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ʻoi aku ka maikaʻi o nā mea hana hoʻopili uila uila

ʻOi aku ka maikaʻi o ka insulating epoxy adhesive glue no ka metala a me ka metala ikaika

ʻO ke kāpili epoxy hoʻokaʻawale maikaʻi loa no ka metala a me nā mea paʻa ikaika ʻO ka metala kekahi o nā mea maʻamau a puni mākou. I kēia lā, hoʻohana ʻia ia e hana i nā mea hana, nā mīkini nui, a me nā mea hoʻonaninani, a me nā mea ʻē aʻe. ʻO ka loaʻa ʻana o ka epoxy adhesive maikaʻi loa no ka metala he mea nui e hoʻokō i ka paʻa kūpono. Epoxy...

ʻoi aku ka maikaʻi o china Uv curing adhesive manufacturers

Pehea e ʻike ai i ka puʻupuʻu pili pono no ka chip kāleka akamai a me ka microchip

Pehea e ʻike ai i ka puʻupuʻu pili puʻupuʻu pono no ka chip kāleka akamai a me ka microchip I ka hoʻokomo ʻana i ka chip flip, pono e hoʻohuli ʻia ka chip i pili pono ka mea hoʻopili me ka papa kaapuni. Hāʻawi kēia i ka hui puʻupuʻu liʻiliʻi a me ka nui o ka hōʻailona pololei. I ka hui ʻana o ka chip, ...

ʻOi aku ka maikaʻi o nā mea hana hoʻopili uila uila kiʻekiʻe

ʻO kahi hiʻohiʻona o ka BGA Underfill Process a Non Conductive Via Fill

ʻO kahi ʻike o ka BGA Underfill Process and Non Conductive Via Fill Flip chip packaging e hōʻike ana i nā chips i ke koʻikoʻi mechanical no ka nui o ka coefficient thermal expansion mismatch ma waena o nā chips silicon a me ka substrate. Ke loaʻa kahi haʻahaʻa wela kiʻekiʻe, hoʻoikaika ka mismatch i nā chips, no laila e hoʻolilo i ka hilinaʻi i mea hopohopo....

ʻoi aku ka maikaʻi o ka mea hana uila uila

Pehea e hoʻohana ai i ka smt underfill epoxy adhesive i nā noi like ʻole

Pehea e hoʻohana ai i ka smt underfill epoxy adhesive i nā noi like ʻole ʻo Underfill kahi ʻano polymer wai i hoʻopili ʻia i nā PCB ma hope o ke kaʻina hana reflow. Ma hope o ka waiho ʻia ʻana o ka underfill, a laila ʻae ʻia e hoʻōla, e hoʻopili ana i ka ʻaoʻao lalo o kahi puʻupuʻu e uhi ana i nā pads interconnected palupalu ma waena o ka ...

ʻOi aku ka maikaʻi o ka photovoltaic solar panel bonding adhesive and sealants manufacturers

Flip Chip Packaging Underfill Bonding Adhesive Die Attach a me kona mau pono

ʻO Flip Chip Packaging Underfill Bonding Adhesive Die Attach A ʻO kāna mau pono ʻO Flip chip kahi ʻano hana e hoʻopili ai i ka make. Ma kēia ʻano hoʻopili, hana pololei ʻia nā pilina uila ma waena o ka substrate a me ka chip ma o ka hoʻohuli ʻana o ka make me ke alo i lalo i ka pūʻolo. ʻO nā puʻupuʻu conductive ...

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