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Nā hihia hoʻopili honua

E hoʻokumu ʻo DeepMaterial i kahi wā e hiki mai ana ma o ke kemika me nā hoa pili honua

Ke hoʻohana nei i ka mana o ke kemika a me ka ʻenehana, ma hope e hana i kahi mea hou. Hoʻohana mākou i kā mākou ʻenehana synthesis hōʻiliʻili e hoʻomohala i nā huahana kūʻokoʻa e like me nā ʻano epoxy resins kūikawā kūikawā a me nā polymers acrylic hana.

Hāʻawi mākou i kahi ākea o nā huahana e kākoʻo ana i ka hana hou me ka hoʻohana ʻana i ka ʻenehana hoʻomohala kiʻekiʻe e loaʻa ai ka hapa nui o nā mea. Hāʻawi mākou i kā mākou mea kūʻai aku me ka wikiwiki a me ka noi ʻana ma o ka hoʻohana ʻana i ka ʻike me ka fermentation a mākou i hoʻomohala ai i nā makahiki he nui a me kā mākou waihona nui o nā enzymes-based actinomycete.

ʻO DeepMaterial ka polyurethane reactive PUR wela wela hoʻoheheʻe kaomi ʻana i nā mea hoʻopili a me ka mea hoʻolako, hana i hoʻokahi mea epoxy underfill adhesives, hoʻoheheʻe wela adhesives glue, uv curing adhesives, kiʻekiʻe refractive index optical adhesive, magnet hoʻopaʻa paʻa ʻana, ʻoi aku ka maikaʻi o ka wai hoʻoheheʻe hoʻoheheʻe ʻia no ka plastic a me ke kila. a me ke aniani, nā mea hoʻopili uila no nā kaʻa uila a me nā kaʻa micro i ka mea hana hale

ʻO DeepMaterial ka mea ʻoi aku ka maikaʻi o ka hoʻopili ʻana i ka wai no ka plastic a me ka mea hana aniani, hoʻolako i ka epoxy adhesive sealant glue non conductive no ka underfill pcb electronic component, semiconductor adhesives no ka hui uila, haʻahaʻa haʻahaʻa haʻahaʻa hoʻōla bga flip chip underfill pcb epoxy adhesive glue material a pēlā aku. ma