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Tushen Chip Ƙarƙashin Ciki da Kayan Rufewar COB

DeepMaterial yana ba da sabbin magudanar ruwa don cika guntu, CSP da na'urorin BGA. DeepMaterial sabon magudanar ruwa da ke ƙarƙashin ruwa mai ƙarfi ne, tsafta mai ƙarfi, kayan tukunyar sassa guda ɗaya waɗanda ke samar da uniform, yadudduka marasa cikawa marasa ƙarfi waɗanda ke haɓaka dogaro da kaddarorin injiniyoyi ta hanyar kawar da damuwa da kayan solder ke haifarwa. DeepMaterial yana ba da ƙididdiga don cike da sauri na sassa masu kyau sosai, ƙarfin warkarwa da sauri, dogon aiki da tsawon rayuwa, gami da sake aiki. Sake yin aiki yana adana kuɗi ta hanyar barin cire abin da ke ƙasa don sake amfani da hukumar.

Juyawa guntu taron yana buƙatar sauƙaƙa damuwa na kabu na walda kuma don tsawan yanayin zafi da rayuwar zagayowar. Taro na CSP ko BGA yana buƙatar amfani da abin cikawa don inganta ingantacciyar injunan taron yayin jujjuyawar, girgiza ko faɗuwar gwaji.

DeepMaterial's flip-chip underfills suna da babban abun ciki mai cikawa yayin kiyaye saurin gudu a cikin ƙananan filaye, tare da ikon samun babban yanayin canjin gilashin da maɗaukaki masu girma. Abubuwan mu na CSP suna samuwa a cikin matakan filaye daban-daban, waɗanda aka zaɓa don zafin canjin gilashin da ma'auni don aikace-aikacen da aka yi niyya.

Ana iya amfani da COB encapsulant don haɗin waya don samar da kariyar muhalli da haɓaka ƙarfin injina. Hatimin kariya na kwakwalwan kwamfuta masu haɗa waya sun haɗa da ɗaukar hoto na sama, cofferdam, da ciko tata. Ana buƙatar mannewa tare da aikin gyare-gyare mai kyau, saboda ƙarfin kwararar su dole ne ya tabbatar da cewa wayoyi sun lulluɓe, kuma mannen ba zai fita daga guntu ba, kuma tabbatar da cewa za'a iya amfani da shi don kyakkyawan sakamako mai kyau.

DeepMaterial's COB encapsulating adhesives iya zama thermally ko UV warke DeepMaterial's COB encapsulation m za a iya warke zafi ko UV-warke tare da high aminci da low thermal kumburi coefficient, kazalika da high gilashin canza yanayin zafi da low ion abun ciki. DeepMaterial's COB encapsulating adhesives suna kare gubar da plumbum, chrome da silicon wafers daga yanayin waje, lalacewar injina da lalata.

DeepMaterial COB encapsulating adhesives an ƙirƙira su tare da epoxy mai zafi, UV-curing acrylic, ko silicone chemistries don ingantaccen rufin lantarki. DeepMaterial COB encapsulating adhesives yana ba da kyakkyawar kwanciyar hankali mai zafi da juriya na zafi mai zafi, kaddarorin rufe wutar lantarki akan kewayon zafin jiki, da ƙarancin raguwa, ƙarancin damuwa, da juriya na sinadarai lokacin warkewa.

Deepmaterial ne mafi kyau saman hana ruwa tsarin m manne ga roba zuwa karfe da gilashin manufacturer, wadata ba conductive epoxy m sealant manne ga underfill pcb lantarki aka gyara, semiconductor adhesives ga lantarki taro, low zazzabi magani bga jefa guntu underfill pcb epoxy tsari m manne abu da sauransu. kan

DeepMaterial Epoxy Resin Base Chip Bottom Cike da Teburin Zaɓin Kayan Kayan Cob
Ƙananan Zazzabi Maganin Epoxy Adhesive Zaɓin Samfurin

