kua nplaum muab kev pabcuam rau cov khoom siv hluav taws xob.
Epoxy-Based Chip Underfill Thiab COB Encapsulation Materials
DeepMaterial muab cov capillary flow underfills tshiab rau flip nti, CSP thiab BGA li. DeepMaterial's tshiab capillary flow underfills yog cov fluidity siab, siab-purity, ib qho khoom siv potting cov ntaub ntawv uas tsim cov khaubncaws sab nraud povtseg, void-free underfill khaubncaws sab nraud povtseg uas txhim kho kev ntseeg siab thiab txhua yam khoom ntawm cov khoom los ntawm kev tshem tawm cov kev ntxhov siab los ntawm cov khoom siv solder. DeepMaterial muab cov qauv rau kev ua kom nrawm nrawm ntawm qhov chaw zoo heev, muaj peev xwm kho tau sai, ua haujlwm ntev thiab ua neej nyob, nrog rau kev ua haujlwm rov ua haujlwm dua. Reworkability txuag cov nqi los ntawm kev tso cai tshem tawm cov underfill rau rov siv lub rooj tsavxwm.
Flip chip los ua ke yuav tsum muaj kev ntxhov siab ntawm lub vuam seam dua rau kev ncua ntev thermal aging thiab lub neej voj voog. CSP los yog BGA lub rooj sib txoos yuav tsum tau siv cov khoom siv hauv qab los txhim kho cov neeg kho tshuab kev ncaj ncees ntawm lub rooj sib txoos thaum lub sij hawm flex, vibration los yog poob kev sim.
DeepMaterial's flip-chip underfills muaj cov ntsiab lus siab muab tub lim thaum tswj ceev ceev hauv qhov me me, nrog lub peev xwm kom muaj qhov kub hloov pauv iav thiab siab modulus. Peb CSP underfills muaj nyob rau hauv ntau theem muab tub lim, xaiv rau lub iav hloov kub thiab modulus rau daim ntawv thov.
COB encapsulant tuaj yeem siv rau kev sib txuas xov hlau los muab kev tiv thaiv ib puag ncig thiab ua kom lub zog muaj zog. Kev tiv thaiv kev sib khi ntawm cov hlua khi hlua khi nrog rau sab saum toj encapsulation, cofferdam, thiab qhov sib txawv filling. Adhesives nrog fine-tuning txaus muaj nuj nqi yuav tsum tau, vim hais tias lawv muaj peev xwm txaus yuav tsum xyuas kom meej tias cov xov hlau yog encapsulated, thiab cov nplaum yuav tsis ntws tawm ntawm lub nti, thiab xyuas kom meej tias yuav siv tau rau zoo heev suab coj.
DeepMaterial's COB encapsulating adhesives tuaj yeem ua thermally lossis UV kho DeepMaterial's COB encapsulation adhesive tuaj yeem kho cua sov lossis UV-kho nrog kev ntseeg siab thiab qis thermal o coefficient, nrog rau cov iav siab hloov pauv kub thiab cov ntsiab lus ion tsawg. DeepMaterial's COB encapsulating adhesives tiv thaiv cov hlau lead thiab plumbum, chrome thiab silicon wafers los ntawm ib puag ncig sab nraud, kev puas tsuaj thiab corrosion.
DeepMaterial COB encapsulating adhesives yog tsim nrog kub-kho epoxy, UV-kho acrylic, los yog silicone chemistry rau hluav taws xob zoo. DeepMaterial COB encapsulating adhesives muaj qhov kub thiab txias ruaj khov thiab thermal poob siab tsis kam, hluav taws xob insulating zog dhau qhov kub thiab txias, thiab qis shrinkage, tsis tshua muaj kev ntxhov siab, thiab tshuaj tiv thaiv thaum kho.
