Hybrid microelectronic semiconductor make i hoʻopili ʻia i nā mea hoʻopili a me nā encapsulants i ka hana hou.

Microelectronics adhesives a me nā encapsulants pono i ka wā e hui ai. Ua komo ikaika ʻo DeepMaterial i ka hoʻomohala ʻana i nā ʻano hana maikaʻi loa i hiki ke hoʻohana ʻia no ka hana ʻana i nā mea hana pono, maʻalahi, wikiwiki, māmā, ʻoi aku ka lahilahi, a me nā mea liʻiliʻi. Ua loaʻa i ka Microelectronics ka kaulana nui i ka ʻoihana. Ua komo mai nā mea hana e hoʻomāʻona i ka piʻi ʻana o ka noiʻi ʻoihana a me nā mea kūʻai aku no nā huahana.

Nā mea hoʻopili a me nā mea hou

ʻO ka hana hou ʻana a me ka ʻenehana ʻokiʻoki i kumu i ka hiki a me ka hilinaʻi o kēia mau ʻōnaehana. ʻO Microelectronics i kēia manawa he mea pāʻani nui i ka kamaʻilio a me ka pūnaewele, ʻenehana waiwai kūlohelohe, mining, space and military applications, transport and automotive system, energy, and medical diagnostic equipment.

Ua hiki ke hoʻomohala i kēia mau wahi ma ka hoʻokomo ʻana i ka mea maikaʻi loa microelectronics adhesives a me nā encapsulants. He kōkua nui nā mea hoʻopili i nā mea hoʻomohala uila e like me nā mea paʻi, nā mea hana hale, nā mea leo leo, nā consoles pāʻani, nā kelepona paʻa lima, nā kamepiula, nā mea ʻike, nā mea hiki ke hoʻohana ʻia, a me nā kiʻi kiʻi kiʻi.

PCBs

Nui nā pilikia hoʻokele wela i kēia manawa i nā PCB i hoʻopiha piha ʻia i nā hoʻolālā miniaturized. He mea nui e hoʻohana i ka thermally conductive microelectronics adhesives a me nā encapsulants ma keia hihia. Hiki i ia mau haku mele ke hana me ka wela loa o nā ʻāpana koʻikoʻi a i ka manawa like e hoʻonui i ka wikiwiki o ka hana ʻana ma o ka hoʻohana ʻana i nā mea hoʻopili wela. Me ia mau mea, hoʻomaikaʻi ʻia ke ola o nā mea i nīnau ʻia a me kā lākou hoʻokūkū me nā makana huahana like ʻole.

Ma nā noi microelectronic, hiki ke hoʻokō i ka mana nui loa i ka hana ʻana i nā huahana hou aʻe. Me nā mea hoʻopili maikaʻi loa ma kēia wahi, ʻaʻohe palena. Kōkua nā adhesives e hana:

• Antenna akamai
• Hoʻohui 3D
• Mea uila ʻōmaʻomaʻo
• Kāiu keleponaʻole
• Kaʻikepiliʻikepili
• ʻEnehana hiki ke komo
• Uila uila
• Kapua Me
• Internet o na mea

I kēia mau lā, he nui nā hana a nā adhesives i ka hana ʻana i nā microelectronics, a ʻaʻole hiki ke mālama ʻia kēia ʻoiaʻiʻo. Hiki ke hoʻohana ʻia nā mea like ʻole no ka hoʻohui ʻana i nā ʻāpana a hiki i ka hoʻopili ʻana. Hiki nō hoʻi i ka ipuhao me ka hoʻohana ʻana i nā pūhui potting, encapsulants, a me nā mea hoʻopili polymeric. No nā ʻāpana kaʻa, hiki ke hoʻohana ʻia ka silicone gel e pale aku iā lākou. He koho maʻalahi kēia a pale i ke kaapuni holoʻokoʻa mai ka wai.

Pono no ka hoʻopili ʻana a me ka encapsulation

I nā microelectronics, pono nā adhesives a me nā encapsulants a he ʻāpana o ka kūleʻa o ia ʻōnaehana. Aia kekahi mau manawa a mākou e hana ai i nā ʻōnaehana pono e hoʻohana ʻia i nā wahi haʻalulu kiʻekiʻe a haʻalulu. Ma ia ʻano, pono ka encapsulation e hoʻokō i ka hana hilinaʻi a paʻa.

Pono e noʻonoʻo ʻia ka hoʻolālā ʻana o ka hui kino, a me nā waiwai encapsulant, i ka wā e piʻi mai ai me ka hoʻolālā ʻōnaehana. Eia kekahi, pono ʻoe e noʻonoʻo i ke alapine a me ka nui o ka ukana inertial.

Hoʻomaikaʻi maikaʻi ka paʻa o ka haʻalulu a me ka haʻalulu ke mālama ʻia ka liʻiliʻi o ka nui a me ke kino o ka ʻōnaehana holoʻokoʻa. Hoʻemi kēia i ka ikaika inertial a hoʻonui i ka ʻoʻoleʻa. Me ka ʻōnaehana maikaʻi loa, mālama ʻia kāu microelectronic i kahi kūlana maikaʻi loa.

Ma DeepMaterial, loaʻa iā mākou kahi ākea o nā microelectronic adhesives a me nā encapsulants āu e noʻonoʻo ai. ʻO kā mākou mau huahana ka mea kiʻekiʻe loa, a aia mākou i ke poʻo i ke kani ʻana i nā mea hou aku i nā ʻoihana like ʻole ma o ka hāʻawi ʻana i nā hopena mau loa.

No ka ʻike hou aku e pili ana i ka hybrid microelectronic semiconductor make attached adhesives a me nā encapsulants i ka hana hou, hiki iā ʻoe ke kipa i DeepMaterial ma https://www.epoxyadhesiveglue.com/thermally-conductive-microelectronics-adhesives-and-encapsulants-bonding-in-microelectronics-and-photonics/ no ka mea,ʻike'ē aʻe.