Samfurin Kasuwanci Product name Samfurin aikace-aikacen yau da kullun
Ƙananan zafin jiki curing m BA-6108

Ƙananan mannen zafin jiki, aikace-aikace na yau da kullun sun haɗa da katin ƙwaƙwalwar ajiya, CCD ko taron CMOS. Wannan samfurin ya dace da maganin ƙananan zafin jiki kuma yana iya samun kyakkyawar mannewa ga abubuwa daban-daban a cikin ɗan gajeren lokaci. Aikace-aikace na yau da kullun sun haɗa da katunan ƙwaƙwalwa, abubuwan haɗin CCD/CMOS. Ya dace musamman ga lokuttan da abubuwan da ke da zafi suna buƙatar warkewa a ƙananan zafin jiki.
BA-6109

Kashi ɗaya ne na maganin zafi na resin epoxy. Wannan samfurin ya dace da maganin ƙananan zafin jiki kuma yana da kyakkyawar mannewa ga abubuwa iri-iri a cikin ɗan gajeren lokaci. Aikace-aikace na yau da kullun sun haɗa da katin ƙwaƙwalwar ajiya, taron CCD/CMOS. Ya dace musamman don aikace-aikace inda ake buƙatar ƙananan zafin jiki don abubuwan da ke da zafi.
BA-6120

Classic low-zazzabi curing m, amfani da LCD backlight taron taron.
BA-6180

Saurin warkewa a ƙananan zafin jiki, ana amfani da shi don haɗa abubuwan haɗin CCD ko CMOS da injin VCM. Wannan samfurin an ƙera shi musamman don aikace-aikacen zafin zafi waɗanda ke buƙatar warkar da ƙarancin zafin jiki. Yana iya ba wa abokan ciniki da sauri aikace-aikacen da ake buƙata, kamar haɗa ruwan tabarau na watsa haske zuwa LEDs, da haɗa kayan aikin gano hoto (ciki har da na'urorin kyamara). Wannan abu fari ne don samar da mafi girman tunani.

Encapsulation Zaɓin Samfurin Epoxy

Layin samfuri Samfurin Kasuwanci Product Name launi Halin danko (cps) Lokacin gyarawa na farko / cikakken gyarawa Hanyar magancewa TG/°C Tauri /D Store/°C/M
Epoxy bisa Encapsulation Adhesive BA-6216 Black 58000-62000 150 ° C 20min Maganin zafi 126 86 2-8/6M
BA-6261 Black 32500-50000 140°C 3H Maganin zafi 125 * 2-8/6M
BA-6258 Black 50000 120 ° C 12min Maganin zafi 140 90 -40/6M
BA-6286 Black 62500 120°C 30min1 150°C 15min Maganin zafi 137 90 2-8/6M