Deepmaterial yog qhov zoo tshaj plaws sab saum toj waterproof structural adhesive kua nplaum rau yas rau hlau thiab iav chaw tsim tshuaj paus, muab cov uas tsis yog conductive epoxy nplaum sealant kua nplaum rau underfill pcb hluav taws xob Cheebtsam, semiconductor nplaum rau hluav taws xob sib dhos, kub kub kho bga flip nti underfill pcb epoxy txheej txheem nplaum nplaum khoom thiab thiaj li. ntawm
DeepMaterial Epoxy Resin Base Chip Hauv qab Filling Thiab Cob Ntim Khoom Xaiv Rooj
Tsawg Kub Curing Epoxy Adhesive Khoom Xaiv
| Khoom Series | khoom npe | Khoom siv raws li kev thov |
| Tsawg kub curing nplaum | DM-6108 |
Tsawg kub curing nplaum, cov ntawv thov raug suav nrog daim npav nco, CCD lossis CMOS sib dhos. Cov khoom no tsim nyog rau kev kho qhov kub thiab txias thiab tuaj yeem muaj qhov adhesion zoo rau ntau yam ntaub ntawv hauv lub sijhawm luv luv. Cov ntawv thov ib txwm suav nrog daim npav nco, CCD / CMOS Cheebtsam. Nws yog qhov tshwj xeeb tshaj yog tsim nyog rau lub sijhawm uas lub caij kub-rhiab heev yuav tsum tau kho ntawm qhov kub thiab txias. |
| DM-6109 |
Nws yog ib qho khoom siv thermal curing epoxy resin. Cov khoom no tsim nyog rau kev kho qhov kub thiab txias thiab muaj qhov zoo adhesion rau ntau yam khoom siv hauv lub sijhawm luv luv. Cov ntawv thov xws li daim npav nco, CCD / CMOS sib dhos. Nws yog tshwj xeeb tshaj yog haum rau daim ntaub ntawv uas tsis tshua muaj curing kub yuav tsum tau rau cov tshav kub-sensitive Cheebtsam. |
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| DM-6120 |
Classic low-temperature curing nplaum, siv rau LCD backlight module los ua ke. |
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| DM-6180 |
Kev kho sai ntawm qhov kub thiab txias, siv rau kev sib dhos ntawm CCD lossis CMOS cov khoom thiab VCM motors. Cov khoom no yog tsim tshwj xeeb rau cov ntawv thov kub-rhiab heev uas yuav tsum tau kho qhov kub thiab txias. Nws tuaj yeem muab cov neeg siv khoom sai sai nrog cov ntawv thov siab, xws li txuas lub teeb diffusion lo ntsiab muag rau LEDs, thiab sib sau cov cuab yeej ntsuas duab (xws li lub koob yees duab modules). Cov khoom no yog dawb los muab kev xav ntau dua. |
Encapsulation Epoxy khoom xaiv
| Khoom kab | Khoom Series | khoom npe | Xim | Hom viscosity (cps) | Pib fixation lub sij hawm / tag nrho fixation | Txoj kev tua | TG/°C | Hardness / D | Khw / ° C / M |
| Epoxy raws | Encapsulation Adhesive | DM-6216 | Dub | 58000-62000 | 150 ° C 20 feeb | Kub curing | 126 | 86 | 2-8/6 MAS |
| DM-6261 | Dub | 32500-50000 | 140 ° C 3H | Kub curing | 125 | * | 2-8/6 MAS | ||
| DM-6258 | Dub | 50000 | 120 ° C 12 feeb | Kub curing | 140 | 90 | -40/6 M | ||
| DM-6286 | Dub | 62500 | 120 ° C 30min1 150 ° C 15 min | Kub curing | 137 | 90 | 2-8/6 MAS |
Underfill Epoxy khoom xaiv
| Khoom Series | khoom npe | Khoom siv raws li kev thov |
| Ua tsis tiav | DM-6307 | Nws yog ib qho khoom siv, thermosetting epoxy resin. Nws yog ib qho rov siv tau CSP (FBGA) lossis BGA muab tub lim siv los tiv thaiv cov pob qij txha los ntawm kev ntxhov siab hauv cov khoom siv hluav taws xob. |
| DM-6303 | Ib qho khoom siv epoxy resin nplaum yog cov khoom ntim uas tuaj yeem rov siv tau hauv CSP (FBGA) lossis BGA. Nws kho sai sai li sai tau thaum nws rhuab. Nws yog tsim los muab kev tiv thaiv zoo los tiv thaiv kev ua tsis tiav vim kev ntxhov siab ntawm cov neeg kho tshuab. Tsawg viscosity tso cai rau sau qhov khoob hauv CSP lossis BGA. | |
