BGA Pob Underfill Epoxy
Siab Fluidity
Siab Phem
Txoj kev sib tw
Cov khoom siv hluav taws xob ntawm aerospace thiab navigation, lub cev muaj zog, tsheb, sab nraum zoov LED teeb pom kev zoo, hnub ci zog thiab tub rog kev lag luam nrog cov kev xav tau siab, cov khoom siv pob array (BGA / CSP / WLP / POP) thiab cov cuab yeej tshwj xeeb ntawm lub rooj tsav xwm hluav taws xob yog tag nrho cov khoom siv hluav taws xob. Cov qauv ntawm miniaturization, thiab nyias PCBs nrog lub thickness tsawg dua 1.0mm los yog hloov tau yooj yim high-density los ua ke substrates, solder pob qij txha ntawm cov khoom siv thiab substrates ua tsis yooj yim nyob rau hauv txhua yam thiab thermal stress.
Solutions
Rau BGA ntim, DeepMaterial muab cov txheej txheem kev daws teeb meem - lub capillary flow underfill. Cov muab tub lim tau muab faib thiab siv rau ntawm ntug ntawm cov khoom sib dhos, thiab "cov nyhuv capillary" ntawm cov kua yog siv los ua cov kua nplaum nkag mus rau hauv qab ntawm cov nti, thiab tom qab ntawd rhaub kom sib xyaw ua ke nrog cov nti substrate, solder pob qij txha thiab PCB substrate.
DeepMaterial underfill txheej txheem zoo
1. High fluidity, siab purity, ib tug-khoom, ceev filling thiab ceev curing muaj peev xwm ntawm tsis tshua muaj zoo-pitch Cheebtsam;
2. Nws tuaj yeem tsim cov txheej txheem tsis zoo thiab tsis muaj qhov khoob hauv qab, uas tuaj yeem tshem tawm cov kev ntxhov siab los ntawm cov khoom siv vuam, txhim kho kev ntseeg tau thiab cov khoom siv kho tshuab ntawm cov khoom, thiab muab kev tiv thaiv zoo rau cov khoom los ntawm kev poob, sib tw, kev vibration, noo noo. , lwm.
3. Lub kaw lus tuaj yeem kho tau, thiab cov khoom siv hluav taws xob tuaj yeem rov qab siv tau, uas txuag tau nyiaj ntau heev.
Deepmaterial yog tsis tshua muaj kub kho bga flip nti underfill pcb epoxy txheej txheem nplaum nplaum cov ntaub ntawv chaw tsim tshuaj paus thiab kub-resistant underfill txheej khoom, muab ib tug tivthaiv epoxy underfill compounds, epoxy underfill encapsulant, underfill encapsulation cov ntaub ntawv rau ntxeev nti nyob rau hauv pcb hluav taws xob Circuit Court board, epoxy- raws li chip underfill thiab cob encapsulation cov ntaub ntawv thiab lwm yam.
