underfill cov ntaub ntawv yog epoxy resins siv rau tag nrho cov wafer nto ua ntej tus neeg chips yog singulated. Cov epoxy yog tom qab ntawd kho, tsim cov khoom nruj uas muab kev tiv thaiv tsis zoo rau tag nrho cov chips ntawm lub wafer. Wafer-theem underfill feem ntau yog siv nyob rau hauv wafer-level ntim (WLP) cov txheej txheem, qhov twg ntau cov chips tau ntim ua ke ntawm ib qho wafer ua ntej muab cais ua ib pob.

Encapsulant Underfill: Cov ntaub ntawv encapsulant underfill yog epoxy resins siv los encapsulate tag nrho cov nti thiab substrate los ua ke, ua ib qho kev tiv thaiv ib puag ncig ntawm cov khoom. Lawv feem ntau yog siv rau hauv daim ntawv thov uas xav tau lub zog txhua yam, kev tiv thaiv ib puag ncig, thiab txhim kho kev ntseeg tau.

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