| DM-6309 | Nws yog kev kho sai, nrawm nrawm ua kua epoxy resin tsim rau capillary txaus ntim cov pob ntim loj, yog txhawm rau txhim kho cov txheej txheem nrawm hauv kev tsim khoom thiab tsim nws cov qauv tsim, cia nws nkag mus rau 25μm tshem tawm, txo qis kev ntxhov siab, txhim kho qhov kub thiab txias kev ua haujlwm, nrog rau tshuaj tiv thaiv zoo heev. | |
| TIAB SA - 6308 | Classic underfill, ultra-low viscosity haum rau feem ntau underfill daim ntaub ntawv. | |
| DM-6310 | Cov epoxy primer rov siv tau yog tsim los rau CSP thiab BGA daim ntawv thov. Nws tuaj yeem kho tau sai ntawm qhov kub nruab nrab kom txo tau qhov siab ntawm lwm qhov chaw. Tom qab kho, cov khoom muaj cov khoom siv zoo heev thiab tuaj yeem tiv thaiv cov pob qij txha thaum lub sij hawm thermal cycling. | |
| DM-6320 | Cov khoom siv rov qab siv tau tshwj xeeb yog tsim los rau CSP, WLCSP thiab BGA daim ntawv thov. Nws cov mis yog kho sai sai ntawm qhov kub nruab nrab kom txo tau kev ntxhov siab ntawm lwm qhov chaw. Cov khoom siv muaj qhov kub hloov pauv ntawm iav siab dua thiab muaj zog tawg ntau dua, thiab tuaj yeem muab kev tiv thaiv zoo rau cov pob qij txha thaum lub sij hawm thermal cycling. |
DeepMaterial Epoxy Based Chip Underfill Thiab COB Ntim Cov Ntaub Ntawv Cov Ntaub Ntawv
Low Temperature Curing Epoxy Adhesive Product Data Sheet
| Khoom kab | Khoom Series | khoom npe | Xim | Hom viscosity (cps) | Pib fixation lub sij hawm / tag nrho fixation | Txoj kev tua | TG/°C | Hardness / D | Khw / ° C / M |
| Epoxy raws | Tsawg kub curing encapsulant | DM-6108 | Dub | 7000-27000 | 80 ° C 20min 60 ° C 60 feeb | Kub curing | 45 | 88 | -20/6 M |
| DM-6109 | Dub | 12000-46000 | 80 ° C 5-10 min | Kub curing | 35 | 88A | -20/6 M | ||
| DM-6120 | Dub | 2500 | 80 ° C 5-10 min | Kub curing | 26 | 79 | -20/6 M | ||
| DM-6180 | Dawb | 8700 | 80 ° C 2 feeb | Kub curing | 54 | 80 | -40/6 M |
Encapsulated Epoxy Adhesive Product Data Sheet
| Khoom kab | Khoom Series | khoom npe | Xim | Hom viscosity (cps) | Pib fixation lub sij hawm / tag nrho fixation | Txoj kev tua | TG/°C | Hardness / D | Khw / ° C / M |
| Epoxy raws | Encapsulation Adhesive | DM-6216 | Dub | 58000-62000 | 150 ° C 20 feeb | Kub curing | 126 | 86 | 2-8/6 MAS |
| DM-6261 | Dub | 32500-50000 | 140 ° C 3H | Kub curing | 125 | * | 2-8/6 MAS | ||
| DM-6258 | Dub | 50000 | 120 ° C 12 feeb | Kub curing | 140 | 90 | -40/6 M | ||
| DM-6286 | Dub | 62500 | 120 ° C 30min1 150 ° C 15 min | Kub curing | 137 | 90 | 2-8/6 MAS |
Daim ntawv qhia txog Epoxy Adhesive Product Data Sheet
| Khoom kab | Khoom Series | khoom npe | Xim | Hom viscosity (cps) | Pib fixation lub sij hawm / tag nrho fixation | Txoj kev tua | TG/°C | Hardness / D | Khw / ° C / M |
| Epoxy raws | Ua tsis tiav | DM-6307 | Dub | 2000-4500 | 120 ° C 5min 100 ° C 10 feeb | Kub curing | 85 | 88 | 2-8/6 MAS |
| DM-6303 | Opaque creamy yellow kua | 3000-6000 | 100 ° C 30min 120 ° C 15min 150 ° C 10min | Kub curing | 69 | 86 | 2-8/6 MAS | ||
| DM-6309 | Cov kua dej dub | 3500-7000 | 165 ° C 3min 150 ° C 5 feeb | Kub curing | 110 | 88 | 2-8/6 MAS | ||
| DM-6308 | Cov kua dej dub | 360 | 130 ° C 8min 150 ° C 5 feeb | Kub curing | 113 | * | -20/6 M | ||
| DM-6310 | Cov kua dej dub | 394 | 130 ° C 8 feeb | Kub curing | 102 | * | -20/6 M | ||
| DM-6320 | Cov kua dej dub | 340 | 130 ° C 10min 150 ° C 5min 160 ° C 3min | Kub curing | 134 | * | -20/6 M |
