Product Specifications & Parameters
| Product
Name |
Product
Name 2 |
Color |
Typical
Viscosity
(cps) |
Mixing Ratio |
Initial Fixation Time /
Full Fixation |
TG/°C |
Hardness/D |
Temperature
Resistance/°C |
Stored |
Typical Product
Applications |
| DM-6060F |
UV moisture dual curing adhesive |
Translucent Light Blue |
18000 |
Single
component |
<10s@100mW/cm 2Humidity 8 days |
75 |
76 |
-55°C-120°C |
2-8°C |
Non-flow, UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (Black). Mainly used for local protection of WLCSP and BGA on circuit boards. |
| DM-6061F |
UV moisture dual curing adhesive |
Translucent Light Blue |
23000 |
Single
component |
<10s@100mW/cm 2Humidity 7 days |
56 |
75 |
-55°C-120°C |
2-8°C |
Non-flow, UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (Black). Mainly used for local protection of WLCSP and BGA on circuit boards. |
| DM-6290 |
UV moisture
dual curing
adhesive |
Transparent amber |
100~350 |
Hardness:
60~90 |
<20s@100mW/cm2Moisture curing for 5 days |
-45 |
|
-53°C – 204°C |
2-8°C |
It is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C. |
| DM-6040 |
UV moisture
dual curing
adhesive |
Transparent
liquid |
500 |
Single
component |
<30s@300mW/cm 2Moisture 2-3 days |
* |
80 |
-40°C – 135°C |
20-30°C |
It is a single component, VOC free conformable coating. The product is specially formulated to gel and fix quickly when exposed to UV light and then cure when exposed to atmospheric moisture, thus ensuring optimum performance even in shaded areas. Thin layers of the coating can be set almost instantly to a depth of 7mils. The product has a strong Black fluorescence and excellent adhesion to a wide range of metal, ceramic and glass filled epoxy surfaces, meeting the needs of the most demanding environmentally friendly applications. |
Product Features
| Fast Curing |
High toughness, excellent thermal cycling properties |
Suitable for stress sensitive materials |
| Resistant to prolonged moisture or water immersion |
High viscosity, high thixotropy |
Strong adhesive properties |
Product Advantages
UV/moisture curing encapsulation for topical circuit board protection. This product is fluorescent under UV light (black). It is mainly used for local protection of WLCSP and BGA on circuit boards. The product is specially formulated for fast gelation and fixing when exposed to UV light and then curing when exposed to atmospheric moisture, thus ensuring optimum performance.
