Ka hihia ma ʻAmelika: ʻAmelika Hui Pū ʻIa Chip Underfill Solution
Ma ke ʻano he ʻāina ʻenehana kiʻekiʻe, nui nā hui BGA, CSP a i ʻole Flip Chip i USA, no laila makemake nui ʻia nā mea hoʻopili underfill.
ʻO kekahi o kā mākou mea kūʻai mai nā hui ʻenehana kiʻekiʻe o USA, hoʻohana lākou i ka hopena DeepMaterial underfill no kā lākou chip underfill, a he hana maikaʻi loa ia.
Hāʻawi ʻo DeepMaterial i nā mea hana kiʻekiʻe no ka Sintering a Die Attach, Surface Mount, a me nā noi Wave Soldering. ʻO ka laulā o nā huahana e pili ana i nā ʻenehana Sinter kālā, Solder Paste, Solder Preforms, Underfills and Edgebond, Soldering Alloys, Liquid Soldering Flux, Cored Wire, Surface Mount Adhesives, Electronic Cleaners, and Stencils.
ʻO DeepMaterial Chip Underfill Adhesive series he mea hoʻokahi, nā mea hiki ke mālama i ka wela. ʻO nā mea i hoʻopaʻa ʻia no ka hoʻopiha piha ʻana o ka capillary a me ka hana hou. Hiki ke hāʻawi ʻia kēia mau mea epoxy ma nā kihi o ka BGA, CSP a i ʻole Flip Chip. E kahe ana kēia mea e hoʻopiha i ka hakahaka ma lalo o kēia mau ʻāpana.
E like me ka mea i loaʻa i ka capillary underfill hoʻokahi ʻāpana i hoʻolālā ʻia no ka pale ʻana i nā pūʻolo chip i hui ʻia ma nā papa kaapuni paʻi.
He kiʻekiʻe ke aniani hoʻololi wela [Tg] a haʻahaʻa coefficient hoʻonui wela [CTE] underfill. ʻO kēia mau hiʻohiʻona ka hopena i kahi hopena hilinaʻi kiʻekiʻe.
Nā Huahana Huahana
· Hāʻawi i ka uhi ʻāpana piha ke hāʻawi ʻia ma luna o ka substrate i hoʻomehana ʻia ma 70 – 100°C
· Kiʻekiʻe Tg a me Haʻahaʻa CTE waiwai hoʻomaikaʻi nui i ka hiki ke hele i kahi kūlana Thermal Cycling Test koʻikoʻi.
· Hana maikaʻi loa i ka hoʻāʻo ʻana i ka Thermal Cycling
· Halogen-noa a hoʻokō me ka RoHS Directive 2015/863/EU
Underfill No Ke Kūʻai Kūʻē Thermal Fatigue
Kū hoʻokahi nā hui solder SAC i nā hui BGA a me CSP e haʻalulu i nā noi kaʻa wela wela. ʻO ke kiʻekiʻe Tg a me ka haʻahaʻa CTE underfill [UF] kahi hopena hoʻoikaika. No ka mea ʻaʻole koi ka hana hou ʻana, ʻae kēia i ka mea hoʻopihapiha hoʻopihapiha kiʻekiʻe i ka hoʻokumu ʻana e hoʻomohala i kēlā mau ʻano.
DeepMaterial Chip Underfill Adhesive series he Tg kiʻekiʻe o 165°C a me CTE1/CTE2 haʻahaʻa o 31 ppm/105 ppm, ma ka hui ʻana a ua hoʻāʻo ʻia e hala i 5000 cycles -40 +125°C thermal cycling test. No ka maikaʻi o ke kahe ʻana, e hoʻomaʻamaʻa mua i nā substrate i ka wā e hoʻopuka ai.
Ke ʻimi nei nō hoʻi mākou i nā huahana adhesive ʻenehana DeepMaterial e hui pū me nā hoa pili honua, inā makemake ʻoe e lilo i ʻelele o DeepMaterial's:
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma ʻAmelika,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma ʻEulopa,
ʻO ka mea hoʻolako kāpili kāpili ʻoihana ma UK,
ʻO ka mea kūʻai aku i ka mea hoʻopili paʻa ʻoihana ma India,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma Australia,
ʻO ka mea kūʻai aku i ka mea hoʻopili kāpili ʻoihana ma Kanada,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma ʻApelika Hema,
ʻO ka mea hoʻolako kāpili kāpili ʻoihana ma Iapana,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma ʻEulopa,
ʻO ka mea hoʻolako kāpili kāpili ʻoihana ma Korea,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma Malaysia,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma Philippines,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma Vietnam,
ʻO ka mea kūʻai aku i nā mea hoʻopili paʻa ʻoihana ma Indonesia,
ʻO ka mea kūʻai aku i ka mea hoʻopili paʻa ʻoihana ma Rūsia,
ʻO ka mea kūʻai aku i ka mea hoʻolale kāpili ʻoihana ma Turkey,
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