description
Ƙayyadaddun samfur
| Samfurin samfur |
Product Name |
Launi |
hankula
Dankowa (cps) |
Lokacin Magani |
amfani |
Bambanci |
| BA-6513 |
Epoxy underfill bonding m |
Rawaya mai ruwan hoda |
3000 ~ 6000 |
@ 100 ℃
30min
120 ℃ 15 min
150 ℃ 10 min |
Mai sake amfani da CSP (FBGA) ko filler BGA |
Epoxy resin mne mai kashi ɗaya ne mai sake amfani da resin CSP (FBGA) ko BGA. Yana saurin warkewa da zarar an zafi. An tsara shi don samar da kariya mai kyau don hana gazawar saboda damuwa na inji. Ƙananan danko yana ba da damar cike giɓi ƙarƙashin CSP ko BGA. |
| BA-6517 |
Epoxy kasa filler |
Black |
2000 ~ 4500 |
@ 120℃ 5minti 100℃ 10min |
CSP (FBGA) ko BGA cike |
Kashi ɗaya, resin epoxy na thermosetting shine mai sake amfani da CSP (FBGA) ko filler BGA da aka yi amfani da shi don kare haɗin gwiwar solder daga damuwa na inji a cikin kayan lantarki na hannu. |
| BA-6593 |
Epoxy underfill bonding m |
Black |
3500 ~ 7000 |
@ 150℃ 5minti 165℃ 3min |
Marufi Girman Girman Chip Flow |
Saurin warkewa, guduro mai ruwa mai gudana da sauri, wanda aka ƙera don marufi mai girman girman guntu. An tsara shi don saurin aiwatarwa azaman mahimmin batu a cikin samarwa. Tsarin rheological ya ba shi damar shiga tazarar 25μm, rage yawan damuwa, inganta aikin hawan keke, kuma yana da kyakkyawan juriya na sinadarai. |
| BA-6808 |
Epoxy underfill m |
Black |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) ko BGA kasa cika |
Classic underfill m tare da ƙarancin danko don yawancin aikace-aikacen da ba a cika ba. |
| BA-6810 |
Epoxy underfill m |
Black |
394 |
@130℃ 8 min |
Mai sake amfani da CSP (FBGA) ko BGA kasa
filler |
Epoxy primer da za a sake amfani da shi an tsara shi don aikace-aikacen CSP da BGA. Yana warkar da sauri a matsakaicin yanayin zafi don rage damuwa akan sauran abubuwan. Da zarar an warke, kayan yana da kyawawan kaddarorin injina don kare haɗin gwiwar solder yayin hawan keken thermal. |
| BA-6820 |
Epoxy underfill m |
Black |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
Mai sake amfani da CSP (FBGA) ko BGA kasa
filler |
Ƙarƙashin mai sake amfani da shi an tsara shi musamman don aikace-aikacen CSP, WLCSP da BGA. An tsara shi don warkar da sauri a matsakaicin yanayin zafi don rage damuwa akan sauran abubuwan. Kayan yana da babban zafin canjin gilashin gilashin da kuma ƙayyadaddun ƙayyadaddun ƙayyadaddun ƙayyadaddun ƙayyadaddun ƙayyadaddun kayan aiki a lokacin hawan hawan zafi. |
Product Features
| Reusable |
Magani cikin sauri a matsakaicin yanayin zafi |
| Mafi girman zafin canjin gilashin da ƙarfin karaya |
Matsakaicin ƙarancin danko don yawancin aikace-aikacen da ba a cika ba |
Abũbuwan samfur
CSP ne mai sake amfani da shi (FBGA) ko filler BGA da ake amfani da shi don kare mahaɗin solder daga damuwa na inji a cikin na'urorin lantarki na hannu. Yana saurin warkewa da zarar an zafi. An tsara shi don samar da kariya mai kyau daga gazawar saboda damuwa na inji. Ƙananan danko yana ba da damar cike giɓi a ƙarƙashin CSP ko BGA.
