Chip Underfill / Ntim
Chip Manufacturing txheej txheem thov ntawm DeepMaterial Adhesive Products
Semiconductor Ntim
Semiconductor technology, tshwj xeeb tshaj yog cov ntim ntawm cov khoom siv semiconductor, tsis tau kov cov ntawv thov ntau dua li niaj hnub no. Raws li txhua yam ntawm lub neej niaj hnub dhau los ua digital-los ntawm lub tsheb mus rau kev ruaj ntseg hauv tsev mus rau smartphones thiab 5G infrastructure-semiconductor ntim innovation yog lub hauv paus ntawm kev teb, txhim khu kev qha, thiab muaj zog hluav taws xob muaj peev xwm.
Thinner wafers, me me qhov ntev, finer pitches, pob kev koom ua ke, 3D tsim, wafer-theem technologies thiab kev lag luam ntawm teev nyob rau hauv loj ntau lawm yuav tsum tau cov ntaub ntawv uas yuav txhawb innovation ambitions. Henkel tag nrho cov kev daws teeb meem kom tau txais txiaj ntsig thoob ntiaj teb cov peev txheej kom xa cov khoom ntim khoom siv semiconductor zoo dua thiab cov nqi sib tw. Los ntawm kev tuag txuas cov nplaum rau cov khoom siv hluav taws xob ib txwm siv rau cov khoom siv hauv qab thiab cov khoom siv rau cov ntawv ntim siab heev, Henkel muab cov cuab yeej siv thev naus laus zis thiab kev txhawb nqa thoob ntiaj teb xav tau los ntawm cov tuam txhab microelectronics.
Flip Chip Underfill
Lub underfill yog siv rau txhua yam stability ntawm flip nti. Qhov no yog qhov tseem ceeb tshwj xeeb tshaj yog thaum soldering pob grid array (BGA) chips. Txhawm rau txo cov coefficient ntawm thermal expansion (CTE), cov nplaum yog ib nrab ntim nrog nanofillers.
Adhesives siv raws li nti underfills muaj capillary txaus zog rau daim ntawv thov sai thiab yooj yim. Ib qho kev kho dual-kho nplaum feem ntau yog siv: thaj chaw ntug tau tuav hauv qhov chaw los ntawm UV kho ua ntej qhov chaw ntxoov ntxoo yog thermally kho.
Deepmaterial yog tsis tshua muaj kub kho bga flip nti underfill pcb epoxy txheej txheem nplaum nplaum cov ntaub ntawv chaw tsim tshuaj paus thiab kub-resistant underfill txheej khoom, muab ib tug tivthaiv epoxy underfill compounds, epoxy underfill encapsulant, underfill encapsulation cov ntaub ntawv rau ntxeev nti nyob rau hauv pcb hluav taws xob Circuit Court board, epoxy- raws li chip underfill thiab cob encapsulation cov ntaub ntawv thiab lwm yam.