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Noi Hoopili Hana

ʻO DeepMaterial ka lāʻau haʻahaʻa haʻahaʻa bga flip chip underfill pcb epoxy kaʻina adhesive glue mea hana mea hana, hoʻolako i nā mea hana ʻenehana i hoʻopaʻa ʻia epoxy adhesive glue, haʻahaʻa refractive index epoxy resin adhesive glue, kiʻekiʻe refractive index optical adhesive glue, maikaʻi ke kāpili no ka magnet i ka metala plastik a me ke aniani. i nā kaʻa uila a me ka microelectronic

Hāʻawi ʻo Deepmaterial i nā mea hoʻopili uila a me nā kiʻi ʻoniʻoni ʻoniʻoni ʻoniʻoni ʻoniʻoni a me nā hopena no nā ʻoihana kikowaena kamaʻilio, nā ʻoihana uila mea kūʻai aku, nā ʻāpana semiconductor a me nā ʻoihana hoʻāʻo, a me nā mea hana kamaʻilio, e hoʻoponopono i nā mea kūʻai aku i ʻōlelo ʻia i ka pale kaʻina, nā huahana paʻa kiʻekiʻe. , a me ka hana uila. Ke koi hoʻololi home no ka pale, pale optical, etc.

Nānā o nā noi no nā mea hoʻopili
Nui nā hoʻohana ʻana o nā mea hoʻopili ʻoihana. Hōʻike ʻia kēia ma ka laulā huahana o Deepmaterial, e hāʻawi ana i ka hopena kūpono no kēlā me kēia noi hoʻopili.

ʻO nā māhele nui o ka noi:

I kēlā me kēia lā, hilinaʻi kā mākou mea kūʻai aku iā mākou e hāʻawi i nā hopena hou e hoʻomaikaʻi i ka hana holoʻokoʻa o kā lākou huahana. ʻO ka ʻike a me ke alakaʻi ʻoihana ʻo Deepmaterial e ʻae iā mākou e hoʻomohala i nā ʻenehana ʻokiʻoki a me nā hoʻonā i hōʻoia ʻia e hāʻawi i nā hopena ma waena o nā mākeke ākea. Ma o ka noiʻi mau ʻana i kēia mau wahi, ke hoʻomau mau nei mākou i ka hoʻomaikaʻi ʻana i nā kaʻina hana hou e hāʻawi i nā hopena āu e pono ai.

Hoʻoikaika mākou i ka hoʻomaikaʻi ʻana i kāu mau huahana a hoʻomaikaʻi i kāu kaʻina hana.

ʻAʻole hāʻawi wale ʻo Deepmaterial i kahi ākea ākea o nā mea hoʻopili ʻenehana, akā he lawelawe kūkākūkā adhesive hoʻi, e noʻonoʻo ana i nā pono o ka mea kūʻai aku. Kūkākūkā kā mākou poʻe ʻenekini noi adhesive i nā hui me kā lākou mau koi ponoʻī a kākoʻo iā lākou i ka loaʻa ʻana o ka hopena paʻi paʻakikī kūpono no kā lākou noi a me ka hana.

ʻO nā mea hoʻopili maikaʻi loa no ka uila
I kēia ao o ka uila, ʻo ka pahuhopu ka hōʻoia ʻana e hoʻokō ʻia nā manaʻolana o nā mea hoʻohana hope me ka ʻole o ke kuʻikahi. Ke hana nei nā mea hana o kēia mau mea hana / mea hana i nā mea āpau e hiki ai ke hōʻoia e hoʻohana lākou i nā mea maikaʻi loa. ʻO kahi laʻana maʻamau he adhesives.

Inā ʻaʻole ʻoe i ʻike, ʻaʻole hiki ke nānā ʻole ʻia nā kuleana o nā mea hoʻopili i nā mea uila. No ka laʻana, kūpono lākou no ka hoʻopili ʻana i nā ʻāpana e like me ka wela wela, nā pūʻolo, nā substrates, nā ʻāpana, a me ka make semi-conductor. ʻO ka ʻōlelo maʻamau, hoʻohana ʻia nā adhesives no ka hoʻopaʻa ʻana i nā ʻāpana mauna i luna, ka ipuhao a me ka hoʻopaʻa ʻana i ka uea.

He aha kāu e ʻike ai
ʻO ka pahuhopu nui o kēia pou ʻo ia ka hōʻike ʻana i kekahi o nā ʻano adhesive maikaʻi loa i hoʻohana ʻia i ka hana ʻana i nā uila. I ka hopena, e ʻike ʻoe i ke kumu ʻo DeepMaterial kekahi o nā ʻoihana kaulana a hilinaʻi e kiʻi i kēlā mau mea mai.

