Harka A Amurka: Maganin Ciki na Abokin Abokin Hulɗa na Amurka
A matsayin babbar ƙasa ta fasaha, akwai kamfanoni da yawa na BGA, CSP ko Flip Chip na'urorin a cikin Amurka, don haka mannen da ba a cika ba yana cikin buƙatu sosai.
Ɗaya daga cikin abokan cinikinmu daga kamfanoni masu fasaha na Amurka, suna amfani da DeepMaterial underfill bayani don ƙarancin guntunsu, kuma yana aiki cikakke.
DeepMaterial yana ba da manyan kayan aiki don Sintering da Die Attach, Dutsen Surface, da aikace-aikacen sayar da Wave. Faɗin samfuran sun haɗa da Fasaha na Sinter na Azurfa, Manna Solder, Preforms na Solder, Ƙarfafawa da Edgebond, Alloys Soldering, Liquid Soldering Flux, Cored Wire, Surface Dutsen Adhesives, Masu Tsabtace Lantarki, da Stencils.
DeepMaterial Chip Underfill Adhesive jerin abubuwa ne guda ɗaya, kayan aikin zafi. An inganta kayan don cikawar capillary da sake aiki. Ana iya ba da waɗannan kayan tushen epoxy akan gefuna na na'urorin BGA, CSP ko Flip Chip. Wannan abu zai gudana daga baya don cika sararin da ke ƙarƙashin waɗannan abubuwan.
Kamar yana ƙunshe da ƙashin-ƙarfi mai kashi ɗaya da aka ƙera don kariyar fakitin guntu da aka haɗa akan allunan da'ira da aka buga.
Yana da babban zafin canjin gilashin [Tg] da ƙarancin haɓakar haɓakar thermal [CTE] ƙarƙashin cikawa. Waɗannan fasalulluka suna haifar da ingantaccen bayani mai dogaro.
Product Features
· Yana ba da cikakken ɗaukar hoto lokacin da aka ba da shi a kan abin da aka rigaya a 70 - 100 ° C
Babban Tg da ƙananan ƙimar CTE suna haɓaka ikon wuce yanayin gwajin hawan keke mai ƙarfi
· Kwarewar Gwajin Kekuna na thermal
Ba shi da halogen kuma ya bi umarnin RoHS 2015/863/EU
Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙashin Ƙarƙwara
Tsaya kai kaɗai SAC haɗin gwiwa na siyar a cikin BGA da majalisun CSP suna yin rauni a cikin ƙaƙƙarfan aikace-aikacen kera motoci. Babban Tg da ƙananan CTE underfill [UF] shine maganin ƙarfafawa. Kamar yadda sake yin aiki ba buƙatu ba ne, wannan yana ba da damar abun ciki mai girma a cikin tsari don haɓaka irin waɗannan halayen.
DeepMaterial Chip Underfill Adhesive jerin yana da babban Tg na 165°C da ƙananan CTE1/CTE2 na 31 ppm/105 ppm, akan haɗawa kuma an gwada shi don wucewa 5000 cycles -40 +125°C gwajin hawan keke na thermal. Don ingantacciyar ƙimar kwararar ruwa, sai a fara zafi da substrates yayin rarrabawa.
Muna kuma neman samfuran samfuran masana'antu na DeepMaterial haɗin gwiwar abokan hulɗa na duniya, idan kuna son zama wakili na DeepMaterial's:
Mai samar da manne na masana'antu a Amurka,
Masana'antu m manne maroki a Turai,
Mai samar da manne na masana'antu a Burtaniya,
Mai samar da manne na masana'antu a Indiya,
Mai samar da manne na masana'antu a Ostiraliya,
Mai samar da manne na masana'antu a Kanada,
Mai samar da manne na masana'antu a Afirka ta Kudu,
Mai samar da manne na masana'antu a Japan,
Masana'antu m manne maroki a Turai,
Mai samar da manne na masana'antu a Koriya,
Mai samar da manne na masana'antu a Malaysia,
Mai samar da manne na masana'antu a Philippines,
Mai samar da manne na masana'antu a Vietnam,
Mai samar da manne na masana'antu a Indonesia,
Masana'antu m manne maroki a Rasha,
Mai samar da manne na masana'antu a Turkiyya,
......
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