Ƙarƙashin Zaɓin Samfurin Epoxy

Samfurin Kasuwanci Product name Samfurin aikace-aikacen yau da kullun
Ƙarƙashin cikawa BA-6307 Kashi ɗaya ne, resin epoxy mai zafi. CSP ne mai sake amfani da shi (FBGA) ko filler BGA da ake amfani da shi don kare mahaɗin solder daga damuwa na inji a cikin na'urorin lantarki na hannu.
BA-6303 Epoxy resin sulke mai-bangare ɗaya ne mai cike da guduro wanda za'a iya sake amfani dashi a cikin CSP (FBGA) ko BGA. Yana saurin warkewa da zarar an zafi. An tsara shi don samar da kariya mai kyau don hana gazawar saboda damuwa na inji. Ƙananan danko yana ba da damar cike giɓi ƙarƙashin CSP ko BGA.
BA-6309 Yana da saurin warkarwa, guduro mai ruwa mai sauri mai gudana wanda aka ƙera don fakitin girman girman girman guntu, shine don haɓaka saurin aiwatarwa a cikin samarwa da ƙirƙira ƙirar rheological, bar shi shiga 25μm sharewa, rage haɓakar damuwa, haɓaka aikin hawan keke, tare da m sinadaran juriya.
Saukewa: DM-6308 Classic underfill, matsananci-ƙananan danko wanda ya dace da yawancin aikace-aikacen da ba a cika ba.
BA-6310 Epoxy primer da za a sake amfani da shi an tsara shi don aikace-aikacen CSP da BGA. Ana iya warkewa da sauri a matsakaicin yanayin zafi don rage matsa lamba akan wasu sassa. Bayan warkewa, kayan yana da kyawawan kaddarorin injina kuma yana iya kare haɗin gwiwar solder yayin hawan keken thermal.
BA-6320 Ƙarƙashin mai sake amfani da shi an tsara shi musamman don aikace-aikacen CSP, WLCSP da BGA. Tsarinsa shine don warkar da sauri a matsakaicin yanayin zafi don rage damuwa akan wasu sassa. Kayan yana da mafi girman zafin canjin gilashin da kuma mafi girman raunin karaya, kuma yana iya ba da kariya mai kyau ga haɗin gwiwar solder yayin hawan hawan zafi.

DeepMaterial Epoxy Based Chip Underfill and COB Packaging Material Data Sheet
Tabbataccen Bayanin Samfuran Ƙarƙashin Zazzabi Maganin Epoxy Adhesive

Layin samfuri Samfurin Kasuwanci Product Name launi Halin danko (cps) Lokacin gyarawa na farko / cikakken gyarawa Hanyar magancewa TG/°C Tauri /D Store/°C/M
Epoxy bisa Low zazzabi curing encapsulant BA-6108 Black 7000-27000 80°C 20minti 60°C 60min Maganin zafi 45 88 -20/6M
BA-6109 Black 12000-46000 80°C 5-10min Maganin zafi 35 88A -20/6M
BA-6120 Black 2500 80°C 5-10min Maganin zafi 26 79 -20/6M
BA-6180 White 8700 80 ° C 2min Maganin zafi 54 80 -40/6M

Tabbataccen Bayanan Samfuran Epoxy Adhesive

Layin samfuri Samfurin Kasuwanci Product Name launi Halin danko (cps) Lokacin gyarawa na farko / cikakken gyarawa Hanyar magancewa TG/°C Tauri /D Store/°C/M
Epoxy bisa Encapsulation Adhesive BA-6216 Black 58000-62000 150 ° C 20min Maganin zafi 126 86 2-8/6M
BA-6261 Black 32500-50000 140°C 3H Maganin zafi 125 * 2-8/6M
BA-6258 Black 50000 120 ° C 12min Maganin zafi 140 90 -40/6M
BA-6286 Black 62500 120°C 30min1 150°C 15min Maganin zafi 137 90 2-8/6M

Ƙarƙashin Takardar Bayanan Samfuran Epoxy

Layin samfuri Samfurin Kasuwanci Product Name launi Halin danko (cps) Lokacin gyarawa na farko / cikakken gyarawa Hanyar magancewa TG/°C Tauri /D Store/°C/M
Epoxy bisa Ƙarƙashin cikawa BA-6307 Black 2000-4500 120°C 5minti 100°C 10min Maganin zafi 85 88 2-8/6M
BA-6303 Ruwan ruwan rawaya mai banƙyama 3000-6000 100°C 30minti 120°C 15minti 150°C 10min Maganin zafi 69 86 2-8/6M
BA-6309 Baki ruwa 3500-7000 165°C 3minti 150°C 5min Maganin zafi 110 88 2-8/6M
BA-6308 Baki ruwa 360 130°C 8minti 150°C 5min Maganin zafi 113 * -20/6M
BA-6310 Baki ruwa 394 130 ° C 8min Maganin zafi 102 * -20/6M
BA-6320 Baki ruwa 340 130°C 10minti 150°C 5minti 160°C 3min Maganin zafi 134 * -20/6M