Nā mea hoʻopili UV Curing
Hiki ke kapa ʻia kēia mau mea he lāʻau hoʻōla māmā. I kēia hihia, hoʻomaka ka hana ma o ke kukui UV. Hiki ke hana ia ma o nā kumu radiation ʻē aʻe. Hoʻokumu pinepine ʻia ka paʻa paʻa me ka hoʻohana ʻole ʻia o ka wela. Loaʻa i nā adhesives curing UV kahi mea i kapa ʻia ʻo "photochemical promoter". Ma hope o ka hahau ʻia ʻana e ke kukui UV, ʻo ia (ka mea hoʻolaha) e hoʻohaʻahaʻa i nā radical manuahi. ʻO kekahi mau hoʻohana ʻana i nā adhesives curing UV e pili ana i nā mea uila he encapsulating, masking, gasketing, potting, component marking, bonding and assembling.

ʻO nā mea hoʻopili i hoʻopili ʻia
He mea pono loa keia mau ano adhesive. No ka laʻana, hāʻawi lākou i ka pale kiʻekiʻe loa i nā kaʻa uila mai nā kaiapuni i ʻike ʻole ʻia. Ma muli paha o ke kiʻekiʻe o ka haʻahaʻa, nā ʻano wela like ʻole a me nā mea haumia ea. ʻO nā ʻano like ʻole o nā ʻano like ʻole e like me ka parylene (XY), silicone resin (SR), acrylic resin (AR), epoxy resin (ER), a me ka urethane resin (UR).

Nā Paʻa Paʻa Kūleʻa
Pono kēia mau mea hoʻopili i ka wā e hoʻopaʻa pū ai i nā substrate. He ʻelua a ʻoi aʻe paha nā substrate i pilikia. I ka pōkole, ʻo kā lākou hana nui ka hoʻopaʻa ʻana i nā hono. I ka hapanui o nā hihia, he mea nui nā hono i ka hana holoʻokoʻa a me ke ʻano o kahi huahana. Hiki ke hōʻoia i ka pōʻino ke hāʻule ʻole. ʻO nā mea hoʻopaʻa hoʻopaʻa hale e pale aku i ka hana ʻana.

Pehea e loaʻa ai kēia mau mea hoʻopili āpau
Hoʻokahi mea e kūʻai ai i nā mea hoʻopili. Eia naʻe, he mea ʻokoʻa loa ka lawelawe ʻana i kā lākou kumu. ʻO DeepMaterial kahi kūpono e kūʻai ai i nā mea hoʻopili o ka maikaʻi maikaʻi. Hoʻohana ʻia kēia e nā mea hana uila kiʻekiʻe mai nā wahi like ʻole o ka honua. No nā makahiki, ua hoʻokō mākou e hui pū i kekahi o nā huahana maikaʻi loa a me nā hoʻonā e like me Glass fiber adhesive, BGA package ma lalo o ka hoʻopiha, a me nā mea hou aku. Hiki ke hoʻohana ʻia kā mākou huahana no nā ʻano noi like ʻole e like me nā smartphones, nā mea hana hale, nā mea uila uila, a me nā kamepiula.

Makemake ʻoe i ke kākoʻo adhesive? E kiʻi aku i kā mākou mau loea hoʻopili!
Ke kōkua nei kā mākou poʻe loea kikowaena noi i nā ʻoihana a puni ka honua e hoʻomaikaʻi i nā kaʻina hana a hoʻomaikaʻi i ka hana a me ke ʻano o kā lākou huahana.

Inā ʻoe e ʻimi nei i kahi koho ʻē aʻe i nā ʻenehana hoʻohui kuʻuna e like me nā screws, rivets, a i ʻole ke kolu wai, a i ʻole e pilikia ana ʻoe i ka loaʻa ʻana o ka mea hoʻopili kūpono no kāu noi kikoʻī, hiki i kā mākou mau kūkākūkā pili ke kōkua i ka hāʻawi ʻana i ka ʻōlelo aʻo kūpono a me ka ʻike. E aʻo mai kā mākou hui pehea e loaʻa ai nā hopena hoʻopili kūpono no nā ʻano hoʻopili like ʻole e like me ka gluing, masking, packaging, fastening, repairing, marking, protecting and bundling.

E hoʻohana i ka palapala hoʻokaʻaʻike ma lalo nei e aʻo hou aʻe e pili ana i kā mākou lawelawe hoʻopili a loaʻa i ke kōkua me kāu mau nīnau noi.