Chip Underfill / Packaging
Hoʻohana ʻia ke kaʻina hana chip no nā huahana adhesive DeepMaterial
Pākuʻi Semiconductor
ʻO ka ʻenehana Semiconductor, ʻoi aku ka paʻa o nā mea semiconductor, ʻaʻole i hoʻopā i nā noi ʻoi aku ma mua o kēia lā. Ke ulu nui nei nā ʻano o ke ola o kēlā me kēia lā-mai nā kaʻa a hiki i ka palekana home a hiki i nā smartphones a me nā ʻōnaehana 5G-ʻo ka semiconductor packaging innovations aia ma ka puʻuwai o ka pane, hilinaʻi, a me ka mana uila.
ʻO nā wafers lahilahi, liʻiliʻi liʻiliʻi, nā pitch ʻoi aku ka maikaʻi, ka hoʻohui pū ʻana, ka hoʻolālā 3D, nā ʻenehana pae wafer a me nā ʻoihana waiwai i ka hana nui e koi i nā mea hiki ke kākoʻo i nā manaʻo hou. Hoʻohana ka huina hoʻonā ʻo Henkel i nā kumu waiwai nui o ka honua e hoʻopuka i ka ʻenehana mea hoʻopihapiha semiconductor kiʻekiʻe a me ka hana hoʻokūkū kūʻai. Mai ka die attach adhesives no ka hoʻopili uea kuʻuna a hiki i nā underfills kiʻekiʻe a me nā encapsulants no nā noi hoʻopihapiha holomua, hāʻawi ʻo Henkel i ka ʻenehana ʻokiʻoki a me ke kākoʻo honua e koi ʻia e nā hui microelectronics alakaʻi.
Flip Chip Underfill
Hoʻohana ʻia ka underfill no ka paʻa ʻana o ka mīkini paʻa. He mea koʻikoʻi kēia i ka wā e kūʻai ai i nā ʻāpana pōpō pōlele (BGA). No ka ho'ēmiʻana i ka coefficient o ka hoʻonui wela (CTE), ua hoʻopiha pihaʻia ka mea hoʻopili me nā nanofillers.
ʻO nā mea hoʻopili i hoʻohana ʻia e like me ka chip underfills he mau waiwai kahe capillary no ka noi wikiwiki a maʻalahi. Hoʻohana mau ʻia ka lāʻau lapaʻau ʻelua: mālama ʻia nā ʻāpana e ka hoʻōla ʻana o UV ma mua o ka hoʻōla wela ʻana o nā wahi i malu.
ʻO ka Deepmaterial ka lāʻau haʻahaʻa haʻahaʻa bga flip chip underfill pcb epoxy process adhesive glue material mea hana a me nā mea hoʻolako mea hoʻopihapiha hoʻopihapiha hoʻopihapiha hoʻopihapiha, hoʻolako i hoʻokahi ʻāpana epoxy underfill pūhui, epoxy underfill encapsulant, underfill encapsulation mea no ka flip chip i ka pcb electronic circuit board, epoxy- e pili ana i ka chip underfill a me nā mea encapsulation cob a pēlā aku.
