Epoxy Underfill
DeepMaterial, ma ke ʻano he mea hana epoxy adhesive ʻoihana, ua nalowale mākou i ka noiʻi e pili ana i ka underfill epoxy, non conductive glue no ka uila, non conductive epoxy, adhesives no ka hui uila, underfill adhesive, high refractive index epoxy. Ma muli o kēlā, loaʻa iā mākou ka ʻenehana hou o ka ʻenehana epoxy adhesive.
Ua hoʻomohala ʻo DeepMaterial i nā mea hoʻopili ʻoihana no ka hōʻiliʻili chip a me ka hoʻāʻo ʻana, nā mea hoʻopili papa kaapuni, a me nā mea hoʻopili no nā huahana uila. Ma muli o nā adhesives, ua hoʻomohala ʻo ia i nā kiʻiʻoniʻoni pale, nā mea hoʻopihapiha semiconductor, a me nā mea hoʻopihapiha no ka hoʻoheheʻe ʻana i ka wafer semiconductor a me ka hōʻiliʻili chip a me ka hoʻāʻo.
No ka hāʻawi ʻana i nā mea hoʻopili uila a me nā mea hoʻohana uila kiʻiʻoniʻoni ʻoniʻoni a me nā hopena no nā ʻoihana kikowaena kamaʻilio, nā ʻoihana uila uila, nā ʻāpana semiconductor a me nā ʻoihana hoʻāʻo, a me nā mea hana mea kamaʻilio, e hoʻoponopono i nā mea kūʻai aku i ʻōlelo ʻia ma luna o ke kaʻina hana, nā huahana kiʻekiʻe kiʻekiʻe. , a me ka hana uila.
Hāʻawi ʻo DeepMaterial i nā ʻano huahana like ʻole e pili ana i ka hoʻopili ʻenehana no ka uila, UV curing UV adhesive series, reactive type of hot melt adhesive and pressure sensitive hot melt adhesiveseries, epoxy-based chip underfill a me COB encapsulation material series, circuit board protection potting and conformal coating adhesive. series, epoxy based conductive silver adhesive moʻo, structural bonding adhesive series, functional film moʻo pale, semiconductor pale pale kiʻiʻoniʻoni.
ʻO DeepMaterial ka mea ʻoi aku ka maikaʻi o kahi hui epoxy underfill encapsulants mea hoʻolako ma Kina, hoʻolako ma kahi ʻāpana epoxy underfill no nā polokalamu kīpē kīpē pōleʻa kiʻi kiʻekiʻe chip scale packaging csp bga wlcsp lga, hoʻōla haʻahaʻa haʻahaʻa bga flip chip underfill pcb epoxy process adhesive glue material, non conductive epoxy pipili hoʻopili paʻa no ka underfill pcb mea uila, semiconductor adhesives no ka hui uila. a laila
