Case In USA: American Partner's Chip Underfill Solution

Raws li lub teb chaws high-tech, muaj ntau ntawm BGA, CSP lossis Flip Chip cov tuam txhab lag luam hauv Asmeskas, yog li cov nplaum nplaum nplaum yog qhov xav tau zoo.

Ib qho ntawm peb cov neeg siv khoom los ntawm Asmeskas cov tuam txhab high-tech, lawv siv DeepMaterial underfill tov rau lawv cov nti underfill, thiab nws ua haujlwm zoo.

DeepMaterial muaj cov ntaub ntawv ua tau zoo rau Sintering thiab Tuag Txuas, Nto Mount, thiab Wave Soldering daim ntawv thov. Qhov dav ntawm cov khoom suav nrog Silver Sinter Technologies, Solder Paste, Solder Preforms, Underfills thiab Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, thiab Stencils.

Flip nti epoxy nplaum nplaum rau kev ruaj ntseg underfill bonding nyob rau hauv nto mount SMT tivthaiv thiab hluav taws xob PCB Circuit Court board

DeepMaterial Chip Underfill Adhesive series yog ib feem, cov ntaub ntawv kho cua sov. Cov ntaub ntawv tau raug optimized rau capillary underfill thiab reworkability. Cov khoom siv epoxy no tuaj yeem muab faib rau ntawm cov npoo ntawm BGA, CSP lossis Flip Chip li. Cov khoom no tom qab ntawd yuav ntws mus rau qhov chaw hauv qab no.

Xws li nws muaj ib qho khoom siv capillary underfill tsim los rau kev tiv thaiv ntawm cov pob khoom sib dhos rau hauv cov ntawv luam tawm hauv Circuit Court.

Nws yog qhov kub hloov pauv iav siab [Tg] thiab qis coefficient thermal expansion [CTE] underfill. Cov yam ntxwv no ua rau muaj kev ntseeg siab daws teeb meem.

khoom nta
· Muab kev tiv thaiv tag nrho thaum xa mus rau lub substrate preheated ntawm 70 - 100 ° C
· Siab Tg thiab qis CTE qhov tseem ceeb tau txhim kho lub peev xwm kom dhau qhov kev ntsuas kub nruj dua
· Cov Kev Ntsuas Kub Kub Zoo Tshaj Plaws Kev Ua Haujlwm Zoo
· Halogen-dawb thiab ua raws li RoHS Cov Lus Qhia 2015/863/EU

Underfill rau Exceptional Thermal Fatigue Resistance
Sawv ib leeg SAC solder pob qij txha nyob rau hauv BGA thiab CSP cov rooj sib txoos yuav fater nyob rau hauv thermally hnyav automotive daim ntaub ntawv. High Tg thiab qis CTE underfill [UF] yog ib qho kev daws teeb meem. Raws li kev rov ua dua tsis yog qhov yuav tsum tau ua, qhov no tso cai rau cov ntsiab lus ntau dua hauv cov qauv tsim los tsim cov yam ntxwv zoo li no.

DeepMaterial Chip Underfill Adhesive series muaj Tg siab ntawm 165 ° C thiab qis CTE1 / CTE2 ntawm 31 ppm / 105 ppm, ntawm kev sib sau ua ke thiab tau raug sim kom dhau 5000 cycles -40 +125 ° C thermal cycling test. Txhawm rau kom zoo dua tus nqi ntws, preheat lub substrates thaum lub sij hawm dispensing.

Peb tseem tab tom nrhiav rau DeepMaterial muaj cov khoom nplaum sib koom tes thoob ntiaj teb, yog tias koj xav ua tus neeg sawv cev ntawm DeepMaterial's:
Kev lag luam nplaum nplaum cov khoom lag luam hauv Asmeskas,
Industrial nplaum nplaum tsum nyob rau hauv cov teb chaws Europe,
Industrial nplaum nplaum tsum nyob rau hauv UK,
Industrial nplaum nplaum tsum nyob rau hauv Is Nrias teb,
Muaj cov nplaum nplaum cov khoom lag luam hauv Australia,
Kev lag luam nplaum nplaum cov khoom lag luam hauv Canada,
Kev lag luam nplaum nplaum cov khoom lag luam hauv South Africa,
Industrial nplaum nplaum tsum nyob rau hauv Nyiv,
Industrial nplaum nplaum tsum nyob rau hauv cov teb chaws Europe,
Muaj cov nplaum nplaum cov khoom lag luam hauv Kauslim,
Muaj cov nplaum nplaum cov khoom lag luam hauv Malaysia,
Muaj cov nplaum nplaum cov khoom lag luam hauv Philippines,
Muaj cov nplaum nplaum cov khoom lag luam hauv Nyab Laj,
Industrial nplaum nplaum tsum nyob rau hauv Indonesia,
Kev lag luam nplaum nplaum cov khoom lag luam hauv Russia,
Kev lag luam nplaum nplaum cov chaw muag khoom hauv Turkey,
......
Hu rau peb tam sim no!