Kunshin BGA Ƙarƙashin Ƙarƙashin Ƙarfafawa
Babban Ruwa
Babban Tsarkin
kalubale
Kayan lantarki na sararin samaniya da kewayawa, motocin motoci, motoci, hasken wuta na waje, hasken rana da kamfanonin soja tare da buƙatun aminci, na'urorin tsararrun ƙwallon ƙafa (BGA/CSP/WLP/POP) da na'urori na musamman akan allunan kewayawa duk suna fuskantar microelectronics. Yanayin miniaturization, da PCBs na bakin ciki tare da kauri na ƙasa da 1.0mm ko sassauƙan madaidaicin madaidaicin madaidaicin madaidaicin, kayan haɗin gwal tsakanin na'urori da kayan aiki sun zama masu rauni a ƙarƙashin damuwa na inji da na thermal.
Solutions
Don marufi na BGA, DeepMaterial yana ba da ingantaccen tsarin aiwatarwa - sabbin hanyoyin kwararar capillary. Ana rarraba filler kuma ana amfani da shi a gefen na'urar da aka haɗa, kuma ana amfani da "tasirin capillary" na ruwa don sa manne ya shiga ya cika kasan guntu, sa'an nan kuma mai tsanani don haɗa filler tare da guntu substrate, solder gidajen abinci da PCB substrate.
Fa'idodin tsarin cika DeepMaterial
1. Babban ruwa mai zurfi, tsabta mai tsabta, kashi ɗaya, cikawa da sauri da kuma saurin warkarwa na musamman madaidaicin sassa;
2. Yana iya samar da wani uniform da mara-free kasa cika Layer, wanda zai iya kawar da danniya lalacewa ta hanyar waldi abu, inganta aminci da inji Properties na aka gyara, da kuma samar da mai kyau kariya ga kayayyakin daga fadowa, karkatarwa, vibration, danshi. , da dai sauransu.
3. Za a iya gyara tsarin, kuma za a iya sake amfani da allon kewayawa, wanda ke adana farashi sosai.
Deepmaterial ne low zafin jiki magani bga jefa guntu underfill pcb epoxy tsari m manne abu manufacturer da kuma zafin jiki resistant underfill shafi kayan kaya, wadata daya bangaren epoxy underfill mahadi, Epoxy underfill encapsulant, underfill encapsulation kayan don jefa guntu a pcb lantarki kewaye hukumar, Epoxy- tushen guntu underfill da cob encapsulation kayan da sauransu.
