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5. Epoxy-Based Chip Underfill A COB Encapsulation Materials

Epoxy-Based Chip Underfill A COB Encapsulation Materials

Hāʻawi ʻo DeepMaterial i nā kahe capillary hou ma lalo o ka hoʻopiha ʻana no ka chip flip, CSP a me nā mea hana BGA. DeepMaterial hou capillary kahe underfills he kiʻekiʻe fluidity, kiʻekiʻe-maʻemaʻe, hoʻokahi-component potting mea e hana like, void-free underfill papa e hoʻomaikaʻi i ka hilinaʻi a me ka mechanical waiwai o nā mea ma o ka hoopau ana i ke kaumaha i hanaia e solder mea. Hāʻawi ʻo DeepMaterial i nā ʻano hana no ka hoʻopiha wikiwiki ʻana i nā ʻāpana pitch maikaʻi loa, hiki ke hoʻōla wikiwiki, hana lōʻihi a me ke ola, a me ka hana hou. Mālama ka hana hou i nā kumukūʻai ma ka ʻae ʻana i ka wehe ʻana i ka underfill no ka hoʻohana hou ʻana i ka papa.

Pono ka hui ʻana o Flip chip e hoʻomaha hou i ke koʻikoʻi o ka wili wili no ka lōʻihi o ka ʻelemakule wela a me ke ola pōʻai. Pono ka hui CSP a i ʻole BGA i ka hoʻohana ʻana i kahi underfill e hoʻomaikaʻi ai i ka pono mechanical o ka hui i ka wā o ka hoʻāʻo ʻana, vibration a hāʻule paha.

Loaʻa i nā waihona hoʻopihapiha hoʻopihapiha kiʻekiʻe ka DeepMaterial i ka holo wikiwiki ʻana i nā pitch liʻiliʻi, me ka hiki ke loaʻa i nā mahana hoʻololi aniani kiʻekiʻe a me nā modulus kiʻekiʻe. Loaʻa kā mākou CSP underfills i nā pae hoʻopihapiha like ʻole, i koho ʻia no ka mahana hoʻololi aniani a me ka modulus no ka noi i manaʻo ʻia.

Hiki ke hoʻohana ʻia ka COB encapsulant no ka hoʻopaʻa ʻana i ka uea e hāʻawi i ka pale o ke kaiapuni a hoʻonui i ka ikaika mechanical. ʻO ka hoʻopaʻa paʻa ʻana o nā ʻāpana uea i hoʻopaʻa ʻia me ka encapsulation luna, cofferdam, a me ka hoʻopiha piha ʻana. Pono nā mea hoʻopili me ka hana hoʻoheheʻe maikaʻi, no ka mea, ʻo ko lākou hiki ke hoʻoheheʻe ʻia e hōʻoia i ka hoʻopili ʻia o nā uea, a ʻaʻole e kahe ka mea hoʻopili i waho o ka chip, a e hōʻoia i hiki ke hoʻohana ʻia no nā alakaʻi pitch maikaʻi loa.

DeepMaterial's COB encapsulating adhesives hiki ke thermally a UV ho'ōla DeepMaterial's COB encapsulation adhesive hiki ke wela a ho'ōla UV me ka hilinaʻi kiʻekiʻe a me ka haʻahaʻa thermal pehu coefficient, a me ke aniani kiʻekiʻe hoʻololi wela a me ka haʻahaʻa ion maʻiʻo. ʻO DeepMaterial's COB encapsulating adhesives e pale i nā alakaʻi a me nā plumbum, chrome a me nā wafer silika mai ke kaiapuni o waho, ka pōʻino mechanical a me ka corrosion.

Hoʻokumu ʻia nā mea hoʻopili hoʻopili DeepMaterial COB me ka epoxy hoʻōla wela, ka acrylic curing UV, a i ʻole nā ​​mea kemika silicone no ka hoʻokaʻawale uila maikaʻi. Hāʻawi nā DeepMaterial COB encapsulating adhesives maikaʻi i ke kūpaʻa wela kiʻekiʻe a me ke kūpaʻa haʻalulu wela, nā waiwai insulating uila ma kahi ākea ākea, a me ka haʻahaʻa haʻahaʻa, haʻahaʻa haʻahaʻa, a me ke kūpaʻa kemika ke hoʻōla ʻia.

ʻO Deepmaterial ka mea ʻoi aku ka maikaʻi o ka hoʻopili ʻana i ka wai no ka plastic a me ka mea hana aniani, hoʻolako i ka epoxy adhesive sealant glue non conductive no ka underfill pcb electronic component, semiconductor adhesives no ka hui uila, hoʻōla haʻahaʻa haʻahaʻa bga flip chip underfill pcb epoxy adhesive glue material a pēlā aku. ma

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